On December 17, 2025, at 9:00 am PST (12:00 pm EST), Alliance Member companies e-con Systems, Lattice Semiconductor, and NVIDIA will deliver a joint webinar “Real-Time AI Sensor Fusion with e-con Systems’ Holoscan Camera Solutions using Lattice FPGA for NVIDIA Jetson Thor Platform.” From the event page: Join an exclusive webinar hosted by e-con Systems®, […]
Upcoming Webinar Explores Real-time AI Sensor Fusion Read More +
This blog post was originally published at Efinix’s website. It is reprinted here with the permission of Efinix. In the rapidly evolving world of microelectronics, there is a relentless push to reduce size and power consumption while increasing compute capability and throughput. Smart edge devices, the internet of things and now Edge AI have only
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This blog post was originally published at NXP Semiconductors’ website. It is reprinted here with the permission of NXP Semiconductors. Smarter Perception at the Edge Dusty construction sites. Fog-covered fields. Crowded warehouses. Heavy rain. Uneven terrain. What does it take for an autonomous machine to perceive and navigate challenging real-world environments like these – reliably, in
Enabling Autonomous Machines: Advancing 3D Sensor Fusion With Au-Zone Read More +
This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading startup providing agentic AI solutions for chip verification, and Cadence have announced an agreement for ChipStack to join the agentic AI team at Cadence. Founded by technologists with deep expertise in both AI and semiconductor
Cadence Welcomes ChipStack Read More +
This blog post was originally published at Woodside Capital’s website. It is reprinted here with the permission of Woodside Capital. Palo Alto – November 3, 2025 – Woodside Capital Partners (WCP) is pleased to release our Digital Advertising Quarterly Sector Update for Q3 2025, authored by senior bankers Alain Bismuth and George Jones. Introduction: Intelligence on the Edge Edge
AI at the Edge: Low Power, High Stakes Read More +
Server enables access to trusted product information across AI platforms to simplify workflows, accelerate design and boost productivity CHANDLER, Ariz., November 6, 2025 — Further demonstrating its commitment to developing AI-enabled solutions for embedded engineers, Microchip Technology (Nasdaq: MCHP) has announced the launch of its Model Context Protocol (MCP) Server. An AI interface, the MCP Server connects directly with
This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. Discover how SME2 brings flexible, high-performance AI denoising to mobile photography for sharper, cleaner low-light images. Every smartphone photographer has seen it. Images that look sharp in daylight but fall apart in dim lighting. This happens because
Laguna Hills, Calif. — November 4th, 2025 — BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, today announced the launch of its AKD1500, a neuromorphic Edge AI accelerator co-processor chip, at Embedded World North America. Designed to deliver exceptional performance with minimal power consumption, the AKD1500 achieves 800 giga operations
This blog post was originally published at Synaptics’ website. It is reprinted here with the permission of Synaptics. Openness across software, standards, and silicon is critical for ensuring interoperability, flexibility, and the growth of AI at the edge AI continues to migrate towards the edge and is no longer confined to the datacenter. Edge AI brings
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EINDHOVEN, The Netherlands, Oct. 28, 2025 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ: NXPI) has announced the completion of its acquisitions of Aviva Links, and Kinara. On October 24, 2025, NXP closed the previously announced acquisition of Aviva Links for $243 million in cash before closing adjustments. Aviva Links is a provider of Automotive SerDes Alliance (ASA)
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