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Introducing the Arducam ezBOX Series: Simplifying Embedded Vision Solutions

Arducam is excited to present the new ezBOX series, a family of embedded vision products designed to streamline your development process and accelerate your time to market. Whether you’re tackling dynamic scenes, high-resolution imaging, or high frame rate capture, the ezBOX series offers tailored solutions to meet the diverse needs of various projects. Why Choose […]

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Chips&Media Launches Cframe60: Lossless and Lossy Frame Compression Standalone Hardware IP

2025-08-21 – Chips&Media is announcing that CFrame60 will be delivered to market as an independent product; new HW core based on compression/decompression technology to contribute performance, DRAM bandwidth, and power efficiency within various multimedia applications. Key notes: Significant DRAM bandwidth reduction between IP modules within imaging application Lossless as well as lossy, with no visual quality

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Sony Experts Present at AI-Vision Event ImagingNext

Munich, Bavaria, Germany – August 20th, 2025 – FRAMOS is stepping up its game once again. The leading AI imaging event, ImagingNext, has added more high-profile speakers to its lineup: Imaging experts from SONY will be presenting the latest developments in their field at the smartvillage in Munich-Bogenhausen from September 18 to 19. With three

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Upcoming Webinar Explores Ethernet Cameras for AI-driven Vision Systems

On August 26, 2025 at 11:00 am CEST and August 27 at 9:30 am PT  (12:30 pm ET), Alliance Member company e-con Systems will deliver two sessions of the free webinar “Unleashing the Power of Ethernet Cameras in New-Age AI Applications.” From the event page: Join our industry expert to explore how Ethernet cameras are

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Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers

News Highlights: Arm neural technology is an industry first, adding dedicated neural accelerators to Arm GPUs, bringing PC-quality, AI powered graphics to mobile for the first time – and laying the foundation for future on-device AI innovation Neural Super Sampling is the first application, an AI-driven graphics upscaler that enables potential for 2x resolution uplift

Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers Read More +

SiMa.ai Next-Gen Platform for Physical AI in Production

Modalix in Production, Now Shipping SoM Pin-Compatible with leading GPU SoM, Dev Kits, and LLiMa for Seamless LLM-to-Modalix Integration SAN JOSE, Calif., August 12, 2025 — SiMa.ai, a pioneer in Physical AI solutions, today is making three significant product announcements to accelerate the scaling of Physical AI. Production and immediate availability of its next-generation Physical

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BrainChip Launches Akida Cloud for Instant Access to Latest Akida Neuromorphic Technology

Aligns with BrainChip’s long-term strategy to accelerate customer access to its innovations and reduce development cycles LAGUNA HILLS, Calif.–(BUSINESS WIRE)–BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based neuromorphic AI, today announced launch of the BrainChip Developer Akida Cloud, a new cloud-based access point

BrainChip Launches Akida Cloud for Instant Access to Latest Akida Neuromorphic Technology Read More +

SiMa.ai Raises $85M to Scale Physical AI, Bringing Total Funding to $355M

Maverick Capital Led the Oversubscribed Round with StepStone Group Joining as a New Investor SAN JOSE, Calif., August 1, 2025 – SiMa.ai, a pioneer in delivering purpose-built hardware and software solutions for Physical AI, today announced it has raised $85 million in an oversubscribed round, bringing total capital raised to $355 million. The latest round

SiMa.ai Raises $85M to Scale Physical AI, Bringing Total Funding to $355M Read More +

SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation

Transforming ADAS and In-Vehicle Infotainment Breakthroughs with Innovative ML IP, Chiplets, and System-on-Chip Reference Architectures SAN JOSE, Calif., July 30, 2025 /PRNewswire/ — SiMa.ai, a pioneer in ultra-efficient machine learning system-on-chip (MLSoC) platform, today announced the next phase of their strategic collaboration with Synopsys, the leading provider of engineering solutions from silicon to systems, to

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SiMa.ai and Macnica TecStar Company Announce Strategic Distribution Agreement to Accelerate Physical AI Adoption in Japan

SAN JOSE, Calif. and YOKOHAMA, Japan, July 29, 2025 /PRNewswire/ — SiMa.ai, the machine learning company delivering the industry’s first purpose-built software-centric MLSoC™ platform for the embedded edge, today announced a distribution partnership with Macnica, Inc. TecStar Company, one of Japan’s leading technology solutions providers. The partnership will accelerate adoption of SiMa.ai’s high-performance, low-power physical

SiMa.ai and Macnica TecStar Company Announce Strategic Distribution Agreement to Accelerate Physical AI Adoption in Japan Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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PO Box #4446
Walnut Creek, CA 94596

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