This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. In microscopic imaging, pixelation is one of the most commonly occurring artifacts, as the camera subjects are micro-level. Pixelation artifact occurs when the magnification surpasses an image sensor’s capabilities, by which indistinct pixel boundaries appear. […]
This blog post was originally published at TechNexion’s website. It is reprinted here with the permission of TechNexion. The retail landscape has changed significantly in recent years, propelled by technological advancements. The COVID-19 pandemic posed new challenges to traditional retail spaces, which resulted in the need for more innovative communication mediums. To offer customers memorable
Revolutionizing Offline Advertising With Smart Signages and Embedded Vision Read More +
Despite a challenging year in 2022, the autonomous and sensor technology market, the third-largest revenue stream in the global AI industry, has demonstrated its resilience. After a record high of $31.5 billion in 2021, the market size experienced a significant 45% drop. However, the industry is now on a trajectory of recovery and growth, with
Autonomous and Sensor Technology Industry to Double and Hit $55 Billion Value by 2030 Read More +
Semiconductor packaging can be incredibly boring. That said, advanced packaging is a key to every high-complexity semiconductor – both on and off the planet. Nvidia, AMD, and Intel have all utilized chiplets and advanced packages for their latest AI/ML accelerators and processors. Without 2.5D and 3D design and assembly techniques, these and many other essential
NIST Advanced Packaging Summit Read More +
This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. Innovation was the focus of our exhibition during this year’s CES, with the theme of Turbocharged AI. Over the course of four days, we held more than 300 customer meetings that showcased nearly 40 demonstrations and customer
Turbocharging AI During CES Read More +
Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. TAIPEI and SEOUL, South Korea, April 23, 2024 /PRNewswire/ — DEEPX, an on-device AI semiconductor company, is announcing plans to expand
This blog post was originally published at Ceva’s website. It is reprinted here with the permission of Ceva. In the realm of smart edge devices, signal processing and AI inferencing are intertwined. Sensing can require intense computation to filter out the most significant data for inferencing. Algorithms for simultaneous localization and mapping (SLAM), a type
Oriented FAST and Rotated BRIEF (ORB) Feature Detection Speeds Up Visual SLAM Read More +
This blog post was originally published by Onit. It is reprinted here with the permission of Onit. At Onit, we’re revolutionizing the efficiency and safety standards in warehouse environments through edge AI and computer vision. Leveraging our state-of-the-art Dragonfly and RTLS (real-time locating system) applications, we address the complex challenges inherent in chaotic and labor-intensive
Achieving a Zero-incident Vision In Your Warehouse with Dragonfly Read More +
With the new dart M with GigE interface, the leading international manufacturer of high-quality cameras and matching image processing hardware and software enables its customers to assemble board level cameras according to the modular principle. Ahrensburg, April 23, 2024 – Basler AG presents the dart M , a customizable, cost-efficient, board level camera with GigE
dart M: Basler Presents Modular, Board Level Camera Read More +
GRENOBLE, France, April 23, 2024 (GLOBE NEWSWIRE) — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, is pleased to announce a new technology and design collaboration with Airy3D (Montreal, Canada), a leading 3D vision solution provider. The first result of this partnership is the co-engineering of the recently announced
Airy3D and Teledyne e2v Collaboration Delivers More Affordable 3D Vision Solutions Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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