This article was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. Running advanced AI and computer vision workloads on small, power-efficient devices at the edge is a growing challenge. Robots, smart cameras, and autonomous machines need real-time intelligence to see, understand, and react without depending on the cloud. The NVIDIA […]
Solution stacks deliver broadcast-quality video, SLVS-EC to CoaXPress bridging and ultra-low power operation for next-generation medical, industrial and robotic vision applications CHANDLER, Ariz., January 19, 2025 —Microchip Technology (Nasdaq: MCHP) has expanded its PolarFire® FPGA smart embedded video ecosystem to support developers who need reliable, low-power, high-bandwidth video connectivity. The embedded vision solution stacks combine hardware evaluation kits, development
Tripling product revenues, comprehensive developer tools, and scalable inference IP for vision and LLM workloads, position Quadric as the platform for on-device AI. BURLINGAME, Calif., Jan. 14, 2026 (PRNewswire) — Quadric®, the inference engine that powers on-device AI chips, today announced an oversubscribed $30 million Series C funding round, bringing total capital raised to $72
Quadric today announced that TIER IV, Inc., of Japan has signed a license to use the Chimera AI processor SDK to evaluate and optimize future iterations of Autoware, open-source software for autonomous driving pioneered by TIER IV. Burlingame, CA, January 14, 2026 – Quadric today announced that TIER IV, Inc., of Japan has signed a
This blog post was originally published at Basler’s website. It is reprinted here with the permission of Basler. Deep learning vision systems are often already a central component of industrial image processing. They enable precise error detection, intelligent quality control, and automated decisions – wherever conventional image processing methods reach their limits. We show how a
Deep Learning Vision Systems for Industrial Image Processing Read More +
On January 14, 2026, at 7:00 am EST (10:00 am EST) Alliance Member company Synopsys will deliver a webinar “Advances in ATPG: From Power and Timing Awareness to Intelligent Pattern Search with AI” From the event page: As System-on-Chip (SoC) designs become increasingly complex, meeting test quality and cost goals requires advances in automatic test
Upcoming Webinar on Advances in Automatic Test Pattern Generation Read More +
Key Takeaways: Snapdragon® X2 Plus transforms every click and every moment for modern professionals, aspiring creators and everyday users, delivering speed, multi-day battery life and built-in AI features. Representing a bold leap forward, the newest entrant in the Snapdragon X Series platform broadens access to the advanced performance and premium experiences consumers and businesses expect, expanding the growing Windows 11 Copilot+ PC community. Snapdragon X2 Plus harnesses the power of the 3rd Gen Qualcomm Oryon™ CPU and an 80 TOPS NPU, with select devices from
Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform SAN JOSE, Calif., January 6, 2026, — Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market Read More +
Intel ushers in the next generation of AI PCs with exceptional performance, graphics and battery life; available this month Key Takeaways: First platform built on Intel 18A: At CES 2026, Intel launched the Intel® Core™ Ultra Series 3 processors, the first compute platform built on Intel 18A – the most advanced semiconductor process ever developed and
Intel Core Ultra Series 3 Debut as First Built on Intel 18A Read More +
Key Takeaways: New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems Launching today,
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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