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The New Metis PCIe with 4 Quad-Core AIPUs is Here
Big update from the Metis world: the epic new 4-core PCIe card is now available to order over on the

China’s Autonomous Trucks Now Log Over One Million Kilometers Daily
This blog post was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. To gain deeper

Public road demonstration tests of the latest autonomous driving EV bus, including nighttime operation, have begun at a hot spring resort
Following on from last year, Macnica, Inc., Fukuyama Consultant Co., Ltd., and KCS Corporation will collaborate with Ureshino City, Saga

How semiconductor equipment makers will drive the next $1 trillion wave
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI,

VC MIPI Cameras & ADLINK i.MX 8M Plus: Full driver support
Ettlingen, November 18, 2025 — For a medical imaging project, ADLINK wanted to integrate VC MIPI Cameras with its I-Pi

The Art of Robotics and The Growing Intellect of Autonomy
This blog post was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. ‘Robotics’ takes

IIJ and Sony to Agree on the Establishment of a Joint Venture to Promote Smart Agriculture
TOKYO and ATSUGI, Japan – November 7, 2025 – Internet Initiative Japan Inc. (IIJ) and Sony Semiconductor Solutions Corporation (Sony)

Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability
Architected to power AI workloads, Micron’s latest automotive solution, built with G9 NAND, equips the industry to create safer, smarter

STMicroelectronics introduces new battery-saving wireless microcontrollers optimized for remote controls
Nov 18, 2025 Geneva, Switzerland STM32WL3R MCUs add flexible features to low-power radio for superior user experiences in consumer electronics and
News

Jeff Bier to Speak at AI Everywhere 2025
On Thursday, December 11, Jeff Bier, Founder of the Edge AI and Vision Alliance will present at two sessions as part of EE Times’ AI Everywhere 2025. In the first, “Edge AI Everywhere: What Will It Take To Get There?” Jeff will highlight some inspiring success stories and explore the key challenges that need to

WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
Nov 26, 2025 Seoul, South Korea — Chips&Media is announcing that the next-generation customized NPU, WAVE-N v2, is ready for release, delivering higher computational power along with improved area and power efficiency. WAVE-N v2 is also designed to support a wider range of applications, such as object detection and segmentation, in addition to visual quality enhancement

Google Announces LiteRT Qualcomm AI Engine Direct Accelerator
Google has announced a new LiteRT Qualcomm AI Engine Direct Accelerator, giving Android and embedded developers a much more direct path to Qualcomm NPUs for on-device AI and vision workloads. Built on top of Qualcomm’s AI Engine Direct (“QNN”) SDK, the new accelerator replaces the older TensorFlow Lite QNN delegate and plugs directly into LiteRT,
Market Analysis

Greater China MEMS Industry On the Rise: Consumer Leads the Way
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its latest analysis, Yole Group examines how the Greater Chinese MEMS ecosystem is expanding across the consumer, automotive, industrial, medical, defense, and telecom markets, with continued growth driven by strong local

AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its new report, Automotive Computing and AI 2025, Yole Group analyzes the technological and market forces redefining vehicle intelligence, safety, and connectivity. The automotive industry is accelerating into a new era

Two-Phase Liquid Cooling: The Future of High-end GPUs
As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal design power (TDP) continuing to rise, the industry is approaching the limits of what single-phase cooling can handle. Two-phase D2C cooling is expected to enter large-scale deployment around 2027. IDTechEx has conducted extensive interviews across
Blog

Introducing Gimlet Labs: AI Infrastructure for the Agentic Era
This blog post was originally published at Gimlet Labs’ website. It is reprinted here with the permission of Gimlet Labs. We’re excited to finally share what we’ve been building at Gimlet Labs. Our mission is to make AI workloads 10X more efficient by expanding the pool of usable compute and improving how it’s orchestrated. Over the

How semiconductor equipment makers will drive the next $1 trillion wave
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI, mobility and cloud are the growth engines: They’re pushing chips toward a $1 trillion market by 2030 and forcing fabs to invest in sub-3nm nodes and advanced packaging Chips are bigger and more complex: Larger dies and

The Image Sensor Size and Pixel Size of a Camera is Critical to Image Quality
This blog post was originally published at Commonlands’ website. It is reprinted here with the permission of Commonlands. The sensor format size and pixel size of digital camera impacts nearly every performance attribute of a camera. The format size is a key element that contributes to system constraints across the low-light performance, dynamic range, size,
