Processors

Microcontrollers Enter a New Growth Cycle as the Market Targets US$34 Billion in 2030

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases its annual Status of the Microcontroller Industry report and expands its quarterly Microcontroller Market Monitor, delivering long-range strategic insights and detailed market tracking   Key Takeaways: The global MCU market […]

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Nota AI Signs Technology Collaboration Agreement with Samsung Electronics for Exynos AI Optimization “Driving the Popularization of On-Device Generative AI”

Nota AI’s optimization technology integrated into Samsung Electronics’ Exynos AI Studio, enhancing efficiency in on-device AI model development   Seoul, South Korea Nov.26, 2025 — Nota AI, a company specializing in AI model compression and optimization, announced today that it has signed a collaboration agreement with Samsung Electronics’ System LSI Business to provide its AI

Nota AI Signs Technology Collaboration Agreement with Samsung Electronics for Exynos AI Optimization “Driving the Popularization of On-Device Generative AI” Read More +

WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS

Nov 26, 2025 Seoul, South Korea — Chips&Media is announcing that the next-generation customized NPU, WAVE-N v2, is ready for release, delivering higher computational power along with improved area and power efficiency. WAVE-N v2 is also designed to support a wider range of applications, such as object detection and segmentation, in addition to visual quality enhancement

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Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs

This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for AI-based designs, including Ultra Accelerator Link (UALink), Ultra Ethernet (UEC), LPDDR6, UCIe 3.0, AMBA CHI-H, Embedded USB v2 (eUSB2), and UniPro 3.0. These new VIP will

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How Semiconductor Equipment Makers Will Drive the Next $1 Trillion Wave

This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI, mobility and cloud are the growth engines: They’re pushing chips toward a $1 trillion market by 2030 and forcing fabs to invest in sub-3nm nodes and advanced packaging Chips are bigger and more complex: Larger dies and

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VC MIPI Cameras & ADLINK i.MX 8M Plus: Full Driver Support

Ettlingen, November 18, 2025 — For a medical imaging project, ADLINK wanted to integrate VC MIPI Cameras with its I-Pi SMARC IMX8M Plus Development Kit. Vision Components adapted the standard driver for the NXP i.MX 8M Plus processor platform to the ADLINK board, including full ISP support, for features such as color tuning etc. As

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STMicroelectronics Introduces New Battery-Saving Wireless Microcontrollers Optimized for Remote Controls

Nov 18, 2025  Geneva, Switzerland STM32WL3R MCUs add flexible features to low-power radio for superior user experiences in consumer electronics and home automation Integrated in new RF remotes from building-automation leader Somfy STMicroelectronics has introduced the STM32WL3R, a wireless microcontroller (MCU) optimized for remote control units in consumer products and home automation. Evolved from the proven STM32WL3

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Trends in Embedded AI: Designing Hardware for Machine Learning on the Edge

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The world is increasingly becoming connected, intelligent, and autonomous. At the core of this transformation is Artificial Intelligence (AI), which is swiftly transitioning from the cloud to the edge, nearer to where data is generated and actions are

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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