This blog post was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. The story of EV adoption contains a warning that semiconductor companies would be wise to take seriously. When the automotive industry made the leap from combustion engines to electric drivetrains, it discovered that a transformative technology is not enough on its own. The […]
By integrating a CPU, GPU, and NPU, Intel Core Ultra Series 3 delivers edge AI power across global use cases—from hospitality and manufacturing to healthcare and education. At 2 a.m., an emergency room nurse orders a latte at a quiet hospital coffee stand. There is no human behind the counter. Instead, a sleek robotic arm
Intel Core Ultra Series 3: The New Standard for Edge AI Robotics Compute Read More +
Pietro Antonio Cicalese, Senior Technical Marketing Engineer at Ambarella, presents “Edge-First Coding Agents: Trustworthy Agentic Development for Real Devices” at the May 2026 Embedded Vision Summit. Coding agents are usually built as cloud-first abstractions. But for developing trustworthy, production-ready edge systems, we’ve found that coding agents should be designed from… “Edge-First Coding Agents: Trustworthy Agentic
This blog post was originally published at Axelera AI’s website. It is reprinted here with the permission of Axelera AI. At a Glance The Achievement: Real-time AI person-of-interest (POI) identification and threat detection across multiple 8K streams at 2.5 PetaOPS The Stack: Voyager SDK + Axelera Metis + Intel Xeon The Future: 3x performance leap with
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. A Step-by-Step Guide with Arduino UNO Q, Rubik Pi 3, and PCs with Snapdragon Introduction Welcome, developers and tech enthusiasts! This blog post will guide you through running OpenClaw and Hermes Agent on Qualcomm Technologies’ platforms,
How Ubicept Photon Fusion enhances conventional sensors for automotive use This blog post was originally published at Ubicept’s website. It is reprinted here with the permission of Ubicept. We’re back with another demo! Previously, we explored how Ubicept Photon Fusion (UPF) improves high-frame-rate CMOS imaging and how those improvements can translate into better downstream
Improving CMOS Performance at Night Read More +
On June 16, 2026 in London, and on June 18, 2026 in Eindhoven, the AMD “Embedded Computing Summit Global Technical Tour” comes to Europe. From the event page: Where Embedded Innocation Meets Technical Depth The Embedded Computing Summit (ECS) Global Technical Tour is the premier in-person technical event series from AMD, bringing together engineers, architects,
AMD’s Embedded Computing Summit Comes to London and Eindhoven Read More +
Company will collaborate with Amazon and Plug and Play Tech Center to evaluate edge AI deployment pathways that can help reduce device energy consumption and carbon impact Sunnyvale, California — May 20, 2026 — ModelCat today announced that it has been selected to participate in the 2026 Amazon Devices Climate Tech Accelerator, a program developed
ModelCat Selected for 2026 Amazon Devices Climate Tech Accelerator Read More +
On May 21, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “What It Takes to Build Your First Real-World AI Tool” From the event page: Most AI talks focus on what’s possible. This one shows how to actually use AI in product development, even if you’re just getting started. In
Upcoming Webinar on Building Your First Real-World AI Tool Read More +
The research collaboration will focus on building geometry-aware perception modules on the AMD ROCm™ open software stack AMD Silo AI and University of Bologna through its Department of Computer Science and Engineering (DISI) are starting a research collaboration to bring explicit 3D geometry into the Vision Language Action (VLA) and world-model pipeline for robotics and
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