MAX78000 AI microcontroller and Xailient’s Detectum neural network detects and localizes faces in video and images at just 12ms per inference SAN JOSE, Calif., July 27, 2021 /PRNewswire/ — Maxim Integrated Products, Inc. (NASDAQ: MXIM) and Xailient Inc., a company focused on artificial intelligence (AI) for the edge, today announced that Maxim Integrated’s MAX78000 ultra-low […]
SoC provides personal computing devices with powerful performance and advanced 5G connectivity, multimedia and gaming technologies HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to
Franklin Templeton and Temasek lead Blaize $71m Series D funding aimed at acceleration of AI Edge Computing and Automotive/EV product roadmap El DORADO HILLS, CA — July 27, 2021 — Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced the close of a $71m Series D round of funding. Franklin Templeton,
Ian Childers, Head of Technology for Functional Coatings—Object Recognition at BASF, presents the “Object Detection and Dataset Labeling Using Colors of Manufactured Objects” tutorial at the May 2021 Embedded Vision Summit. This talk introduces a new method for object detection for consumer goods and other applications based on measuring an object’s illumination invariant fluorescent chroma.
Geneva, July 26, 2021 – STMicroelectronics has expanded the variety of machine-learning techniques available to users of the STM32Cube.AI development environment, giving extra flexibility to solve classification, clustering, and novelty-detection challenges as efficiently as possible. In addition to enabling development of neural networks for edge inference on STM32* microcontrollers (MCUs), the latest STM32Cube.AI release (version
Parag Beeraka, Head of the Smart Camera and Vision Business at Arm, presents the “Software-Defined Cameras for Edge Computing of the Future,” tutorial at the May 2021 Embedded Vision Summit. Computer-vision-enabled cameras have demonstrated the potential to bring compelling functionality to numerous applications. But to realize the full potential and assist with the growth of
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Sheffield, UK 23rd July 2021 Mindtech Global, developer of the world’s leading end-to-end synthetic data creation platform for training AI vision systems – today announced closing a $3.25 million funding round. The round was led by NPIF – Mercia Equity Finance, which is managed by Mercia and is part of the Northern Powerhouse Investment Fund
Felix Baum, Director of Product Management at Qualcomm, presents the “Hate It Or Love It, Your Neural Network Software Stack Defines Application Performance and Reach” tutorial at the May 2021 Embedded Vision Summit. Qualcomm has invested extensively in its state-of-the-art Qualcomm Neural Network and software stack, including the Qualcomm Neural Processing SDK and the AI
Teledyne expands its camera portfolio with new high-resolution Lt Series USB3 cameras for use in diverse machine vision applications Ottawa, CANADA, July 22, 2021 – Teledyne is pleased to announce the release of its new Lt Series USB3 high resolution cameras. With robust enclosures and fully locking USB3 connectors, these new cameras are built for
Megha Daga, Director of Product Management for AI Enablement at Qualcomm, presents the “Deploying Edge AI Solutions at Scale for the Internet of Things” tutorial at the May 2021 Embedded Vision Summit. There are many large-scale opportunities for edge AI solutions across a broad range of Internet of Things applications. But deploying the kinds of
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