TECHNOLOGIES

MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones

The Dimensity 820 delivers, ultra-fast 5G speeds, impressive power-efficiency and seamless connectivity TAIPEI, Taiwan, May 18, 2020 /PRNewswire/ — MediaTek today announced the Dimensity 820 system-on-chip (SoC) which is optimized for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek’s latest multimedia, AI and imaging innovations. “Our Dimensity 1000 […]

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NVIDIA’s New Ampere Data Center GPU in Full Production

New NVIDIA A100 GPU Boosts AI Training and Inference up to 20x; NVIDIA’s First Elastic, Multi-Instance GPU Unifies Data Analytics, Training and Inference; Adopted by World’s Top Cloud Providers and Server Makers SANTA CLARA, Calif., May 14, 2020 (GLOBE NEWSWIRE) — NVIDIA today announced that the first GPU based on the NVIDIA® Ampere architecture, the

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NVIDIA EGX Edge AI Platform Brings Real-Time AI to Manufacturing, Retail, Telco, Healthcare and Other Industries

Ecosystem Expands with EGX A100 and EGX Jetson Xavier NX  Supported by AI-Optimized, Cloud-Native, Secure Software to Power New Wave of 5G and Robotics Applications SANTA CLARA, Calif., May 14, 2020 (GLOBE NEWSWIRE) — NVIDIA today announced two powerful products for its EGX Edge AI platform — the EGX A100 for larger commercial off-the-shelf servers

NVIDIA EGX Edge AI Platform Brings Real-Time AI to Manufacturing, Retail, Telco, Healthcare and Other Industries Read More +

NVIDIA Releases Jetson Xavier NX Developer Kit with Cloud-Native Support

Cloud-Native Support Comes to Entire Jetson Platform Lineup, Making It Easier to Build, Deploy and Manage AI at the Edge Thursday, May 14, 2020—GTC 2020—NVIDIA today announced availability of the NVIDIA® Jetson Xavier™ NX developer kit with cloud-native support — and the extension of this support to the entire NVIDIA Jetson™ edge computing lineup for

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Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the “Edge”

Foxconn’s Enhanced “BOXiedge” Edge Computing Solution Offers Market-leading Energy-efficiency for Standalone AI Inference Nodes [Taipei, Taiwan, Yokohama, Japan, and Tel Aviv, Israel. May 12, 2020] – Foxconn, a global leader in smart manufacturing, is joining Socionext, a major provider of advanced SoC solutions for video and imaging systems, and leading artificial intelligence (AI) chipmaker Hailo

Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the “Edge” Read More +

Qualcomm Addresses Growing Demand for 5G by Announcing New Snapdragon 768G Mobile Platform

Snapdragon 768G is Designed to Deliver Immersive Gaming Experiences and Truly Global 5G May 10, 2020 – San Diego – Qualcomm Technologies, Inc. announced the Qualcomm® Snapdragon™ 768G Mobile Platform, a follow-on to the Snapdragon 765G. Snapdragon 768G is designed to bring next-level performance that enables smart, immersive gaming experiences with the integration of truly

Qualcomm Addresses Growing Demand for 5G by Announcing New Snapdragon 768G Mobile Platform Read More +

ADAS, a Rebirth For the Automotive Industry

This market research report was originally published at Yole Développement’s website, and is extracted from “Sensing and Computing for ADAS Vehicle 2020 Report.” It is reprinted here with the permission of Yole Développement. Outlines: Better sensor performance to enable automated driving. A sensor market worth US$22.4 billion in 2025, led by radars. Greater ADAS functionality

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MediaTek Unveils 5G-Integrated Dimensity 1000+ Chip for Smartphones

Dimensity 1000+ packs 5G connectivity and gaming, video and power-saving technology enhancements for flagship-grade user experiences HSINCHU, Taiwan – May 7, 2020 – MediaTek today announced enhancements to its Dimensity 5G chipset family with the Dimensity 1000+, an enhanced 5G-integrated chip with a number of leading technologies and upgrades for gaming, video and power-efficiency. Dimensity 1000+ is based

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With the Apple iPad LiDAR Chip, Sony Landed On the Moon Without Us Knowing

This market research report was originally published at Yole Développement’s website. It is reprinted here with the permission of Yole Développement. Yole Développement has recently published its reports, “Status of the CIS industry 2019” and “3D Imaging & Sensing 2020” and maintains a continuous analysis of the chain of events in this prolific domain. System

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OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras With Industry’s Best Low-Light Performance, Lowest Power and Smallest Size

In Combination With Onscreen Display Overlays, Curve Distortion Correction, 120dB HDR and Low Noise, Single-Chip Image Sensor and Signal Processor Enables Best Image Quality and Smallest Modules SANTA CLARA, Calif. – May 5, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced its 1.3MP OX01E10 SoC, providing automotive designers

OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras With Industry’s Best Low-Light Performance, Lowest Power and Smallest Size Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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