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Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design

This blog post was originally published at Synopsys’s website. It is reprinted here with the permission of Synopsys. With the semiconductor industry shifting from monolithic chip designs to multi-die architectures — which leverage chiplets for improved flexibility, scalability, and time to market — engineering teams are facing new hurdles and complexities. Beyond power, performance, and area (PPA), they […]

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2026: The Year Intelligence Gets Physical

This article was originally published at Analog Devices’ website. It is reprinted here with the permission of Analog Devices. Artificial intelligence is entering a new phase where models interpret contextual data whilst interacting with the physical world in real time. At Analog Devices, Inc. (ADI), we call this Physical Intelligence: intelligent systems that can perceive, reason

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Why Night HDR Is More Challenging Than Daytime HDR

This blog post was originally published at Visidon’s website. It is reprinted here with the permission of Visidon. High Dynamic Range (HDR) imaging has become a standard feature in modern cameras, from smartphones to automotive and surveillance systems. While daytime HDR is already a complex task, nighttime HDR introduces a completely different level of difficulty. The same

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Restar Framos Demo: Sony IMX927 105 MP Global Shutter Image Sensor

  Prashant Mehta from Restar Framos presents the Sony IMX927, a high-performance 105-megapixel global shutter image sensor. The demonstration highlights the sensor’s extreme resolution and speed, showing its ability to capture live, detailed images of a watch’s internal mechanics. By displaying a 1:1 pixel representation on a monitor, the demo illustrates how the sensor provides

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UCIe & Chiplets: A Practical Guide to Modular SoC Design

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The semiconductor industry is undergoing a paradigm shift. Traditional monolithic System-on-Chip (SoC) designs are giving way to modular architectures that leverage interoperable chiplets. At the heart of this evolution is Universal Chiplet Interconnect Express (UCIe). This open standard

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Edge AI and Vision Insights: March 18, 2026

  LETTER FROM THE EDITOR Dear Colleague, This issue highlights two important threads shaping the future of edge AI. First, we explore vision for autonomous intelligence, with presentations on geometric depth estimation, vision-based aircraft functions and vision LLMs in multi-agent systems—together showing how visual perception is becoming a foundation for autonomy, reasoning and coordinated action.

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From Warehouse to Wallet: New State of AI in Retail and CPG Survey Uncovers How AI Is Rewiring Supply Chains and Customer Experiences

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. The third annual NVIDIA State of AI in Retail and CPG survey shows why nine in 10 retailers will increase AI budgets in 2026, focusing on open-source models and software, as well as agentic and physical AI. Highlights

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Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​

New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges   SAN JOSE, Calif.— Today, Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI design solutions includes autonomous,

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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