TECHNOLOGIES

Deci Boosts Computer Vision and NLP Models’ Performance at MLPerf

Deci’s submissions deliver breakthrough accuracy & throughput performance across CV and NLP models on Intel’s CPUs Tel Aviv, Israel, April 6, 2022 – Deci, the deep learning company harnessing Artificial Intelligence (AI) to build AI, announced its results for both Computer Vision (CV) and Natural Language Processing (NLP) inference models that were submitted to the […]

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Lanner Electronics and MOV.AI Partner to Speed Up AMR Development with an Integrated Computing and Software Platform

April 5, 2022 – Lanner Electronics and MOV.AI are collaborating to provide Autonomous Mobile Robots (AMR) manufacturers with an integrated computing and software platform for optimized performance and faster AMR development and deployment. According to Fortune Business Insights, the global AMR market is expected to grow at an annual rate of 23.7 percent, reaching USD

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BrainChip and SiFive Partner to Deploy AI/ML Technology at the Edge

Laguna Hills, Calif. – April 5, 2022 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power neuromorphic AI chips and IP, and SiFive, Inc., the founder and leader of RISC-V computing, have combined their respective technologies to offer chip designers optimized AI/ML compute at the edge.

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Ambarella and Lumentum Offer Unique Combination of Edge AI and Privacy for Smarter Building Automation and Occupancy Sensor Systems

Joint Reference Design Enables New Paradigm in Distributed Building Intelligence, Adding Scalable AI Smarts to Sensor Nodes While Providing Occupant Privacy SAN JOSE, Calif., and SANTA CLARA, Calif., April 05, 2022 (GLOBE NEWSWIRE) — Lumentum Holdings Inc. (“Lumentum”) (NASDAQ: LITE), a market-leading designer and manufacturer of innovative optical and photonic products, and Ambarella, Inc. (NASDAQ:

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Teledyne’s New High-resolution Multispectral Line Scan Camera Extends Defect Detection Beyond the Surface

Teledyne DALSA introduces its Linea ML 8k multispectral CLHS line scan camera for improved defect detectability with a single scan WATERLOO, Canada – April 5, 2022 – Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce the release of its multispectral Camera Link HS (CLHS) line scan camera—a new model of the award-winning

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Is the New NVIDIA Jetson AGX Orin Really a Game Changer? We Benchmarked It

This technical article was originally published by SmartCow AI Technologies. It is reprinted here with the permission of SmartCow AI Technologies. On March 22th 2022, NVIDIA announced the availability of its new edge computing platform, the Jetson AGX Orin™ developer kit. The production version is being released on Q4 2022 at roughly the same price

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A Tutorial on Implementing Visual Intelligence with a Low Cost MCU

In the fall of 2021, Alliance Member companies Au-Zone Technologies and NXP Semiconductors co-presented the webinar “ML at the Edge: Visual Intelligence with a Low Cost MCU” as an accompaniment to their technical blog post on the topic. If you missed the webinar, you can view the archive recording here. From the event page: Are

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Will 3D Depth Cameras Return to Android Phones?

Photo – Courtesy of Gagadget website This market research report was originally published at Yole Développement’s website. It is reprinted here with the permission of Yole Développement. For a while, no Android player included 3D depth cameras in their flagship phones. However, during Mobile World Congress 2022, Honor unexpectedly released the Magic 4 Pro with

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Guide to Computer Vision: Why It Matters and How It Helps Solve Problems

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. This post was written to enable the beginner developer community, especially those new to computer vision and computer science. NVIDIA recognizes that solving and benefiting the world’s visual computing challenges through computer vision and artificial intelligence requires

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Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems

X1M Boards Deliver High Performance and Ultra Low Power in a Tiny M.2 Form Factor MOUNTAIN VIEW, Calif., March 29, 2022 /PRNewswire/ — Flex Logix® Technologies, Inc., supplier of the most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, today announced production availability of its InferX™ X1M boards. At roughly the size of

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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