January 17, 2023 – At Photonics West (San Francisco, January 28 – February 2), Vision Components will be showcasing new MIPI camera modules and components that make the integration of embedded vision even faster, easier and more cost-efficient. The highlight will be the FPGA-based hardware accelerator VC Power SoM, which completes complex image processing calculations […]
Trenton, New Jersey, USA, January 17, 2023 – Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2nd, 2023, in San Francisco, California. Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging
Laguna Hills, Calif. – January 15, 2023 – A new white paper by BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, evaluates the current state of edge AI benchmarks and the need to continually improve metrics that measure performance and
Expanding the Intel® Agilex™ FPGA Offering to Enable New Capabilities and a Broad Set of Applications January 10, 2023 – With the introduction of Intel® Agilex™ FPGAs in 2019, Intel delivered the industry’s highest performance, flexible and industry-leading power efficiency programmable logic devices., This product family has become prominent in the FPGA industry and our
Learn About the Intel Agilex FPGA Portfolio Expansion Read More +
On March 2, 2023 at 9 am PT (noon ET), Axel Clouet, Ph.D., technology and market analyst at the Yole Group, will present the free hour webinar “Short-wave Infrared: The Dawn of a New Imaging Age?,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page: “Short wave” refers
Free Webinar Explores the Opportunities for Short-wave Infrared Imaging Read More +
January 10, 2022 – Vision Components will host two webinars on 24 January, demonstrating the operation and integration of autonomous angle measurement in metal processing. Thanks to the integrated processor, the sensor directly outputs the workpiece angle in degrees. The free-of-charge webinars are aimed in particular at manufacturers and distributors of press brakes and metal
Free Webinar: Real-time Angle Measurement in Sheet Metal Bending Read More +
Grenoble, FRANCE, 10th January, 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY] announces the release of its Hydra3D+, a new Time-of-Flight (ToF) CMOS image sensor which incorporates 832 x 600 pixel resolution and is tailored for versatile 3D detection and measurement. Designed with Teledyne e2v’s proprietary CMOS technology, Hydra3D+ features a brand-new
Ergo 2 enables even larger, more complex neural networks inside edge devices, including transformer networks for language and imaging, while drawing less than 100 milliwatts of compute power January 3, 2023 – Today, Perceive® unveiled a faster, more powerful addition to the Ergo® product line. The new Ergo 2 AI processor provides the performance needed
The i.MX 95 family combines multi-core high performance compute, immersive 3D graphics and an integrated NXP eIQ® Neutron Neural Processing Unit (NPU) to enable machine learning and advanced edge applications across automotive, industrial and IoT applications Part of the NXP SafeAssure® portfolio, the i.MX 95 family’s advanced heterogeneous domain design powers safety-enabled platforms with integrated
Highly scalable, area and power efficient machine learning accelerator core architecture. January 4, 2023 – A critical requirement for the next wave of edge applications is advanced processing and machine learning capabilities. Machine learning use cases vary widely for the different markets and application domains requiring different amounts of acceleration compute performance and at differing
Introducing the NXP eIQ Neutron Neural Processing Unit (NPU) Read More +
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