Processors

Leading Edge AI Chipmaker Hailo Partners with NXP to Launch High-Performance, Scalable, AI Solutions for the Automotive Industry

NXP’s automotive processors, combined with the Hailo-8™AI processor, offer powerful, scalable, safe, and efficient deep learning processing for automotive ECUs TEL AVIV, Israel, Dec. 16, 2021 /PRNewswire/ — Hailo, the leading edge Artificial Intelligence chipmaker today announced its partnership with NXP® Semiconductors, an automotive market innovator, to launch a number of joint AI solutions for […]

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MediaTek Dimensity 9000 Uses Armv9 Technology for Unparalleled Performance

News Highlights Armv9 architecture at the foundation of MediaTek Dimensity 9000 premium SoC Specialized processing empowers MediaTek to redefine the flagship mobile experience First partner adoption of Total Compute solution with Arm Cortex-X2 2021 has been a year of continued innovation for Arm and its partners as we look to empower the ultimate digital experiences

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MediaTek Officially Launches Dimensity 9000 Flagship Chip And Announces Adoption by Global Device Makers

Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022 HSINCHU, Taiwan – December 16, 2021 – MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements

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Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development

Improved user experience and more performance for applications in robotics, smart factory, and motion control HILLSBORO, Ore – Dec. 15, 2021 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today launched the latest version of its Lattice Automate™ solution stack for industrial automation systems featuring new real-time networking capabilities, AI-based predictive maintenance, increased

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Renesas Demonstration of the RZ/V Microprocessor with a Power-efficient AI Accelerator

Manny Singh, Principal Product Marketing Manager at Renesas, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Singh demonstrates the company’s the RZ/V microprocessor with a power-efficient AI accelerator. In this demo of object detection and recognition on Renesas’ proprietary Dynamically Reconfigurable Processor (DRP-AI), Singh shows

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Microchip Technology Demonstration of Its VectorBlox Software Development Kits and PolarFire FPGAs for Artificial Intelligence and Machine Learning

Avery Williams, Technical Marketing Engineer at Microchip Technology, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Williams demonstrates the company’s VectorBlox software development kits and PolarFire FPGAs for artificial intelligence and machine learning. Williams demonstrates the steps required to quickly get started with evaluating artificial

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Ready for Air: Welcome to a New Dawn for Aerial Autonomy

This blog post was originally published at Opteran Technologies’ website. It is reprinted here with the permission of Opteran Technologies. Opteran enables robust, fast, GPS free, verifiable autonomy for aerial systems, at previously unimaginable size, weight (~30g), power (~3W) and hardware costs using consumer 2D cameras Today we’re happy to share a first glance at our

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Inuitive Demonstration of Its Multi-core Processor For 3D Imaging, Deep Learning and Computer Vision

Dor Zepeniuk, Chief Technology Officer and Vice President of Products at Inuitive, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Zepeniuk demonstrates the company’s NU4000, a multi-core processor for 3D imaging, deep learning and computer vision. Zepeniuk demos the diverse edge computing and other capabilities

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Immervision Demonstration of How Its Super-wide-angle Camera and Pixel Processing Can Improve Machine Perception

Patrice Roulet, Vice President of Technology and Co-founder of Immervision, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Roulet demonstrates how the company’s super-wide-angle camera and pixel processing can improve machine perception. Roulet describes how to specify, simulate and design using cameras equipped with super-wide-angle

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eYs3D Microelectronics Demonstration of Stereo Vision for Robotic Automation and Depth Sensor Fusion

James Wang, Technical General Manager at eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Wang demonstrates stereo vision for robotic automation and depth sensor fusion. Depth-sensing technology is now being widely adopted commercially in various consumer and industrial products. It’s commonly recognized that

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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