APPLICATIONS

EuroBLECH Tradeshow: Inline Metal Bending Control with Autonomous Laser Profiler

October 13, 2022 – At the EuroBLECH tradeshow, Vision Components (booth 12-A02) will showcase its tested and proven laser profiler for angle measurement and inline control of sheet metal bending processes. The VC nano3D-Z laser triangulation sensor operates autonomously, without an external computing unit, and is already fully calibrated for angle measurement. It enables dynamic […]

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Hailo Demonstration of Accurate License Plate Recognition for High-speed Moving Vehicles

Nadav Eden, Application Engineer Group Leader at Hailo, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Eden demonstrates accurate license plate recognition of high-speed moving vehicles based on the highly efficient Hailo-8 AI processor.

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Unikie Demonstration of AI-enabled Real-time Situational Awareness and Smart Spaces

Petri Talala, Vice President and General Manager at Unikie, demonstrates the company’s latest edge AI and vision technologies and products in Business Oulu’s booth at the 2022 Embedded Vision Summit. Specifically, Talala demonstrates an AI-enabled real-time situational awareness solution. Talala demonstrates how software-based edge AI, sensor fusion and a secure connectivity platform can together create

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Vehicle Homologation Is Among the Biggest Challenges for Roboshuttles

Roboshuttles like those from EasyMile and Navya are a new and exciting mobility solution that have grown in interest during the past decade. They are all electric, autonomous, and a promised solution to last mile journeys in cities. However, in the past few years, IDTechEx has observed a slump in roboshuttle sales and a reduction

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OEM Laser Profiler with Integrated 3D Image Processing

October 4, 2022 – Vision Components launches the new OEM laser profiler VC picoSmart 3D with integrated processors for 3D profile data analysis and further image processing tasks. All components are designed to function together perfectly: a miniaturized embedded vision system with a 1-megapixel image sensor, an FPGA and a high-end FPU processor and a

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“Making Cities More Efficient with Computer Vision and Edge AI,” a Presentation from Hayden AI

Vaibhav Ghadiok, Co-founder and Executive Vice President of Engineering at Hayden AI, presents the “Making Cities More Efficient with Computer Vision and Edge AI” tutorial at the September 2022 Edge AI and Vision Innovation Forum. Vaibhav Ghadiok is an engineering leader with a track record of productizing robotics technology. He has 15+ years of experience

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AMD Demonstration of Kria Machine Vision

Drew Emery, Technical Sales Engineer at AMD, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Emery demonstrates one of the applications included with the Kria KR260 Robotics Starter Kit. The application implements an industrial camera design using a Sony IMX SLVS-EC sensor and the widely

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Teledyne Introduces Contact Image Sensors for High-speed, High-resolution Line Scan Imaging

WATERLOO, Canada – September 27, 2022 – Teledyne DALSA is pleased to introduce AxCIS™, a new family of high-speed and high-resolution fully integrated line scan imaging modules. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications. AxCIS is powered by

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SmartCow Releases AI SuperCam and Box PC Powered by NVIDIA Jetson AGX Orin for Next-Generation Edge Applications

Most powerful, compact and energy-efficient AI ‘at the edge’ for smart city with 5G functionality JULIANS, MALTA, September 21, 2022 – Today,SmartCow, an AI engineering company specializing in video analytics and AIoT devices, announced two robust ‘end to end’ solutions for smart cities: Mars, an AI edge embedded box PC; and SuperCam, the powerful all-in-one

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IDS Adds Numerous New USB3 Cameras to Its Product Range

September 21, 2022 – Anyone who needs readily available industrial cameras for image processing projects is facing a difficult task due to the worldwide chip shortage. IDS Imaging Development Systems GmbH has therefore been pushing the development of alternative USB3 hardware generations with available, advanced semiconductor technology in recent months and has consistently procured components

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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