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AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of
FRAMOS Unveils Three Specialized Camera Modules for UAV and Drone Applications
Munich, Bavaria, Germany – October 21st, 2025 – FRAMOS, the world’s leading vision expert, unveils three new camera modules specially
Don’t Give Your Business Data to AI Companies
This blog post was originally published at Plainsight Technologies’ website. It is reprinted here with the permission of Plainsight Technologies.
ST Introduces New Image Sensors for Industrial Automation, Security and Retail Applications
Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible
NanoEdge AI Studio v5, the First AutoML Tool with Synthetic Data Generation
This blog post was originally published at STMicroelectronics’ website. It is reprinted here with the permission of STMicroelectronics. NanoEdge AI
Andes Showcases Expanding RISC-V Ecosystem and Next-generation “Cuzco” High-performance CPU at RISC-V Summit North America 2025
San Jose, CA October 17, 2025 –– Andes Technology, a Founding Premier Member of RISC-V International and a leading supplier of
Task-specific AI vs Generic LLMs: Why Precision and Reliability Matter
This blog post was originally published at Rapidflare’s website. It is reprinted here with the permission of Rapidflare. Task-specific AI
Two-Phase Liquid Cooling: The Future of High-end GPUs
As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal
Plainsight Appoints Venky Renganathan as Chief Technology Officer
Enterprise Technology Leader Brings Experience Leading Transformational Change as Computer Vision AI Innovator Moves to Next Phase of Platform Innovation
News
FRAMOS Unveils Three Specialized Camera Modules for UAV and Drone Applications
Munich, Bavaria, Germany – October 21st, 2025 – FRAMOS, the world’s leading vision expert, unveils three new camera modules specially developed for use in drones and unmanned aerial vehicles (UAVs). These modules feature state-of-the-art image sensors from SONY, which offer exceptional precision, high speed, and energy efficiency, creating the ideal conditions for demanding vision systems.
ST Introduces New Image Sensors for Industrial Automation, Security and Retail Applications
Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible product instead of two chips New device family is ideal for high-speed automated manufacturing processes and object tracking New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel
Andes Showcases Expanding RISC-V Ecosystem and Next-generation “Cuzco” High-performance CPU at RISC-V Summit North America 2025
San Jose, CA October 17, 2025 –– Andes Technology, a Founding Premier Member of RISC-V International and a leading supplier of high-efficiency, high-performance RISC-V processor IPs, will highlight its expanding ecosystem and preview its next-generation out-of-order CPU—code-named “Cuzco”—at RISC-V Summit North America 2025, taking place October 22–23 in Santa Clara, California. Building on its success in
Market Analysis
Generative AI Reshapes the Global Processor Market, Driving Unprecedented Growth
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Semiconductor Tour on 10/8 at 11:00 AM, in parallel to Semicon West- Invited speakers: NVIDIA, Intel, Lam Research. Register today! KEY TAKEAWAYS The processor market is projected to reach $554 billion by
Edge AI Hangs on Power: Can Chipmakers Meet Up?
Power semiconductors will define how well and how quickly the global economy adopts Edge AI and benefit from its promises. That’s why the race is stiffening among chipmakers to offer the most innovative power management components and systems. Who is winning? What’s at stake: The stakes for power semiconductor makers in the Edge AI market
Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging
The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology
Blog
NVIDIA Contributes to Open Frameworks for Next-generation Robotics Development
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. At the ROSCon robotics conference, NVIDIA announced contributions to the ROS 2 robotics framework and the Open Source Robotics Alliance’s new Physical AI Special Interest Group, as well as the latest release of NVIDIA Isaac ROS. This
Unleash Real-time LiDAR Intelligence with BrainChip Akida On-chip AI
This blog post was originally published at BrainChip’s website. It is reprinted here with the permission of BrainChip. Accelerating LiDAR Point Cloud with BrainChip’s Akida™ PointNet++ Model. LiDAR (Light Detection and Ranging) technology is the key enabler for advanced Spatial AI—the ability of a machine to understand and interact with the physical world in three
Introducing Synaptics Astra SL2610: The Edge Processor Engineers Have Been Waiting For
This blog post was originally published at Synaptics’ website. It is reprinted here with the permission of Synaptics. There’s a growing tension in the world of connected products. On one side, engineers find themselves having to push microcontrollers far beyond their limits, resorting to bolted-on accelerators, extra parts and delicate pipelines just to keep pace
