Technology Showcase

e-con Systems Demonstration of Its Advanced Camera Solutions

e-con Systems, Lattice Semiconductor, NVIDIA, Processors, Sensors and Cameras, Summit 2024, Tools, Videos /

Gomathi Sankar Paramasivan, Head of the Industrial Camera Business Unit at e-con Systems, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2024 Embedded Vision Summit. Specifically, Paramasivan demonstrates his company’s CAM85_CUOAGX and See3CAM50_CUG advanced camera solutions based on Lattice Semiconductor FPGAS. The showcased cameras are powered […]

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Flex Logix Demonstration of Enabling High Performance AI Inference At the Edge

Flex Logix, Processors, Summit 2024, Tools, Videos /

Jeremy Roberson, Technical Director and Software Architect for AI and Machine Learning at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Roberson demonstrates the power, performance, and area (PPA) capabilities of his company’s InferX IP by using it to run a state-of-the-art object

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Flex Logix Overview of SoC Adaptability and Algorithm Acceleration Using Embedded FPGA Technology

Flex Logix, Processors, Summit 2024, Tools, Videos /

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can bring adaptability and algorithm acceleration capabilities to SoCs. Building SoCs is becoming increasingly challenging. To create

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Flex Logix Overview of How to Enable Long-lasting Security For SoCs with Embedded FPGA Technology

Flex Logix, Processors, Summit 2024, Tools, Videos /

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can enable long-lasting security for SoCs. Considering current and future security landscapes and their associated challenges, providing

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DEEPX Demonstration of Its DX-M1 AIoT Booster

Algorithms & Models, DEEPX, Processors, Software, Summit 2024, Tools, Videos /

Taisik Won, the President of DEEPX USA, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Won demonstrates the company’s AIoT Booster, the DX-M1. The DX-M1 is DEEPX’s flagship AI chip, meticulously engineered for seamless integration into any AIoT application. This cutting-edge chip can simultaneously process

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DEEPX Demonstration of Its DX-V1 and DX-V3 AI Vision Processors

Algorithms & Models, DEEPX, Processors, Software, Summit 2024, Tools, Videos /

Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s DX-V1 and DX-V3 AI vision processors. The DX-V1 and DX-V3 are AI enabler chips for vision systems. The DX-V1 is a standalone edge AI chip that can

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DEEPX Demonstration of Its DX-H1 Green AI Computing Card

Algorithms & Models, DEEPX, Processors, Software, Summit 2024, Tools, Videos /

Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s latest innovation, the DX-H1 Green AI Computing Card. The DX-H1 is designed for eco-friendly data centers, delivering 10 times better power and cost efficiency than GPGPU solutions.

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Cadence Demonstration of a Large Vision Model for Generative AI on the Tensilica Vision P6 DSP

Algorithms & Models, Cadence, Object Identification, Object Tracking, Processors, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision P6 DSP for the latest generative AI (GenAI) applications. The Vision P6 DSP is a

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Cadence Demonstration of Time-of-Flight Decoding on the Tensilica Vision Q7 DSP

Algorithms & Models, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision Q7 DSP for Time-of-Flight (ToF) decoding. In this demonstration, the Tensilica Vision Q7 DSP integrated

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Cadence Demonstration of an Imaging Radar Applications on the Tensilica ConnX B10 DSP

Algorithms & Models, Automotive, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica ConnX B10 DSP for automotive imaging radar applications. The ConnX B10 DSP is a highly efficient,

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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