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SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation

Transforming ADAS and In-Vehicle Infotainment Breakthroughs with Innovative ML IP, Chiplets, and System-on-Chip Reference Architectures SAN JOSE, Calif., July 30, 2025 /PRNewswire/ — SiMa.ai, a pioneer in ultra-efficient machine learning system-on-chip (MLSoC) platform, today announced the next phase of their strategic collaboration with Synopsys, the leading provider of engineering solutions from silicon to systems, to […]

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SiMa.ai and Macnica TecStar Company Announce Strategic Distribution Agreement to Accelerate Physical AI Adoption in Japan

SAN JOSE, Calif. and YOKOHAMA, Japan, July 29, 2025 /PRNewswire/ — SiMa.ai, the machine learning company delivering the industry’s first purpose-built software-centric MLSoC™ platform for the embedded edge, today announced a distribution partnership with Macnica, Inc. TecStar Company, one of Japan’s leading technology solutions providers. The partnership will accelerate adoption of SiMa.ai’s high-performance, low-power physical

SiMa.ai and Macnica TecStar Company Announce Strategic Distribution Agreement to Accelerate Physical AI Adoption in Japan Read More +

Renesas Introduces 64-bit RZ/G3E MPU for High-performance HMI Systems Requiring AI Acceleration and Edge Computing

MPU Integrates a Quad-Core CPU, an NPU, High-Speed Connectivity and Advanced Graphics to Power Next-Generation HMI Devices with Full HD Display TOKYO, Japan, July 29, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimized for high-performance Human Machine

Renesas Introduces 64-bit RZ/G3E MPU for High-performance HMI Systems Requiring AI Acceleration and Edge Computing Read More +

STMicroelectronics to Strengthen Position in Sensors with Acquisition of NXP’s MEMS Sensors Business

ST enters into agreement for acquisition of NXP’s MEMS sensor business for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of technical milestones The MEMS businesses of ST and NXP are strongly complementary in terms of technology and product portfolio, with the

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ImagingNext AI-Vision Event: Agenda Now Available

Munich, Bavaria, Germany – July 23rd, 2025 – A lot of work has gone into planning the schedule and topics, but now the program for the ImagingNext event is finally ready. Experts from the fields of imaging, embedded vision, and related areas who want to gain substantial insights into artificial intelligence and its applications can

ImagingNext AI-Vision Event: Agenda Now Available Read More +

Embedded Vision Kit from Vision Components and Phytec: Plug-and-play with i.MX 8M Plus / 8M Mini and 50+ MIPI Cameras

Mainz / Ettlingen, July 23, 2025 – The phyBOARD for VC MIPI Development Kit from Phytec, in collaboration with Vision Components, is now available in two versions with NXP i.MX 8M Plus and i.MX 8M Mini processor boards. Both versions provide plug-and-play support for Vision Components’ more than 50 VC MIPI Cameras. The two embedded vision

Embedded Vision Kit from Vision Components and Phytec: Plug-and-play with i.MX 8M Plus / 8M Mini and 50+ MIPI Cameras Read More +

IP67 Camera and Components: Basler Presents a Complete Solution

Basler presents an IP67-protected vision system that reliably delivers images under demanding environmental conditions with dust, dirt, and water. Ahrensburg, July 23, 2025 – Basler AG, international manufacturer of high-quality machine vision hardware and software, presents a vision system protected in accordance with the IP67 standard. The system consists of an ace 2 IP67 camera,

IP67 Camera and Components: Basler Presents a Complete Solution Read More +

FRAMOS Campus Wins Green Building Award in New Construction Category

Zagreb, Croatia – July 22, 2025. – The FRAMOS Campus project in Čakovec (Croatia) has been awarded the 2024 Green Building and Sustainable Built Environment Annual Award in the New Construction category by GBC Croatia. GBC Croatia is a member of the World Green Building Council (World GBC) and the European Regional Network (ERN). This recognition highlights

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First Sensor Module for High-resolution Image Sensor IMX811 (247 Mpixel) Available Soon

Embedded vision engineers and tech leads can start preparing for high-resolution applications. Munich – July 17th 2025 – The first on the market for engineers and tech leads in the embedded vision sector: FRAMOS will soon release the first image sensor module and development kit available on the market for Sony’s new high-resolution IMX811 image

First Sensor Module for High-resolution Image Sensor IMX811 (247 Mpixel) Available Soon Read More +

SiMa.ai to Accelerate Edge AI Adoption with Cisco for Industry 4.0

SiMa.ai’s Modalix AI Platform Now Compatible With Cisco’s Industrial Ethernet Switches, Delivers Real-Time AI at the Industrial Edge San Jose, CA – July 16, 2025 – SiMa.ai, a leading provider of Machine Learning System on a Chip™ (MLSoC silicon and the Palette™ software platform, today announced a go-to-market collaboration with Cisco to bring artificial intelligence

SiMa.ai to Accelerate Edge AI Adoption with Cisco for Industry 4.0 Read More +

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