Processors

From Brain to Binary: Can Neuro-inspired Research Make CPUs the Future of AI Inference?

This article was originally published at Tryolabs’ website. It is reprinted here with the permission of Tryolabs. In the ever-evolving landscape of AI, the demand for powerful Large Language Models (LLMs) has surged. This has led to an unrelenting thirst for GPUs and a shortage that causes headaches for many organizations. But what if there […]

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$1 Trillion by 2030: The Semiconductor Devices Industry is On Track

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Entering a new growth cycle, the surge in the semiconductor industry is driven by the rise of generative AI processors and HBM[1] OUTLINE Market evolution: with a $672 billion market in 2024[2],

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Autonomous Cars are Leveling Up: Exploring Vehicle Autonomy

When the Society of Automotive Engineers released their definitions of varying levels of automation from level 0 to level 5, it became easier to define and distinguish between the many capabilities and advancements of autonomous vehicles. Level 0 describes an older model of vehicle with no automated features, while level 5 describes a future ideal

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Introducing Qualcomm Custom-built AI Models, Now Available on Qualcomm AI Hub

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. We’re thrilled to announce that five custom-built computer vision (CV) models are now available on Qualcomm AI Hub! Qualcomm Technologies’ custom-built models were developed by the Qualcomm R&D team, optimized for our platforms and designed with end-user applications

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NXP Agrees to Acquire Edge AI Pioneer Kinara to Redefine the Intelligent Edge

Enhances NXP’s leading processing portfolio with cutting edge NPUs and AI software, driving intelligent system solutions across the industrial and automotive edge markets. Delivers high-performance neural network processing with advanced generative AI to create transformative edge use cases. Establishes a scalable platform for AI-powered edge systems, combining NXP’s broad portfolio of processing, connectivity, security, and

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New AI SDKs and Tools Released for NVIDIA Blackwell GeForce RTX 50 Series GPUs

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA recently announced a new generation of PC GPUs—the GeForce RTX 50 Series—alongside new AI-powered SDKs and tools for developers. Powered by the NVIDIA Blackwell architecture, fifth-generation Tensor Cores and fourth-generation RT Cores, the GeForce RTX 50

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Vision Components Introduces MIPI Camera Modules with Integrated Image Pre-processing

Ettlingen, February 6, 2025.  Vision Components introduces VC MIPI Cameras with onboard image pre-processing at embedded world (March 11-13, 2025, Nuremberg). The tiny camera modules can detect and extract barcodes, objects, edges and laser lines as well as perform blob analyses and color conversions. VC will also show a new version of the FPGA accelerator

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Qualcomm AI Research Makes Diverse Datasets Available to Advance Machine Learning Research

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Qualcomm AI Research has published a variety of datasets for research use. These datasets can be used to train models in the kinds of applications most common to mobile computing, including: advanced driver assistance systems (ADAS), extended reality

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Make Your Existing NVIDIA Jetson Orin Devices Faster with Super Mode

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. The NVIDIA Jetson Orin Nano Super Developer Kit, with its compact size and high-performance computing capabilities, is redefining generative AI for small edge devices. NVIDIA has dropped an exciting new update to their existing Jetson

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Advanced Packaging: How AI is Revolutionizing the Game

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The growth of the AI server market is driving the adoption of 2.5D/3D packaging technologies. 2.5D & 3D interconnect types for the high-end performance packaging market: Revenue is expected to grow with

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