Processors

AMD Announces World’s Fastest HPC Accelerator for Scientific Research

AMD, News, Processors /

AMD Instinct™ MI100 accelerators revolutionize high-performance computing (HPC) and AI with industry-leading compute performance First GPU accelerator with new AMD CDNA architecture engineered for the exascale era SANTA CLARA, Calif. – 11/16/2020 – AMD (NASDAQ: AMD) today announced the new AMD Instinct™ MI100 accelerator – the world’s fastest HPC GPU and the first x86 server GPU […]

AMD Announces World’s Fastest HPC Accelerator for Scientific Research Read More +

AI Startup Deep Vision Powers AI Innovation at the Edge

Deep Vision, News, Processors /

LOS ALTOS, Calif., November 16, 2020 – Deep Vision exits stealth mode and launches its ARA-1 inference processor to enable the creation of new world AI vision applications at the edge. The processors provide the optimal balance of compute, memory, energy efficiency (2W Typical), and ultra-low latency in a compact form factor, making it the

AI Startup Deep Vision Powers AI Innovation at the Edge Read More +

“Machine-Learning-Based Perception on a Tiny, Low-Power FPGA,” a Presentation from Lattice Semiconductor

Lattice Semiconductor, Processors, Software, Summit 2020, Tools, Videos /

Hoon Choi, Fellow at Lattice Semiconductor, presents the “Machine-Learning-Based Perception on a Tiny, Low-Power FPGA” tutorial at the September 2020 Embedded Vision Summit. In this tutorial, Choi presents a set of machine-learning-based perception solutions that his company implemented on a tiny (5.4 mm2 package), low-power FPGA. These solutions include hand gesture classification, human detection and

“Machine-Learning-Based Perception on a Tiny, Low-Power FPGA,” a Presentation from Lattice Semiconductor Read More +

“Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases,” a Presentation from Cadence

Cadence, Processors, Summit 2020, Videos /

Pulin Desai, Vision and AI Product Marketing Group Director at Cadence, presents the “Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases” tutorial at the September 2020 Embedded Vision Summit. In this talk, Desai presents the full range of Cadence Tensilica edge AI processing solutions. These silicon IP-based solutions serve markets from

“Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases,” a Presentation from Cadence Read More +

Intel Executing toward XPU Vision with oneAPI and Intel Server GPU

Intel, News, Processors, Software, Tools /

What’s New: Intel today announced key milestones in its multiyear journey to deliver a mix of architectures with a unified software experience. The company announced the gold release of Intel® oneAPI toolkits coming in December, and new capabilities in its software stack as part of the Intel’s combined hardware and software design approach. Intel also debuted

Intel Executing toward XPU Vision with oneAPI and Intel Server GPU Read More +

Imagination Launches Multi-core IMG Series4 NNA – The Ultimate AI Accelerator Delivering Industry-disruptive Performance for ADAS and Autonomous Driving

Imagination Technologies, News, Processors /

Offering the most responsive and power efficient neural network acceleration for next-generation automotive use cases London, England – 12th November 2020 – Imagination Technologies announces IMG Series4, its next-generation neural network accelerator (NNA) for advanced driver-assistance systems (ADAS) and autonomous driving. Series4 targets automotive industry-leading disruptors as well as Tier 1s, original equipment manufacturer (OEMS)

Imagination Launches Multi-core IMG Series4 NNA – The Ultimate AI Accelerator Delivering Industry-disruptive Performance for ADAS and Autonomous Driving Read More +

“Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision,” a Presentation from Intel

Intel, Processors, Software, Summit 2020, Tools, Videos /

Tara K. Thimmanaik, Solutions Architect at Intel, presents the “Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision” tutorial at the September 2020 Embedded Vision Summit. As demand for smarter and more efficient manufacturing is growing, IoT technologies⁠—including sensors, edge devices, gateways, servers and the cloud⁠—are being used throughout the factory to compute deep learning analytics

“Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision,” a Presentation from Intel Read More +

CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC

Automotive, Ceva, News, Processors, Renesas /

Rockville, MD., – November 11, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC). “We are honored that Renesas, a world leading automotive semiconductor supplier, has selected our leading-edge DSP

CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC Read More +

“Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study,” a Presentation from Intel

Intel, Processors, Summit 2020, Tools, Videos /

Manas Pathak, Global AI Lead for Oil and Gas at Intel, presents the “Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study” tutorial at the September 2020 Embedded Vision Summit. The use of deep learning for automatic seismic data interpretation is gaining the attention of many researchers across the oil and gas industry. The

“Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study,” a Presentation from Intel Read More +

MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones

MediaTek, News, Processors /

Dimensity 700 caters to growing consumer demand for 5G devices HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives

MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Pages

Topics

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top