TECHNOLOGIES

ILLIUM AI Demonstrates AI Machine Vision with LIDAR Precision

At the 2026 Embedded Vision Summit, Luis Dussan and Adrian Kaehler show their system fusing real-time camera and LIDAR data at the edge to deliver precise spatial awareness without heavy cloud dependency or large data backhaul. Using an intuitive user interface, operators can visualize environments, interact with live data, and leverage an integrated AI agent […]

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Powering the Next Generation of NVIDIA AI Factories with MGX

This blog post was originally published at Analog Devices’ website. It is reprinted here with the permission of Analog Devices. As AI workloads accelerate, the shift toward AI factories are driving unprecedented rack-level power density. At the center of this transition is NVIDIA MGX™, an open modular architecture that enables faster system design, improved scalability and rapid

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Optimizing Warehousing Efficiency: Arducam’s Custom Barcode Scanning Solution for Smart Forklifts

This blog post was originally published at Arducam’s website. It is reprinted here with the permission of Arducam. In the rapid evolution of smart warehousing, the forklift has transformed from a simple lifting machine into a sophisticated mobile data hub. For an Automated Identification Solutions provider, the challenge isn’t just about “taking a picture” of a barcode; it’s

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Free Webinar Outlines Development of Edge-first Coding Agents

On August 25, 2026 at 9 am PT (noon ET), Pietro Antonio Cicalese, Senior Technical Marketing Engineer, at Ambarella, will present the free hour webinar “Edge-First Coding Agents: Trustworthy Agentic Development for Real Devices,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page: Coding agents are usually built

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“From Chips to Platforms: Scaling Edge AI with SoMs, Production Linux and Secure Life-Cycle Ops,” a Presentation from Peridio

Amir Sherman, Head of Global Business Development at Peridio presents “From Chips to Platforms: Scaling Edge AI with SoMs, Production Linux and Secure Life-Cycle Ops” at the May 2026 Embedded Vision Summit. Edge AI has moved beyond choosing a single chip or platform. Teams now face a harder question: how… “From Chips to Platforms: Scaling

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Successful Machine Learning Projects Shape the Entire Lifecycle

This blog post was originally published at Helbling’s website. It is reprinted here with the permission of Helbling. The full value of Machine Learning (ML) and Artificial Intelligence (AI) only emerges when the entire lifecycle of an application is taken into account. Yet many companies struggle to establish a sustainable and scalable operating model early enough

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“Building a Local Voice Agent on a Raspberry Pi,” a Presentation from Moonshine AI

Pete Warden, CEO at Moonshine AI presents “Building a Local Voice Agent on a Raspberry Pi” at the May 2026 Embedded Vision Summit. In this talk, Warden explains everything you need to know to build your own voice agent running entirely on a stock Raspberry Pi 5, with no internet… “Building a Local Voice Agent

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Why Most AI Performance Metrics Break Down in Production

This blog post was originally published at ModelCat’s website. It is reprinted here with the permission of ModelCat. Artificial intelligence systems often appear highly effective during development. Models achieve strong benchmark scores, validation metrics improve over time, and performance looks predictable within controlled environments. But once those same systems are deployed into real-world conditions, results frequently

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MemryX Expands Cascade Platform, Bringing Power-Efficient Edge AI to Servers

Introducing an expanded portfolio of modules that gives developers a single, scalable architecture to power everything from low-power devices to enterprise edge infrastructure ANN ARBOR, Mich., June 22, 2026 /PRNewswire/ — As AI moves from cloud environments into factories, transportation systems, robotics, and intelligent infrastructure, developers face growing challenges related to power consumption, memory bandwidth, deployment complexity,

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STMicroelectronics Unveils New Compact Direct Time-of-Flight 3D LiDAR Module

Key Takeaways VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. Designed to meet the evolving needs of customers and partners across diverse industries, including robotics,

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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