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VeriSilicon NPU IP is Shipped In Over 100 Million AI-enabled Chips Worldwide

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Enabling efficient execution of applications ranging from AI voice, AI vision, AI pixel to AIGC on embedded devices Shanghai, China, February 29, 2024–VeriSilicon (688521.SH) VeriSilicon (688521.SH) today announced that it has reached a milestone achievement with its Neural Network Processor (NPU) IP integrated into over 100 million AI-enabled chips across 10 major application sectors worldwide, […]

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Intel Launches Altera, Its New Standalone FPGA Company

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Altera prioritizes customers with end-to-end FPGAs, accessible AI, software and supply resilience. What’s New: Today, Intel announced the official launch of Altera, its new standalone FPGA company. During the FPGA Vision Webcast, Chief Executive Officer Sandra Rivera and Chief Operating Officer Shannon Poulin unveiled their strategy to secure leadership across a $55 billion-plus market opportunity;

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Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications

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Highlights: Single DSPs for embedded vision, radar, lidar and AI processing boost performance while providing significant area, power and cost savings New radar accelerator provides a highly programmable hardware solution for offloading 4D imaging radar workloads, increasing performance Designed for sensor fusion processing in multi-sensor automotive, drone, robotics and autonomous vehicle system designs SAN JOSE,

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Vision Components: New Cameras and Vision Systems for Intralogistics

Industrial Vision (Computer Vision), News, Sensors and Cameras, Vision Components /

Ettlingen, February 28, 2024 – At LogiMAT trade fair (Messe Stuttgart, March 19 – 21, 2024), Vision Components will present the world’s first industrial-grade MIPI camera module with the new IMX900 image sensor from Sony. The VC MIPI IMX900 global shutter camera offers 3.2 megapixel resolution and high light sensitivity up to the infrared range.

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Cornell Tech Joins BrainChip University AI Accelerator Program

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Laguna Hills, Calif. – February 27, 2024 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that Cornell Tech has joined the BrainChip University AI Accelerator Program. Cornell Tech is an applied sciences and engineering campus in New

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ProHawk Gains NVIDIA Preferred Partner Status for its AI-enabled Computer Vision Solutions

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ProHawk solutions validated in NVIDIA’s labs over the past 18 months, and now embedded with NVIDIA Metropolis, Holoscan, and Jetson platforms, with more integrations coming. LAKE MARY, FLORIDA, February 27, 2024 — ProHawk Technology Group (ProHawk AI), a leading AI-enabled computer vision company, today announced that it has been selected as a Preferred partner within

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Intel Core Ultra Extends AI PCs to the Enterprise with New Intel vPro Platform

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New vPro platform delivers unmatched productivity, security, manageability and stability for businesses of all sizes. What’s New: Today at MWC 2024, Intel extends the benefits of the AI PC to commercial customers with the new Intel vPro® platform. The enhanced features of Intel® Core™ Ultra processors with available built-in Intel® Arc™ GPUs, and Intel® Core™

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Intel Announces New Edge Platform for Scaling AI Applications

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The edge-native software platform simplifies development, deployment and management of edge AI applications. What’s New: At MWC 2024, Intel announced its new Edge Platform, a modular, open software platform enabling enterprises to develop, deploy, run, secure, and manage edge and AI applications at scale with cloud-like simplicity. Together, these capabilities will accelerate time-to-scale deployment for

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Micron Commences Volume Production of Industry-leading HBM3E Solution to Accelerate the Growth of AI

Memory, Micron Technology, News, NVIDIA, Processors /

Micron HBM3E helps reduce data center operating costs by consuming about 30% less power than competing HBM3E offerings BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H

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Qualcomm Continues to Bring the Generative AI Revolution to Devices and Empowers Developers with Qualcomm AI Hub

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Highlights: Qualcomm now enables at-scale on-device AI commercialization across next-generation PCs, smartphones, software-defined vehicles, XR devices, IoT and more – bringing intelligent computing everywhere. Qualcomm AI Hub offers 75+ optimized AI models for Snapdragon and Qualcomm platforms, reducing time-to-market for developers and unlocking the benefits of on-device AI for their apps. These models are also

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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