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Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability
Architected to power AI workloads, Micron’s latest automotive solution, built with G9 NAND, equips the industry to create safer, smarter

STMicroelectronics introduces new battery-saving wireless microcontrollers optimized for remote controls
Nov 18, 2025 Geneva, Switzerland STM32WL3R MCUs add flexible features to low-power radio for superior user experiences in consumer electronics and

The Image Sensor Size and Pixel Size of a Camera is Critical to Image Quality
This blog post was originally published at Commonlands’ website. It is reprinted here with the permission of Commonlands. The sensor

Au-Zone Technologies Expands EdgeFirst Studio Access
Proven MLOps Platform for Spatial Perception at the Edge Now Available CALGARY, AB – November 19, 2025 – Au-Zone

Trends in Embedded AI: Designing Hardware for Machine Learning on the Edge
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The world is

Reimagining Embedded Audio: MIPI SWI3S Is a Game Changer
This blog post was originally published at MIPI Alliance’s website. It is reprinted here with the permission of MIPI Alliance. As

Semiconductor industry 2025: worldwide dynamics and China’s strategic rise unveiled
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the

Upcoming Webinar on AI Vision for Occupational Safety and Health
On November 25, 2025, at 9:30 am PST (12:30 pm EST), and on November 26, 2025 at 11:00 am CET

10 Tips for First-Pass Silicon Success in AI Chip Development
This blog post was originally published at Synopsys’s website. It is reprinted here with the permission of Synopsys. As the
News

Sony’s Large Format Sensors: A Look at Global Shutter and Rolling Shutter
On December 4, 2025, at 10:00 am CET (4:00 am EST) Alliance Member companies Sony and RESTAR FRAMOS will deliver a 30-minute technical session “Sony’s Large Format Sensors: A Look at Global Shutter and Rolling Shutter” From the event page: Join experts from Sony, FRAMOS, and RESTAR FRAMOS for a focused, 30-minute technical session examining

The New Metis PCIe with 4 Quad-Core AIPUs is Here
Big update from the Metis world: the epic new 4-core PCIe card is now available to order over on the store. Huge performance shift that opens up seriously scalable edge AI. Key specs: 856 TOPS (INT8) Choice of 16GB and 64GB DRAM ~12,800 FPS on ResNet-50 Runs dozens of streams or parallel models per board

Public road demonstration tests of the latest autonomous driving EV bus, including nighttime operation, have begun at a hot spring resort
Following on from last year, Macnica, Inc., Fukuyama Consultant Co., Ltd., and KCS Corporation will collaborate with Ureshino City, Saga Prefecture, to conduct a public road demonstration experiment of autonomous driving vehicle (autonomous driving level 2) through co-creation with the local community, and will verify the degree to which autonomous driving will contribute to the
Market Analysis

AI at the Edge: Low Power, High Stakes
This blog post was originally published at Woodside Capital’s website. It is reprinted here with the permission of Woodside Capital. Palo Alto – November 3, 2025 – Woodside Capital Partners (WCP) is pleased to release our Digital Advertising Quarterly Sector Update for Q3 2025, authored by senior bankers Alain Bismuth and George Jones. Introduction: Intelligence on the Edge Edge

PiezoMEMS: A Market Poised to Outpace MEMS Growth by 2030
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group unveils two new reports, PiezoMEMS Technologies 2025 and PiezoMEMS Comparison 2025, providing market ranking, technology insights and cost analyses. Key Takeaways The piezoMEMS market will reach nearly US$5.7 billion by 2030,

Greater China MEMS Industry On the Rise: Consumer Leads the Way
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its latest analysis, Yole Group examines how the Greater Chinese MEMS ecosystem is expanding across the consumer, automotive, industrial, medical, defense, and telecom markets, with continued growth driven by strong local
Blog

Reimagining Embedded Audio: MIPI SWI3S Is a Game Changer
This blog post was originally published at MIPI Alliance’s website. It is reprinted here with the permission of MIPI Alliance. As embedded audio systems continue to evolve across consumer electronics, automotive and industrial applications, so does the demand to deliver advanced features—such as far-field voice recognition, spatial audio and “always-on” AI-driven audio processing—within increasingly compact, power-sensitive devices

10 Tips for First-Pass Silicon Success in AI Chip Development
This blog post was originally published at Synopsys’s website. It is reprinted here with the permission of Synopsys. As the saying goes, with great risk comes great reward. Because of the profound complexity and intricate dependencies between hardware and software, developing a custom AI chip is one of the most capital-intensive and high-risk endeavors in

The Benefits of System-in-Package
This blog post was originally published at Efinix’s website. It is reprinted here with the permission of Efinix. In the rapidly evolving world of microelectronics, there is a relentless push to reduce size and power consumption while increasing compute capability and throughput. Smart edge devices, the internet of things and now Edge AI have only
