Summit

Micron Demonstration of Memory in Automotive: Great Things Come in Small Packages

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Bill Stafford, Marketing Solutions Director at Micron, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Stafford demonstrates his company’s collaboration with Infineon on the TRAVEO T2G CYT4EN graphics microcontroller teamed with Micron LPDDR4 and e.MMC, which give automotive clusters media rich content, high performance, and […]

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Micron Demonstration of Memory in Artificial Intelligence: Leading from Performance to Safety

Memory, Micron Technology, Summit 2025, Videos /

Bill Stafford, Marketing Solutions Director at Micron, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Stafford demonstrates his company’s key products in the artificial intelligence (AI) and computer vision markets. Micron manufactures one of the broadest portfolios of memory and storage solutions in the world.

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Teledyne FLIR Demonstration of an Advanced Thermal Imaging Camera Enabling Automotive Safety Improvements

Automotive, FLIR Systems, Lattice Semiconductor, Object Identification, Object Tracking, Sensors and Cameras, Summit 2025, Teledyne Digital Imaging, Videos /

Ethan Franz, Senior Software Engineer at Teledyne FLIR, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2025 Embedded Vision Summit. Specifically, Franz demonstrates a state-of-the-art thermal imaging camera for automotive safety applications, designed using Lattice FPGAs. This next-generation camera, also incorporating Teledyne FLIR’s advanced sensing technology,

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Lattice Semiconductor Demonstration of NVIDIA Holoscan-compatible Cameras from Valued Partners

e-con Systems, Lattice Semiconductor, NVIDIA, Processors, Sensors and Cameras, Summit 2025, Videos /

Jacob Mercado, Applications Engineer at Lattice Semiconductor, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Mercado demonstrates Holoscan camera solutions from ecosystem partner vendors Leopard Imaging and e-con Systems, designed with Lattice FPGAs for use with NVIDIA Orin AGX or IGX platforms. Holoscan is enabled

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Lattice Semiconductor Demonstration of Random Bin Picking Based on Structured-Light 3D Scanning

Lattice Semiconductor, Object Identification, Object Tracking, Processors, Robotics, Summit 2025, Videos /

Mark Hoopes, Senior Director of Industrial and Automotive at Lattice Semiconductor, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Hoopes demonstrates how Lattice FPGAs increase performance, reduce latency and jitter, and reduce overall power for a random bin picking robot. The Lattice FPGA offloads the

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Cadence Demonstration of Waveguide 4D Radar Central Computing on a Tensilica Vision DSP-based Platform

Automotive, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Summit 2025, Videos /

Sriram Kalluri, Product Marketing Manager for Cadence Tensilica DSPs, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Kalluri demonstrates the use of the Tensilica Vision 130 (P6) DSP for advanced 4D radar computing for perception sensing used in ADAS applications. The Vision 130 DSP is

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Cadence Demonstration of a SWIN Shifted Window Vision Transform on a Tensilica Vision DSP-based Platform

Algorithms, Cadence, Processors, Software, Summit 2025, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs, presents the company’s latest edge AI and vision technologies at the 2025 Embedded Vision Summit. Specifically, Borkar demonstrates the use of the Tensilica Vision 230 (Q7) DSP for advanced AI and transformer applications. The Vision 230 DSP is a highly efficient, configurable, and extensible processor

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Aizip Demonstration of Its Personal Offline AI Assistant for Biking on a Cadence Tensilica HiFi DSP Platform

Cadence, Processors, Summit 2025, Videos /

Nathan Francis, Head of Business Development at Aizip, demonstrates the company’s latest edge AI and vision technologies and products in Cadence’s booth at the 2025 Embedded Vision Summit. Specifically, Francis demonstrates the capabilities of his company’s small language model capable of running on a bike computer. You can’t assume internet connectivity when biking in the

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DeGirum Demonstration of Its PySDK Running on BrainChip Hardware for Real-time Edge AI

Algorithms, BrainChip, DeGirum, Processors, Software, Summit 2025, Tools, Videos /

Stephan Sokolov, Software Engineer at DeGirum, demonstrates the company’s latest edge AI and vision technologies and products in BrainChip’s booth at the 2025 Embedded Vision Summit. Specifically, Sokolov demonstrates the power of real-time AI inference at the edge, running DeGirum’s PySDK application directly on BrainChip hardware. This demo showcases low-latency, high-efficiency performance as a script

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BrainChip Demonstration of LLM Inference On an FPGA at the Edge using the TENNs Framework

Algorithms, BrainChip, Processors, Software, Summit 2025, Tools, Videos /

Kurt Manninen, Senior Solutions Architect at BrainChip, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Van Manninen demonstrates his company’s large language models (LLMs) running on an FPGA edge device, powered by BrainChip’s proprietary TENNs (Temporal Event-Based Neural Networks) framework. BrainChip enables real-time generative AI

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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