News

New Arm Technologies to Transform the Software-defined Future For the Automotive Industry

News Highlights: Arm is delivering critical resources to accelerate the automotive industry’s software-defined future with support from leading industry players including AWS, Continental, CARIAD and more SOAFEE, a new software architecture and open-source reference implementation, brings the real-time and safety needs of automotive together with the advantages of a cloud-native approach Two new reference hardware […]

New Arm Technologies to Transform the Software-defined Future For the Automotive Industry Read More +

Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round

Stealth company incubated by blockchain unicorn Bitfury Group and global nanoelectronics R&D center imec Eindhoven, Netherlands – September 15, 2021 – AI semiconductor startup Axelera AI announced today that it has successfully closed a seed investment round of $12 million. The round was led by emerging technologies leader Bitfury and joined by global nanoelectronics R&D

Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round Read More +

GML and ERM Partner to Develop Life-Ready AI Kit for Education

September 14, 2021–PARIS–(BUSINESS WIRE)–GrAI Matter Labs (GML), a pioneer of brain-inspired computing solutions, announced today that it has entered a partnership with ERM Automatismes (ERM), a French market leader for didactic solutions in technological and professional training for 30 years, to create a ROS2-based robotics education kit. The Life-Ready AI Kit for Education combines robotics

GML and ERM Partner to Develop Life-Ready AI Kit for Education Read More +

Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

New Tensilica AI engine boosts performance and AI accelerators provide a turnkey solution for consumer, mobile, automotive and industrial AI SoC designs Highlights: Domain-specific, extensible and configurable AI platform built upon mature, volume production-proven Tensilica architecture Industry-leading performance and energy efficiency for on-device AI applications Comprehensive, common AI software addresses all target markets Low-, mid-

Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform Read More +

Teledyne e2v Introduces the Industry’s Smallest 2MP & 1.5MP CMOS Sensors, Featuring a Low-noise Global Shutter Pixel

New Topaz sensors are ideal for mobile applications, offering an attractive price point with no-compromise performance. Grenoble, FRANCE, September 14, 2021 – Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], has introduced its Topaz series of industrial CMOS sensors with new 2MP and 1.5MP resolution devices. These new 1920 x 1080 and 1920 x

Teledyne e2v Introduces the Industry’s Smallest 2MP & 1.5MP CMOS Sensors, Featuring a Low-noise Global Shutter Pixel Read More +

Webinar Explores Building Scalable Edge ML Solutions Using NXP Processors and Amazon Services

Now available for on-demand viewing is the archive recording of the webinar “Building Scalable Edge ML Solutions with NXP i.MX Applications Processors and AWS Cloud Services,” co-presented by Ali Osman Örs, Director of AI ML Strategy and Technologies for Edge Processing at NXP Semiconductors, and Jack Ogawa, responsible for Strategic Semiconductor Partnerships for IoT at

Webinar Explores Building Scalable Edge ML Solutions Using NXP Processors and Amazon Services Read More +

Xilinx Showcases New Solutions and Technologies for Software and Hardware Developers

Week one unveils software developer kit for intelligent video analytics applications, an expanded video and imaging IP portfolio and developer design contest Sep 07, 2021 – SAN JOSE, Calif. – (Xilinx Adapt) – Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive computing, today unveiled powerful new solutions and IP for its rapidly growing software, AI, and

Xilinx Showcases New Solutions and Technologies for Software and Hardware Developers Read More +

MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks

Kompanio family allows OEMs to build powerful, thin and lightweight mobile computing devices with long battery life HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio™ 900T chipset, expanding MediaTek’s portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch

MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks Read More +

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

Geneva, September 9, 2021 – STMicroelectronics has announced the first multi-zone FlightSense™ time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products. The VL53L5CX sensor provides up to 64 sensing zones with multi-target detection, distance measurement up to four meters in each zone, and

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications Read More +

BrainChip Demonstrates that Intelligent AI is Everywhere at AI Hardware Summit 2021

Aliso Viejo, Calif. – August 5, 2021 – BrainChip Holdings Ltd (ASX: BRN), (OTCQX: BRCHF), a leading provider of ultra-low power high performance artificial intelligence technology, today announced that Rob Telson, VP Worldwide Sales and Marketing, will be a featured presenter at the AI Hardware Summit at 1:25 p.m. PDT, September 13th. This hybrid event

BrainChip Demonstrates that Intelligent AI is Everywhere at AI Hardware Summit 2021 Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top