Processors

Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform   SAN JOSE, Calif., January 6, 2026, — Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical […]

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Intel Core Ultra Series 3 Debut as First Built on Intel 18A

Intel ushers in the next generation of AI PCs with exceptional performance, graphics and battery life; available this month   Key Takeaways: First platform built on Intel 18A: At CES 2026, Intel launched the Intel® Core™ Ultra Series 3 processors, the first compute platform built on Intel 18A – the most advanced semiconductor process ever developed and

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AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI

Key Takeaways: New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems Launching today,

AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI Read More +

Qualcomm Drives the Future of Mobility with Strong Snapdragon Digital Chassis Momentum and Agentic AI for Major Global Automakers Worldwide

Key Takeaways: Qualcomm extends its automotive leadership with new collaborations, including Google, to power next‑gen software‑defined vehicles and agentic AI‑driven personalization. Snapdragon Ride and Cockpit Elite Platforms, and Snapdragon Ride Flex SoC, see rapid adoption, adding new design-wins and delivering the industry’s first commercialized mixed‑criticality platform that integrates cockpit, advanced driver‑assistance systems, and end‑to‑end AI. Decade of in-vehicle infotainment

Qualcomm Drives the Future of Mobility with Strong Snapdragon Digital Chassis Momentum and Agentic AI for Major Global Automakers Worldwide Read More +

SiMa.ai Announces First Integrated Capability with Synopsys to Accelerate Automotive Physical AI Development

San Jose, California – January 6, 2026 – SiMa.ai today announced the first integrated capability resulting from its strategic collaboration with Synopsys. The joint solution provides a blueprint to accelerate architecture exploration and early virtual software development for AI- ready, next-generation automotive SoCs that support applications such as Advanced Driver Assistance Systems (ADAS) and In-vehicle-Infotainment

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D3 Embedded Showcases Camera/Radar Fusion, ADAS Cameras, Driver Monitoring, and LWIR solutions at CES

Las Vegas, NV, January 7, 2026 — D3 Embedded is showcasing a suite of technology solutions in partnership with fellow Edge AI and Vision Alliance Members HTEC, STMicroelectronics and Texas Instruments at CES 2026. Solutions include driver and in-cabin monitoring, ADAS, surveillance, targeting and human tracking – and will be viewable at different locations within

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Ambarella Launches Powerful Edge AI 8K Vision SoC With Industry-Leading AI and Multi-Sensor Perception Performance

New 4nm CV7 System-on-Chip Provides Ideal Combination of Simultaneous Multi-Stream Video and Advanced On-Device Edge AI Processing With Very Low Power Consumption SANTA CLARA, Calif., Jan. 05, 2026 (GLOBE NEWSWIRE) — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced during CES the CV7 edge AI vision system-on-chip (SoC), which is optimized for a wide range

Ambarella Launches Powerful Edge AI 8K Vision SoC With Industry-Leading AI and Multi-Sensor Perception Performance Read More +

Qualcomm’s IE‑IoT Expansion Is Complete: Edge AI Unleashed for Developers, Enterprises & OEMs

Key Takeaways: Expanded set of processors, software, services, and developer tools including offerings and technologies from the five acquisitions of Augentix, Arduino, Edge Impulse, Focus.AI, and Foundries.io, positions the Company to help meet edge computing and AI needs for customers across virtually all verticals. Completed acquisition of Augentix, a leader in mass-market image processors, extends Qualcomm Technologies’ ability to provide system-on-chips tailored for intelligent IP cameras and vision systems. New Qualcomm Dragonwing™ Q‑7790 and Q‑8750 processors power security-focused on‑device AI across drones, smart cameras

Qualcomm’s IE‑IoT Expansion Is Complete: Edge AI Unleashed for Developers, Enterprises & OEMs Read More +

NXP and GE HealthCare Accelerate AI Innovation in Acute Care

NXP and GE HealthCare announced a collaboration to pioneer new advancements in edge AI innovation, beginning with new anesthesia and neonatal concepts showcased at CES 2026.   LAS VEGAS and CHICAGO, Illinois, January 6, 2026 — NXP Semiconductors N.V. (NASDAQ: NXPI) and GE HealthCare (NASDAQ: GEHC) today announced a collaboration to pioneer new advancements in

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Accelerate AI Inference for Edge and Robotics with NVIDIA Jetson T4000 and NVIDIA JetPack 7.1

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA is introducing the NVIDIA Jetson T4000, bringing high-performance AI and real-time reasoning to a wider range of robotics and edge AI applications. Optimized for tighter power and thermal envelopes, T4000 delivers up to 1200 FP4  TFLOPs of AI compute and 64 GB of memory,

Accelerate AI Inference for Edge and Robotics with NVIDIA Jetson T4000 and NVIDIA JetPack 7.1 Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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