Sample Use Cases with Type2DA EVK Demoed at CES 2023 Smyrna, GA, December 14, 2022 – Murata today announced that it is showcasing its new Edge AI module Type2DA with Syntiant® NDP102 Neural Decision Processor™ (NDP) at CES 2023 (LVCC booth #10249). Ideal for always-on audio and sensor applications, the new solution significantly improves efficiencies […]
Ron Kamm, Application Engineer at Syntiant, demonstrates the company’s latest edge AI and vision technologies and products at the December 2022 Edge AI and Vision Innovation Forum. Specifically, Kamm gives an overview of the company’s complete edge AI computer vision solutions for consumer, commercial enterprise and automotive applications. The demonstration shows both Syntiant’s ultra-low-power vision
Syntiant Demonstration of Its Always-on Battery-powered Computer Vision Capabilities Read More +
Young-Jun Yoo, director of marketing at Nextchip, demonstrates the company’s latest edge AI and vision technologies and products at the December 2022 Edge AI and Vision Innovation Forum. Specifically, Yoo demonstrates the company’s new ISP (image signal processor) applicable to various CFAs (color filter arrays), as well as the company’s latest edge AI processor.
Accelerating ecosystem growth as a leading member of the RISC-V community London, England – 14th December 2022 – Imagination Technologies announces it has upgraded to the Premier RISC-V International membership level, further establishing its commitment to drive growth for the RISC-V ecosystem. At this Premier level, Shreyas Derashri, VP of Compute at Imagination, will join
Imagination Extends Its Commitment to RISC-V with an Upgrade to Premier Level Membership Read More +
Delivers AIoT (Artificial Intelligence of Things) edge technology for autonomous driving, robotics, and mobility AI vision surveillance management EL DORADO HILLS, CA — December 13, 2022 —Blaize® today announced a multi-year Memorandum of Understanding with Korea Telecom (KT) — Korea’s leading AI, big data, and cloud service provider. The strategic collaboration brings AIoT (Artificial Intelligence
Aimed at AI/ML applications in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute NeuPro-M awarded as ‘Most Promising Product’ 3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X ROCKVILLE, MD – December 13, 2022 – CEVA, Inc. (NASDAQ: CEVA),
CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 Read More +
Hannover, Germany, December 13, 2022 – videantis GmbH, provider of a unified platform for combined processing of algorithms as diverse as AI (Artificial Intelligence), multi-modal sensor data processing and fusion, or video coding on a single architecture, today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The
KI-FLEX AI Chip Tapes Out With Flexible videantis Processor Platform Read More +
Ultra-Low-Power Chip Provider Recognized for Breakthroughs in Edge AI Solutions Irvine, Calif., December 12, 2022 — Syntiant Corp., a provider of deep learning solutions for always-on edge AI voice, sensor and vision applications, today announced that the company was named 2022’s “Start-Up to Watch” during this year’s Global Semiconductor Alliance (GSA) Awards. Syntiant was selected
Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance Read More +
Laguna Hills, Calif. – December 11, 2022 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power neuromorphic AI IP, today announced that it has become a member of the Intel Foundry Services (IFS) ecosystem alliance to help advance innovation on Intel’s foundry manufacturing platform. BrainChip is
BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge Read More +
HSINCHU, Taiwan – December 1, 2022 – MediaTek today announced the Dimensity 8200, the company’s newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences – including connectivity, gaming, multimedia, displays and imaging – at a more accessible price point. Built on the 4nm-class process, the new chipset
MediaTek’s New Dimensity 8200 Upgrades Experiences on Premium 5G Smartphones Read More +
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