Processors

Deep Learning Vision Systems for Industrial Image Processing

Algorithms & Models, Articles, Basler, Processors, Sensors and Cameras, Software, Tools /

This blog post was originally published at Basler’s website. It is reprinted here with the permission of Basler. Deep learning vision systems are often already a central component of industrial image processing. They enable precise error detection, intelligent quality control, and automated decisions – wherever conventional image processing methods reach their limits. We show how a […]

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Upcoming Webinar on Advances in Automatic Test Pattern Generation

News, Processors, Synopsys /

On January 14, 2026, at 7:00 am EST (10:00 am EST) Alliance Member company Synopsys will deliver a webinar “Advances in ATPG: From Power and Timing Awareness to Intelligent Pattern Search with AI” From the event page: As System-on-Chip (SoC) designs become increasingly complex, meeting test quality and cost goals requires advances in automatic test

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Empowering Professionals and Aspiring Creators, Snapdragon X2 Plus Delivers Multi-day Battery Life, Fast Performance and Advanced AI

Consumer, News, Processors, Qualcomm /

Key Takeaways: Snapdragon® X2 Plus transforms every click and every moment for modern professionals, aspiring creators and everyday users, delivering speed, multi-day battery life and built-in AI features. Representing a bold leap forward, the newest entrant in the Snapdragon X Series platform broadens access to the advanced performance and premium experiences consumers and businesses expect, expanding the growing Windows 11 Copilot+ PC community. Snapdragon X2 Plus harnesses the power of the 3rd Gen Qualcomm Oryon™ CPU and an 80 TOPS NPU, with select devices from

Empowering Professionals and Aspiring Creators, Snapdragon X2 Plus Delivers Multi-day Battery Life, Fast Performance and Advanced AI Read More +

Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

Cadence, News, Processors /

Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform   SAN JOSE, Calif., January 6, 2026, — Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical

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Intel Core Ultra Series 3 Debut as First Built on Intel 18A

Intel, News, Processors /

Intel ushers in the next generation of AI PCs with exceptional performance, graphics and battery life; available this month   Key Takeaways: First platform built on Intel 18A: At CES 2026, Intel launched the Intel® Core™ Ultra Series 3 processors, the first compute platform built on Intel 18A – the most advanced semiconductor process ever developed and

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AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI

AMD, News, Processors /

Key Takeaways: New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems Launching today,

AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI Read More +

Qualcomm Drives the Future of Mobility with Strong Snapdragon Digital Chassis Momentum and Agentic AI for Major Global Automakers Worldwide

Automotive, News, Processors, Qualcomm /

Key Takeaways: Qualcomm extends its automotive leadership with new collaborations, including Google, to power next‑gen software‑defined vehicles and agentic AI‑driven personalization. Snapdragon Ride and Cockpit Elite Platforms, and Snapdragon Ride Flex SoC, see rapid adoption, adding new design-wins and delivering the industry’s first commercialized mixed‑criticality platform that integrates cockpit, advanced driver‑assistance systems, and end‑to‑end AI. Decade of in-vehicle infotainment

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SiMa.ai Announces First Integrated Capability with Synopsys to Accelerate Automotive Physical AI Development

Automotive, News, Processors, SiMa.ai, Software, Synopsys, Tools /

San Jose, California – January 6, 2026 – SiMa.ai today announced the first integrated capability resulting from its strategic collaboration with Synopsys. The joint solution provides a blueprint to accelerate architecture exploration and early virtual software development for AI- ready, next-generation automotive SoCs that support applications such as Advanced Driver Assistance Systems (ADAS) and In-vehicle-Infotainment

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D3 Embedded Showcases Camera/Radar Fusion, ADAS Cameras, Driver Monitoring, and LWIR solutions at CES

Automotive, D3 Embedded, HTEC Group, News, Processors, Security, Sensors and Cameras, STMicroelectronics, Texas Instruments /

Las Vegas, NV, January 7, 2026 — D3 Embedded is showcasing a suite of technology solutions in partnership with fellow Edge AI and Vision Alliance Members HTEC, STMicroelectronics and Texas Instruments at CES 2026. Solutions include driver and in-cabin monitoring, ADAS, surveillance, targeting and human tracking – and will be viewable at different locations within

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Ambarella Launches Powerful Edge AI 8K Vision SoC With Industry-Leading AI and Multi-Sensor Perception Performance

Ambarella, News, Processors /

New 4nm CV7 System-on-Chip Provides Ideal Combination of Simultaneous Multi-Stream Video and Advanced On-Device Edge AI Processing With Very Low Power Consumption SANTA CLARA, Calif., Jan. 05, 2026 (GLOBE NEWSWIRE) — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced during CES the CV7 edge AI vision system-on-chip (SoC), which is optimized for a wide range

Ambarella Launches Powerful Edge AI 8K Vision SoC With Industry-Leading AI and Multi-Sensor Perception Performance Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
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