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Andes Technology Further Expands Long-term Collaboration with Sequans Communications with AndesCore A25MP and N25F RISC-V CPU Core Licenses
Hsinchu Science Park, Taiwan – August 28th, 2025 – Andes Technology Corporation (TWSE: 6533) today celebrated ten years of collaboration with Sequans
Thermal Imaging and Sensing Industry Reaches $7 Billion Milestone, Driven by Chinese Market Growth
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of
Capgemini Leverages Qualcomm Dragonwing Portfolio to Enhance Railway Monitoring with Edge AI
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. AI device
Chips&Media’s ‘WAVE’ IP Successfully Enters the Global Mobile Market
2025-08-27 – WAVE, video multi-CODEC HW IP from Chips&Media, is being deployed to global mobile market this August. This remarkable
Why 4K HDR Imaging is Required in Front View Cameras?
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems.
Hot Topics at Hot Chips: Inference, Networking, AI Innovation at Every Scale — All Built on NVIDIA
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. At the
RealSense and NVIDIA Collaborate to Usher in the Age of Physical AI
Integration of RealSense AI depth cameras with NVIDIA Jetson Thor and simulation platforms sets a new industry standard, driving breakthroughs
NVIDIA Blackwell-powered Jetson Thor Now Available, Accelerating the Age of General Robotics
News Summary: NVIDIA Jetson AGX Thor developer kit and production modules, robotics computers designed for physical AI and robotics, are
e-con Systems Launches AI-powered Vision and Compute Solutions Accelerated by NVIDIA Jetson Thor
California & Chennai (August 25, 2025): e-con Systems®, a global leader in embedded vision solutions, announces support for the newly
News
Andes Technology Further Expands Long-term Collaboration with Sequans Communications with AndesCore A25MP and N25F RISC-V CPU Core Licenses
Hsinchu Science Park, Taiwan – August 28th, 2025 – Andes Technology Corporation (TWSE: 6533) today celebrated ten years of collaboration with Sequans Communications, with the latest licensing of Andes’ A25MP and N25F RISC-V CPU intellectual property (IP) cores for Sequans’ next-generation Internet of Things (IoT) chipsets featuring 4G and 5G eRedCap cellular network technologies. Sequans, a fabless
Chips&Media’s ‘WAVE’ IP Successfully Enters the Global Mobile Market
2025-08-27 – WAVE, video multi-CODEC HW IP from Chips&Media, is being deployed to global mobile market this August. This remarkable achievement is the result of the multi-year collaboration with one of leading mobile handset makers in Android industry, and WAVE is playing the irreplaceable key roles to deliver the best video capture and playback experience.
RealSense and NVIDIA Collaborate to Usher in the Age of Physical AI
Integration of RealSense AI depth cameras with NVIDIA Jetson Thor and simulation platforms sets a new industry standard, driving breakthroughs in humanoids, AMRs and the future of intelligent machines SAN FRANCISCO — Aug. 25, 2025 — RealSense, Inc., the global leader in robotic perception, today announced a strategic collaboration with NVIDIA to accelerate the adoption
Market Analysis
Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases the first edition of its Status of the Back-End Equipment Industry Report, offering a strategic outlook on the semiconductor market. KEY TAKEAWAYS 2025-2030 period: The global back-end equipment market
XR Tech Market Report
Woodside Capital Partners (WCP) is pleased to share its XR Tech Market Report, authored by senior bankers Alain Bismuth and Rudy Burger, and by analyst Alex Bonilla. Why we are interested in the XR Ecosystem Investors have been pouring billions of dollars into developing enabling technologies for augmented reality (AR) glasses aimed at the consumer market,
The Chiplet Consolidation Wave: How Strategic Acquisitions are Shaping the Future of Silicon
The Disaggregation of the Monolith: A New Paradigm Forged by AI’s Demands The semiconductor industry is navigating its most significant architectural shift in decades, a transition compelled by the relentless demands of Generative AI. The monolithic System-on-Chip (SoC), the reigning paradigm for half a century, is fracturing under the weight of exponentially growing AI models
Blog
GenAI Firsts: Redefining What’s Possible At the Edge
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. How our pioneering research and leading proof-of-concepts are paving the way for generative AI to scale What you should know: Qualcomm AI Research is pioneering research and inventing novel techniques to deliver efficient, high-performance GenAI solutions. Our
How to Support Multi-planar Format in Python V4L2 Applications on i.MX8M Plus
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. The default Python V4L2 library module contains critical details related to the V4L2 capture method. Learn how to implement basic definitions (missing the default library module) and capture images in the V4L2 multi-planar format. Python
Into the Omniverse: World Foundation Models Advance Autonomous Vehicle Simulation and Safety
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. AI and OpenUSD accelerate safe, scalable autonomous vehicle development by enabling simulation-first approaches. Editor’s note: This blog is a part of Into the Omniverse, a series focused on how developers, 3D practitioners and enterprises can transform their
