TECHNOLOGIES

Beyond the Bench: The Hard Truth About Robotics Automation in Logistics with Pickle Robotics

This video was originally published by Peridio. It is reprinted here with the permission of Peridio. In this episode of Beyond the Bench from Peridio, Bill Brock sits down with Ari Eisenstein, co-founder and CTO of Pickle Robotics. They discuss the evolution of robotics and AI, focusing on Pickle’s innovative approach to logistics automation. Ari […]

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Vedya Labs Demonstration of Stable Diffusion Deployment on Cadence Tensilica DSPs

Suresh Pasupuleti, Managing Director of Vedya Labs, presents the company’s work in bringing Stable Diffusion-based image generation to DSP-centric embedded platforms. The demonstration showcases a nearly 500-million-parameter model running on the Axera AX650N SoC, with the text encoder, U-Net, and VAE stages optimized for dual Cadence Tensilica Vision DSPs. Using INT8 quantization and a combination

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Bolom Sound Classification on Cadence Tensilica HiFi 5

Mauricio Greene of Bolom demonstrates real-time Sound Classification running on the Cadence Tensilica HiFi 5 DSP at the Embedded Vision Summit. Bolom Acoustic Intelligence edge models identify hundreds of distinct sound events and soundscape scenes – such as sirens, alarms, horns, traffic and more, fully on-device and without relying on the cloud. The Tensilica HiFi

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When the Edge Is 400 Kilometers Up: AI, Space, and the Limits of Cloud Computing

This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. The orbital community has reached the same conclusions that the broader edge AI industry has been articulating for years: If moving the data is more expensive than moving the result, the processing belongs where the data was produced. The

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Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes

Key Takeaways: World’s first independent APV HW IP ‘WAVE-P’ confirmed for flagship devices of a major North American client Following the Samsung-Qualcomm alliance, Chips&Media and North American Big Tech solidify APV as the industry standard Targeting the professional video market with 8K 120fps high-quality recording and editing optimization Seoul, South Korea July 2, 2026 –

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Pulling Back the Curtain on a Smarter, More Connected AI Future

At the 2026 Embedded Vision Summit, Boston AI CEO Peter Winston explores the latest advances shaping the future of AI. From intelligent agents to next-generation edge applications, he highlights how AI is evolving beyond task automation to become a more capable and collaborative partner within organizations. The video concludes with a look at emerging trends

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Insight Mirror: The mirror that sees you. The mirror that knows you. The mirror that talks back.

At the 2026 Embedded Vision Summit, Dan Daogaru shows an interactive, AI-aware smart mirror designed to redefine customer engagement. The Insight Mirror is not just a reflection; it is a fully integrated, intelligent AI companion capable of dynamic, voice-first conversations, open-vocabulary visual recognition, and presence-aware engagement. Built around a single high-performance C++20 application and fully

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HTEC White Paper Outlines the Convergence of Edge AI, Semiconductor Software, and Autonomous Systems

This content was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. Physical AI at the Edge: Building the Full Stack for Real-World Deployment For years, AI progress was measured by model benchmark scores. The real test is different: does it work when deployed in a vehicle, a factory, a

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ILLIUM AI Demonstrates AI Machine Vision with LIDAR Precision

At the 2026 Embedded Vision Summit, Luis Dussan and Adrian Kaehler show their system fusing real-time camera and LIDAR data at the edge to deliver precise spatial awareness without heavy cloud dependency or large data backhaul. Using an intuitive user interface, operators can visualize environments, interact with live data, and leverage an integrated AI agent

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Powering the Next Generation of NVIDIA AI Factories with MGX

This blog post was originally published at Analog Devices’ website. It is reprinted here with the permission of Analog Devices. As AI workloads accelerate, the shift toward AI factories are driving unprecedented rack-level power density. At the center of this transition is NVIDIA MGX™, an open modular architecture that enables faster system design, improved scalability and rapid

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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