Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging
The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology […]