Quadric today announced that TIER IV, Inc., of Japan has signed a license to use the Chimera AI processor SDK to evaluate and optimize future iterations of Autoware, open-source software for autonomous driving pioneered by TIER IV. Burlingame, CA, January 14, 2026 – Quadric today announced that TIER IV, Inc., of Japan has signed a […]
Ettlingen, Germany, January 12, 2026 — Vision Components will present its new VC MIPI IMX454 Camera Module at SPIE Photonics West, 20-22 January in San Francisco, California. The MIPI Camera features Sony’s new multispectral image sensor IMX454 and enables to capture up to 41 wavelength in one shot. VC will also showcase its lineup of
This blog post was originally published at Basler’s website. It is reprinted here with the permission of Basler. Deep learning vision systems are often already a central component of industrial image processing. They enable precise error detection, intelligent quality control, and automated decisions – wherever conventional image processing methods reach their limits. We show how a
Deep Learning Vision Systems for Industrial Image Processing Read More +
On March 3, 2026 at 9 am PT (noon ET), The Ocean Cleanup’s Robin de Vries, ADIS (Autonomous Debris Imaging System) Lead, will present the free hour webinar “Cleaning the Oceans with Edge AI: The Ocean Cleanup’s Smart Camera Transformation,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration
Free Webinar Examines Autonomous Imaging for Environmental Cleanup Read More +
A funny thing is happening in the edge AI world: some of the most important product decisions you’ll make this year won’t be about TOPS, sensor resolution, or which transformer variant to deploy. They’ll be about memory—how much you can get, how much it costs, and whether you can ship the exact part you designed
When DRAM Becomes the Bottleneck (Again): What the 2026 Memory Squeeze Means for Edge AI Read More +
On January 14, 2026, at 7:00 am EST (10:00 am EST) Alliance Member company Synopsys will deliver a webinar “Advances in ATPG: From Power and Timing Awareness to Intelligent Pattern Search with AI” From the event page: As System-on-Chip (SoC) designs become increasingly complex, meeting test quality and cost goals requires advances in automatic test
Upcoming Webinar on Advances in Automatic Test Pattern Generation Read More +
Key Takeaways: Snapdragon® X2 Plus transforms every click and every moment for modern professionals, aspiring creators and everyday users, delivering speed, multi-day battery life and built-in AI features. Representing a bold leap forward, the newest entrant in the Snapdragon X Series platform broadens access to the advanced performance and premium experiences consumers and businesses expect, expanding the growing Windows 11 Copilot+ PC community. Snapdragon X2 Plus harnesses the power of the 3rd Gen Qualcomm Oryon™ CPU and an 80 TOPS NPU, with select devices from
This article was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Intersections remain among the most accident-prone areas in traffic networks, with violations like red-light running leading to severe crashes. Red light cameras automate detection by linking vehicle movement with signal state, capturing clear evidence for enforcement. They
What is a Red Light Camera? A Quick Guide to Vision-Based Traffic Violation Detection Read More +
ANN ARBOR, Mich., Dec. 26, 2025 (PRNewswire) — MemryX Inc., a company delivering production AI inference acceleration, today announced its strategic roadmap for the MX4. The next-generation accelerator is engineered to scale the company’s “at-memory” dataflow architecture from edge deployments into the data center, leveraging 3D hybrid-bonded memory to eliminate the industry’s most pressing bottleneck: the “memory wall.” MemryX is
Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform SAN JOSE, Calif., January 6, 2026, — Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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