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AMD Unveils Vision for an Open AI Ecosystem, Detailing New Silicon, Software and Systems at Advancing AI 2025

Only AMD powers the full spectrum of AI, bringing together leadership GPUs, CPUs, networking and open software to deliver unmatched flexibility and performance Meta, OpenAI, xAI, Oracle, Microsoft, Cohere, HUMAIN, Red Hat, Astera Labs and Marvell discussed how they are partnering with AMD for AI solutions SANTA CLARA, Calif., June 12, 2025 (GLOBE NEWSWIRE) — […]

AMD Unveils Vision for an Open AI Ecosystem, Detailing New Silicon, Software and Systems at Advancing AI 2025 Read More +

Upcoming Webinar Explores SLAM Optimization for Autonomous Robots

On July 10, 2025 at 8:00 am PT (11:00 am ET), Alliance Member company eInfochips will deliver the free webinar “GPU-Accelerated Real-Time SLAM Optimization for Autonomous Robots.” From the event page: Optimizing execution time for long-term and large-scale SLAM algorithms is essential for real-time deployments on edge compute platforms. Higher throughput of SLAM output provides

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FRAMOS Grants Early Access to Sony’s High-speed Global Shutter Sensors with Up to 660 FPS

Munich – June 11th 2025 – The industry is on the verge of a major breakthrough: Sony’s new high-speed global shutter sensors IMX925, IMX926, IMX935, and IMX936 will make applications such as automated inspection and volumetric imaging much more accurate and efficient. FRAMOS now offers access to these first engineering samples of Sony’s new high-speed

FRAMOS Grants Early Access to Sony’s High-speed Global Shutter Sensors with Up to 660 FPS Read More +

VeriSilicon’s Ultra-low Energy NPU Provides Over 40 TOPS for On-device LLM Inference in Mobile Applications

The energy-efficient architecture scales across AI-enabled devices, including AI phones and AI PCs Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) today announced that its ultra-low energy and high-performance Neural Network Processing Unit (NPU) IP now supports on-device inference of large language models (LLMs) with AI computing performance scaling beyond 40 TOPS. This energy-efficient NPU architecture is

VeriSilicon’s Ultra-low Energy NPU Provides Over 40 TOPS for On-device LLM Inference in Mobile Applications Read More +

VeriSilicon’s Scalable High-performance GPGPU-AI Computing IPs Empower Automotive and Edge Server AI Solutions

Provide AI acceleration with high computing density, multi-chip scaling, and 3D-stacked memory integration Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) today announced the latest advancements in its high-performance and scalable GPGPU-AI computing IPs, which are now empowering next-generation automotive electronics and edge server applications. Combining programmable parallel computing with a dedicated Artificial Intelligence (AI) accelerator, these

VeriSilicon’s Scalable High-performance GPGPU-AI Computing IPs Empower Automotive and Edge Server AI Solutions Read More +

VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones

Providing architecture design, software-hardware co-development, and mass production support, and enhancing AI-powered imaging capabilities in smart devices Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing. VeriSilicon’s AI-ISP

VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones Read More +

Andes Technology Unveils AndesAIRE AnDLA I370: A Next-generation Deep Learning Accelerator for Edge and Endpoint AI

Hsinchu, Taiwan –June 05, 2025 – Andes Technology, a leading supplier of high-performance, low-power 32/64-bit RISC-V processor cores and AI acceleration solutions, proudly announces the launch of AndesAIRE™ AnDLA™ I370, its latest Deep Learning Accelerator (DLA), engineered to bring advanced neural network performance to cost-sensitive edge and endpoint AI applications. Building on the success of

Andes Technology Unveils AndesAIRE AnDLA I370: A Next-generation Deep Learning Accelerator for Edge and Endpoint AI Read More +

Advances in Time-of-flight and Event-based Vision

Special image sensors such as time-of-flight sensors and event-based sensors perform tasks that go beyond mere imaging: Speakers from Sony Semiconductor Europe and FRAMOS will report on the latest advances in this field. Munich – June 6th 2025 – Special image sensors such as time-of-flight sensors (ToF sensors) and event-based sensors have made remarkable technical

Advances in Time-of-flight and Event-based Vision Read More +

Chips&Media Unveils WAVE-N: A Custom NPU for High-quality, High-resolution Imaging

2025-06-05 – Chips&Media unveiled WAVE-N that is a custom NPU designed to work with imaging application at high-quality and high-resolution for edge device market at Embedded Vision Summit 2025 in Santa Clara San Jose, California. Key notes Extreme efficiency, up to 90% of MAC utilization, for Modern CNN Computation Highly optimized for real-time video processing

Chips&Media Unveils WAVE-N: A Custom NPU for High-quality, High-resolution Imaging Read More +

AMD Acquires Brium to Strengthen Open AI Software Ecosystem

News Highlights Brium’s world-class compiler and AI software experience will strengthen AMD’s ability to deliver highly optimized AI solutions across the entire stack Will reduce developer dependencies on specific hardware configurations and enable accelerated out of the box AI performance Brium’s domain-specific expertise will expand AMD’s market reach across industries such as healthcare, life sciences,

AMD Acquires Brium to Strengthen Open AI Software Ecosystem Read More +

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