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Lattice Joins Autotech Council to Accelerate Next Generation Automotive Application Development

HILLSBORO, Ore. – Mar. 7, 2023 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it has joined the Autotech Council, a mobility ecosystem community of auto makers, mobility companies, and startups focused on solving mobility and transportation challenges. Lattice will work closely with other Autotech Council members to advance in-vehicle […]

Lattice Joins Autotech Council to Accelerate Next Generation Automotive Application Development Read More +

Leading Edge AI Chipmaker Hailo Introduces Hailo-15: The First AI-centric Vision Processors for Next-generation Intelligent Cameras

The powerful new Hailo-15 Vision Processor Units (VPUs) bring unprecedented AI performance directly to cameras deployed in smart cities, factories, buildings, retail locations, and more. TEL AVIV, Israel, March 8, 2023 /PRNewswire/ — Hailo, the pioneering chipmaker of edge artificial intelligence (AI) processors, today announced its groundbreaking new Hailo-15™ family of high-performance vision processors, designed

Leading Edge AI Chipmaker Hailo Introduces Hailo-15: The First AI-centric Vision Processors for Next-generation Intelligent Cameras Read More +

Teledyne Introduces 4K 3D Laser Line Profile Sensor Family for In-line Measurement

WATERLOO, Canada – March 7, 2023 – Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, is pleased to introduce the Z-Trak™ LP2C 3D profile sensor family for in-line 3D measurement and inspection applications. As the latest member of the Z-Trak family, the LP2C 4K sensors deliver 4,096 samples

Teledyne Introduces 4K 3D Laser Line Profile Sensor Family for In-line Measurement Read More +

FRAMOS Announces Release of FSM-IMX570 Devkit for the Development of Time-of-Flight (ToF) Cameras with Sony’s IMX570 iToF Image Sensor

March 4, 2023 – FRAMOS, a leading global supplier of imaging components, announced the launch of a new development kit for vision system engineers who are working to develop Time-of-Flight devices for industrial and robotics applications. The FSM-IMX570 Devkit provides vision system engineers with a simple, coherent framework for quickly developing a working prototype of

FRAMOS Announces Release of FSM-IMX570 Devkit for the Development of Time-of-Flight (ToF) Cameras with Sony’s IMX570 iToF Image Sensor Read More +

STMicroelectronics’ All-in-one Motion and Bone-conduction Sensor Saves Space and Power in Hearables and Headsets

Delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets 06 Mar 2023 | Geneva | STMicroelectronics’ LSM6DSV16BX is a unique highly integrated sensor that delivers tremendous space savings inside hearable devices including sports and general-purpose earbuds. It combines a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with

STMicroelectronics’ All-in-one Motion and Bone-conduction Sensor Saves Space and Power in Hearables and Headsets Read More +

BrainChip Introduces Second-generation Akida Platform

Introduces Vision Transformers and Spatial-Temporal Convolution for radically fast, hyper-efficient and secure Edge AIoT products, untethered from the cloud Laguna Hills, Calif. – March 6, 2023 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, neuromorphic AI IP, today announced the second generation of

BrainChip Introduces Second-generation Akida Platform Read More +

e-con Systems Launches a New 3D ToF MIPI Camera for NVIDIA Jetson Processors

940nm/850nm MIPI CSI 2 Multi-camera support NVIDIA Depth range up to 12m <1% accuracy California and Chennai (March 03, 2023) – e-con Systems, a leading OEM embedded camera manufacturer and solution provider launches DepthVista_MIPI_IRD, a 3D Time of Flight (ToF) camera for NVIDIA Jetson AGX Orin and AGX Xavier, with outdoor robustness. DepthVista_MIPI_IRD is a

e-con Systems Launches a New 3D ToF MIPI Camera for NVIDIA Jetson Processors Read More +

Enhanced Teledyne FLIR Prism AI Detection and Tracking Software Model Enables Embedded Thermal Automotive Perception Systems

Trained and validated on more than 2.3M multi-spectrum annotations, the new compact Prism AI model improves inference performance for perception development GOLETA, Calif. February 28, 2023 ― Teledyne FLIR, part of Teledyne Technologies Incorporated, today announced a new Prism AI release featuring a compact AI model for simplified deployment on embedded systems. The new release further enables perception

Enhanced Teledyne FLIR Prism AI Detection and Tracking Software Model Enables Embedded Thermal Automotive Perception Systems Read More +

Teledyne e2v Releases 1.5 Megapixel Version of Optimom, a Turnkey Optical Module for Quick and Easy Development of Vision Systems

Grenoble, FRANCE, 28 February 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], announces the release of Optimom 1.5M, the latest member of the Optimom™ family, a new range of turnkey optical modules that can be instantly integrated into vision systems. Optimom 1.5M is a complete board-level vision extension made to accelerate development time,

Teledyne e2v Releases 1.5 Megapixel Version of Optimom, a Turnkey Optical Module for Quick and Easy Development of Vision Systems Read More +

BrainChip Partners with emotion3D to Improve Driver Safety and User Experience

Laguna Hills, Calif. – February 26, 2023 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that it has entered into a partnership with emotion3D to demonstrate in-cabin analysis that makes driving safer and enables next level user

BrainChip Partners with emotion3D to Improve Driver Safety and User Experience Read More +

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