Brian Dipert

AIDM-336_FI

Exploring Neuromorphic Computing for AI: Why Spikes? (Part Two)

This blog post was originally published at Intel's website. It is reprinted here with the permission of Intel. In this blog series, we’re looking at one of Intel’s branches of AI research, neuromorphic computing. The goal of neuromorphic computing is to apply the fundamental properties of neural computation found in nature to breakthroughs in non-Von […]

Exploring Neuromorphic Computing for AI: Why Spikes? (Part Two) Read More +

“Separable Convolutions for Efficient Implementation of CNNs and Other Vision Algorithms,” a Presentation from Phiar

Chen-Ping Yu, Co-founder and CEO of Phiar, presents the “Separable Convolutions for Efficient Implementation of CNNs and Other Vision Algorithms” tutorial at the May 2019 Embedded Vision Summit. Separable convolutions are an important technique for implementing efficient convolutional neural networks (CNNs), made popular by MobileNet’s use of depthwise separable convolutions. But separable convolutions are not

“Separable Convolutions for Efficient Implementation of CNNs and Other Vision Algorithms,” a Presentation from Phiar Read More +

Intel-Xeon-Platinum-9200

Next-generation Intel Xeon Scalable Processors to Deliver Breakthrough Platform Performance with Up to 56 Processor Cores

What’s New: Intel today announced its next-generation Intel® Xeon® Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in standard socketed  Intel Xeon Scalable processor offerings with availability starting in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper

Next-generation Intel Xeon Scalable Processors to Deliver Breakthrough Platform Performance with Up to 56 Processor Cores Read More +

10thGen_Chip-on-Motherboard-600x338

Intel Launches First 10th Gen Intel Core Processors: Redefining the Next Era of Laptop Experiences

What’s New: Today, Intel officially launched 11 new, highly integrated 10th Gen Intel® Core™ processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel® Iris® Plus graphics for stunning entertainment and enable the best connectivity1 with Intel® Wi-Fi 6 (Gig+) and Thunderbolt™ 3. Systems are expected from

Intel Launches First 10th Gen Intel Core Processors: Redefining the Next Era of Laptop Experiences Read More +

1

Xilinx Expands Alveo Portfolio with Industry’s First Adaptable Compute, Network and Storage Accelerator Card Built for Any Server, Any Cloud

First low-profile PCIe Gen 4 card delivers dramatic improvements in throughput, latency and power efficiency for critical data center workloads SAN JOSE, Calif., Aug. 6, 2019 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today expanded its Alveo data center accelerator card portfolio with the launch of the Alveo™ U50. The

Xilinx Expands Alveo Portfolio with Industry’s First Adaptable Compute, Network and Storage Accelerator Card Built for Any Server, Any Cloud Read More +

Ceva_Website_Product_Page_Leading_Image_Template_2019_Immervision_V3

CEVA and Immervision Enter into Strategic Partnership for Advanced Image Enhancement Technologies

Partnership includes $10 million technology investment from CEVA, securing exclusive licensing rights to Immervision's patented image processing and sensor fusion software portfolio for wide-angle cameras, which are broadly used in surveillance, smartphone, automotive, robotics and consumer applications MOUNTAIN VIEW, Calif. and MONTREAL, Aug. 6, 2019 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of

CEVA and Immervision Enter into Strategic Partnership for Advanced Image Enhancement Technologies Read More +

BAS1908_PR_Launch_Embedded_Vision_NXP__rgb

Basler Embedded Vision Solutions Now Also Available for NXP’s i.MX 8 Applications Processor Series – First Products Launched

Two new dart camera modules and Add-on Camera Kits provide an ideal starting point for adding image processing to NXP’s i.MX 8 applications processors. Ahrensburg, 6 August, 2019 – Camera manufacturer Basler is expanding its embedded vision solution portfolio with products that are compatible with NXP's i.MX 8 applications processors. The combination of Basler’s camera

Basler Embedded Vision Solutions Now Also Available for NXP’s i.MX 8 Applications Processor Series – First Products Launched Read More +

“Deploying Visual SLAM in Low-power Devices,” a Presentation from CEVA

Ben Weiss, Customer Solutions Engineer in the CSG Group at CEVA, presents the “Deploying Visual SLAM in Low-power Devices” tutorial at the May 2019 Embedded Vision Summit. Simultaneous localization and mapping (SLAM) technology has been evolving for quite some time, including visual SLAM, which relies primarily on image data. But implementing fast, accurate visual SLAM

“Deploying Visual SLAM in Low-power Devices,” a Presentation from CEVA Read More +

Intel-FPGA-PAC-D5005-1-1

Intel Expands Workload Acceleration with Hewlett Packard Enterprise in New Programmable Acceleration Card

What’s New: Intel announced today it is working with Hewlett Packard Enterprise* (HPE) to provide increased workload acceleration capacity for the HPE ProLiant DL380 Gen10 server. This will address computing-intensive markets – like streaming analytics, media transcoding, financial technology and network security – with the new high-performance Intel® FPGA Programmable Acceleration Card (Intel® FPGA PAC) D5005. The Intel

Intel Expands Workload Acceleration with Hewlett Packard Enterprise in New Programmable Acceleration Card Read More +

Intel-Lenovo-MOU_Signing_1

Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership

Collaboration Will Build on Long-Standing Partnership to Further Accelerate Scientific and Business Innovation and Discovery SANTA CLARA, Calif., Aug. 5, 2019 — Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most

Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top