News

Upcoming Webinar Explores How to Choose the Right Processor and Camera For Your Application

On June 28, 2023 at 10:00 am PT (1:00 pm ET), Alliance Member companies e-con Systems and NVIDIA will co-deliver the free webinar “How to Choose the Right Jetson Processor and Camera For Your Application.” From the event page: The definitive guide to developing a successful edge AI-enabled embedded vision application. Key takeaways: Find out […]

Upcoming Webinar Explores How to Choose the Right Processor and Camera For Your Application Read More +

Vision Components at LASER World of PHOTONICS: MIPI Cameras and Smart Embedded Vision Systems

June 13, 2023 – At LASER World of PHOTONICS, Vision Components (booth A3-123) will present new MIPI camera modules and embedded vision systems for time-saving, cost-effective development of customized solutions. Highlights include embedded cameras with a MIPI CSI-2 interface, featuring IMX565, IMX566, IMX567 and IMX568 global shutter sensors from the Sony Pregius S series. The

Vision Components at LASER World of PHOTONICS: MIPI Cameras and Smart Embedded Vision Systems Read More +

Teledyne e2v’s New 8K Image Sensor Delivers Wide FOV for High-throughput Logistics Vision Systems

GRENOBLE, France, June 13, 2023 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Snappy Wide, a new 8K wide aspect ratio CMOS image sensor designed specifically for logistics applications where larger conveyor belts are becoming increasingly common. A single Snappy Wide sensor can cover this large field

Teledyne e2v’s New 8K Image Sensor Delivers Wide FOV for High-throughput Logistics Vision Systems Read More +

BrainChip Examines New Approach to Optimizing Time-series Data

Laguna Hills, Calif. – June11, 2023 – A new white paper by BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, unveils Temporal Event-based Neural Networks (TENNs) – an innovative way to bring greater accuracy and efficiency to complex models on

BrainChip Examines New Approach to Optimizing Time-series Data Read More +

Focus on Software First with the oneAPI Construction Kit

Bring the open and standards-based SYCL™ programming model to your custom accelerator with the oneAPI Construction Kit. June 5, 2023 – Edinburgh – Today, Codeplay® announces the latest extension of the oneAPI ecosystem with an open source project that allows code written in SYCL to run on custom architectures for HPC and AI. The oneAPI

Focus on Software First with the oneAPI Construction Kit Read More +

e-con Systems Announces Advanced Multi-camera Solutions for the Qualcomm Robotics RB5 Kit

QRB5 kit Multi-camera support up to 6 cameras MIPI & GMSL Interfaces Qualcomm ISP Full HD 20 MP camera Monochrome HDR LFM Low light NIR CALIFORNIA & CHENNAI (June 01st, 2023) – e-con Systems™, with over two decades of experience in designing, developing, and manufacturing OEM cameras, recently launched an extensive multi-camera solution to fully

e-con Systems Announces Advanced Multi-camera Solutions for the Qualcomm Robotics RB5 Kit Read More +

University of Oklahoma Joins the BrainChip University AI Accelerator Program

Laguna Hills, Calif. – May 31, 2023 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that University of Oklahoma (OU) has joined the University AI Accelerator Program to ensure students have the tools and resources needed to

University of Oklahoma Joins the BrainChip University AI Accelerator Program Read More +

Syntiant Strengthens Advisory Board with Four New Members

Business and Technical Leaders Provide Strategic Guidance and Expertise on Growth Strategy Irvine, Calif., May 31, 2023 – Syntiant Corp., a leader in edge AI deployment, today announced the addition of four new members to its advisory board, which is now comprised of 10 seasoned professionals from diverse backgrounds who serve as trusted resources for

Syntiant Strengthens Advisory Board with Four New Members Read More +

Teledyne’s Backside Illuminated TDI Camera Delivers Greater Sensitivity for Near Ultraviolet and Visible Imaging

WATERLOO, Canada – May 30, 2023 – Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce its Linea™ HS 16k Backside Illuminated (BSI) TDI camera is in production now. With its CLHS interface, this camera offers enhanced sensitivity and is ideal for Near Ultraviolet (NUV) and visible imaging applications such as wafer, flat

Teledyne’s Backside Illuminated TDI Camera Delivers Greater Sensitivity for Near Ultraviolet and Visible Imaging Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top