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The Forest Listener: Where edge AI meets the wild
This blog post was originally published at Micron’s website. It is reprinted here with the permission of Micron. Let’s first discuss
HCLTech unveils VisionX 2.0, a next-gen multi-modal AI Edge Platform with NVIDIA
Noida, India, February 20, 2026 — HCLTech, a leading global technology company, today unveiled VisionX 2.0, an upgraded version of its
How Lenovo is scaling Level 4 autonomous robotaxis on Arm
This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. As L4 robotaxis shift
What Does a GPU Have to Do With Automotive Security?
This blog post was originally published at Imagination Technologies’ website. It is reprinted here with the permission of Imagination Technologies.
Ambarella to Showcase “The Ambarella Edge: From Agentic to Physical AI” at Embedded World 2026
Enabling developers to build, integrate, and deploy edge AI solutions at scale SANTA CLARA, Calif., — Ambarella, Inc. (NASDAQ: AMBA),
Vision Components unveils all-in-one VC EvoCam with MediaTek processor
Ettlingen, February 18, 2026 — Vision Components is presenting the VCSBC EvoCam for the first time at embedded world, a
Pushing the Limits of HDR with Ubicept
This blog post was originally published at Ubicept’s website. It is reprinted here with the permission of Ubicept. Executive summary
e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation
California & Chennai (February 17, 2026): e-con Systems, a global leader in embedded vision solutions, launches DepthVista Helix 3D CW iToF
A Practical Guide to Recall, Precision, and NDCG
This blog post was originally published at Rapidflare’s website. It is reprinted here with the permission of Rapidflare. Introduction Retrieval-Augmented Generation
News
STM32U3B5/U3C5: Bringing High-Performance DSP & Edge AI to Ultralow Power Designs
Built on the Arm® Cortex®‑M33 core, the STM32U3B5/U3C5 MCUs combine up to 2 Mbytes of dual‑bank flash memory with 640 Kbytes of RAM and are available in packages from 48 to 144 pins (UFQFPN, WLCSP, LQFP, and UFBGA). The lines introduce a hardware signal processor (HSP) to the STM32U3 portfolio, offloading complex DSP and edge‑AI workloads and
Airy3D and Lattice to Showcase Compact, Integrated Humanoid and Robotic 3D Vision Demo at Embedded World 2026
Montreal, Canada — March 4, 2026 — Airy3D today announced a joint demonstration with Lattice Semiconductor highlighting a compact and compute-efficient 3D vision solution for humanoids and advanced robotics, which will be on display at Embedded World 2026. The demo combines Airy3D’s DepthIQ™ technology with a compact, low-power Lattice CrossLink™-NX FPGA to enable high-quality depth
Upcoming Webinar on LLM-driven Driver Development
On March 19, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “Intelligent Driver Development with LLM Context Engineering ” From the event page: Developing even simple sensor drivers can consume valuable engineering time, requiring manual transcription of registers from datasheets into code—an error-prone and repetitive process. In this webinar, you’ll
Market Analysis
Semiconductor Industry 2025: Worldwide Dynamics and China’s Strategic Rise Unveiled
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The market research & strategy consulting company, Yole Group, delivers a dual perspective on global semiconductor dynamics and China’s fast-evolving industry landscape. Key Takeaways Global semiconductor device revenues are set to reach
Automotive Radar Industry: China’s Acceleration and the Next Wave of Sensing
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. With volumes rising and semiconductor innovation accelerating, Yole Group delivers a dual analysis on automotive radar technology, market dynamics, and chipset design. Key Takeaways 166 million radar modules shipped globally in 2024;
Humanoid Robots 2025: The Race to Useful Intelligence
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. AI, dexterity, and cost reduction are converging to bring humanoids from prototypes to real-world deployment. Key Takeaways The global humanoid robot market will grow to US$51 billion by 2035. Three adoption waves have
Blog
HTEC Research Reveals the Real AI Scaling Challenge: It’s Not the Technology
This blog post was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. AI has moved from ambition to action. Every organization is deploying it. Yet for most enterprises, the real challenge is only just beginning. Today, HTEC, a global AI‑first provider of software and hardware design and engineering services,
The Forest Listener: Where edge AI meets the wild
This blog post was originally published at Micron’s website. It is reprinted here with the permission of Micron. Let’s first discuss the power of enabling. Enabling a wide electronic ecosystem is essential for fostering innovation, scalability and resilience across industries. By supporting diverse hardware, software and connectivity standards, organizations can accelerate product development, reduce costs and
How Lenovo is scaling Level 4 autonomous robotaxis on Arm
This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. As L4 robotaxis shift from pilot to production, Arm offers the compute foundation needed to deliver end-to-end physical AI that scales across vehicle fleets. After years of autonomous driving pilots and controlled trials, the automotive industry is moving toward the production-scale deployment of Level 4 (L4) robotaxis. This marks
