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AI-Assisted Coding: The Next Step in Abstraction
I’ve been using AI-assisted coding for my work a lot recently, and I’ll admit, I wasn’t sure how I felt
A Smarter Vision for AI at ISC West 2026
Ambarella will be hosting an invitation-only exhibition at ISC West 2026, taking place March 25 – 27 at the Venetian
UCIe & Chiplets: A Practical Guide to Modular SoC Design
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The semiconductor industry
From Warehouse to Wallet: New State of AI in Retail and CPG Survey Uncovers How AI Is Rewiring Supply Chains and Customer Experiences
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. The third annual
Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design
New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI
STMicroelectronics and Leopard Imaging Accelerate Robotics Vision with NVIDIA Jetson-ready Multi-sensor Module
Key Takeaways Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit
HSP: The new hardware accelerator that transforms an ultra-low-power STM32U3 into an AI machine
This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. ST is launching
NVIDIA, T-Mobile and Partners Integrate Physical AI Applications on AI-RAN-Ready Infrastructure
News Summary: T-Mobile pilots NVIDIA RTX PRO 6000 Blackwell Server Edition AI infrastructure to demonstrate physical AI applications at the
Lattice Joins NVIDIA Halos Ecosystem to Advance Safety for Physical AI with Holoscan Sensor Bridge
HILLSBORO, Ore. – Mar. 16, 2026 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced it has joined the NVIDIA Halos
News
A Smarter Vision for AI at ISC West 2026
Ambarella will be hosting an invitation-only exhibition at ISC West 2026, taking place March 25 – 27 at the Venetian Expo in Las Vegas, where we’ll demonstrate how edge AI is enabling the next generation of intelligent security and physical AI systems. This year’s theme, “A Smarter Vision for AI,” reflects an important shift underway
Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design
New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges SAN JOSE, Calif.— Today, Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI design solutions includes autonomous,
STMicroelectronics and Leopard Imaging Accelerate Robotics Vision with NVIDIA Jetson-ready Multi-sensor Module
Key Takeaways Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully supported by NVIDIA Isaac open robot development platform STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining
Market Analysis
From Warehouse to Wallet: New State of AI in Retail and CPG Survey Uncovers How AI Is Rewiring Supply Chains and Customer Experiences
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. The third annual NVIDIA State of AI in Retail and CPG survey shows why nine in 10 retailers will increase AI budgets in 2026, focusing on open-source models and software, as well as agentic and physical AI. Highlights
Which Service Robots Will Dominate the Market in the Next 10 Years?
Logistics robots and cleaning robots both benefit from high market demand and relatively low technical barriers, compared to kitchen and restaurant robots or underwater robots. Source: Service Robots 2026-2036: Technologies, Players and Markets This blog post was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. The service robotics industry has grown
CES 2026: Physical AI moves from concept to system architecture
This market analysis was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The world’s largest consumer electronics conference demonstrated the technical synergies between automotive and robotics. At CES 2026, there was a clear cross-sector message: Physical AI is the common language across the automotive, robotaxi
Blog
AI-Assisted Coding: The Next Step in Abstraction
I’ve been using AI-assisted coding for my work a lot recently, and I’ll admit, I wasn’t sure how I felt about it. Was I cheating? How do I know it’s right? Do I admit to using it? Looking at how software development has evolved over time helped answer those questions and led to a few
UCIe & Chiplets: A Practical Guide to Modular SoC Design
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The semiconductor industry is undergoing a paradigm shift. Traditional monolithic System-on-Chip (SoC) designs are giving way to modular architectures that leverage interoperable chiplets. At the heart of this evolution is Universal Chiplet Interconnect Express (UCIe). This open standard
HSP: The new hardware accelerator that transforms an ultra-low-power STM32U3 into an AI machine
This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. ST is launching today its hardware signal processor (HSP), a new hardware unit that the industry will experience in more and more of our upcoming STM32 microcontrollers, starting today with our new STM32U3B5/C5 devices featuring 2 MB of flash. In a
