Brian Dipert

VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones

Providing architecture design, software-hardware co-development, and mass production support, and enhancing AI-powered imaging capabilities in smart devices Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing. VeriSilicon’s AI-ISP […]

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The SHD Group Releases New Edge AI Processor and Ecosystem Report

Now available for free download from Alliance Member company The SHD Group is their latest market report, Edge AI Market Analysis: Applications, Processors and Ecosystem Guide, developed in partnership with the Edge AI and Vision Alliance. The report provides a detailed exploration of the rapidly evolving edge AI landscape, covering critical insights on emerging applications,

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What Is Agentic AI? A Complete Guide to the Future of Autonomous Intelligence

This blog post was originally published at Geisel Software’s website. It is reprinted here with the permission of Geisel Software. What is agentic AI? It refers to intelligent systems that can autonomously set goals, make decisions, and execute tasks without constant human input. It marks a significant shift from reactive chatbots to proactive, mission-oriented AI

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“Why It’s Critical to Have an Integrated Development Methodology for Edge AI,” a Presentation from Lattice Semiconductor

Sreepada Hegade, Director of ML Systems and Software at Lattice Semiconductor, presents the “Why It’s Critical to Have an Integrated Development Methodology for Edge AI” tutorial at the May 2025 Embedded Vision Summit. The deployment of neural networks near sensors brings well-known advantages such as lower latency, privacy and reduced… “Why It’s Critical to Have

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Alliance Member Company Primary Contact List (Effective June 7, 2025)

The PDF linked to below contains the Alliance member company primary contact list, as of June 7, 2025. Alliance Member Company Primary Contact List (6/7/25) Alliance Member Company Primary Contact List (Effective June 7, 2025) Register or sign in to access this content. Registration is free and takes less than one minute. Click here to

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SplitQuant: Layer Splitting for Low-bit Neural Network Quantization for Edge AI Devices

This blog post was originally published at Nota AI’s website. It is reprinted here with the permission of Nota AI. This study proposes an AI model preprocessing method for improved quantization accuracies on edge AI devices which do not support advanced quantization methods due to their limitations. By splitting layers based on parameter clustering, the

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“Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor,” a Presentation from Cadence

Amol Borkar, Product Marketing Director at Cadence, presents the “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor” tutorial at the May 2025 Embedded Vision Summit. Artificial intelligence is rapidly integrating into every aspect of technology. While the neural processing unit (NPU) often receives the majority of the spotlight as… “Solving Tomorrow’s AI Problems Today

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Andes Technology Unveils AndesAIRE AnDLA I370: A Next-generation Deep Learning Accelerator for Edge and Endpoint AI

Hsinchu, Taiwan –June 05, 2025 – Andes Technology, a leading supplier of high-performance, low-power 32/64-bit RISC-V processor cores and AI acceleration solutions, proudly announces the launch of AndesAIRE™ AnDLA™ I370, its latest Deep Learning Accelerator (DLA), engineered to bring advanced neural network performance to cost-sensitive edge and endpoint AI applications. Building on the success of

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Advances in Time-of-flight and Event-based Vision

Special image sensors such as time-of-flight sensors and event-based sensors perform tasks that go beyond mere imaging: Speakers from Sony Semiconductor Europe and FRAMOS will report on the latest advances in this field. Munich – June 6th 2025 – Special image sensors such as time-of-flight sensors (ToF sensors) and event-based sensors have made remarkable technical

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Chips&Media Unveils WAVE-N: A Custom NPU for High-quality, High-resolution Imaging

2025-06-05 – Chips&Media unveiled WAVE-N that is a custom NPU designed to work with imaging application at high-quality and high-resolution for edge device market at Embedded Vision Summit 2025 in Santa Clara San Jose, California. Key notes Extreme efficiency, up to 90% of MAC utilization, for Modern CNN Computation Highly optimized for real-time video processing

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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