Highlights: Neo NPUs efficiently offload from any host processor and scale from 8 GOPS to 80 TOPS in a single core, extending to hundreds of TOPS for multicore AI IP delivers industry-leading AI performance and energy efficiency for optimal PPA and cost points Targets a broad range of on-device and edge applications, including intelligent sensors, […]
Suhas Mitra, Director Product Management and Marketing at Cadence, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Mitra demonstrates Cadence’s Tensilica AI accelerator portfolio, specifically showcasing the company’s Tensilica NNA (Neural Network Accelerator) 110 IP. These IPs can significantly improve the performance of edge and
Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Borkar demonstrates an automotive in-vehicle infotainment system, implemented on a customer’s platform and featuring the Tensilica Vision DSP. Infotainment is an important
Cadence Demonstration of In-vehicle Infotainment Read More +
David Bell, Product Marketing Director for Tensilica AI IP products at Cadence, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Bell demonstrates the vision and AI capabilities of Tensilica DSPs for industrial products, in the process also answering the question of whether a tomato is
Amol Borkar, Product Marketing Director at Cadence, presents the “Tensilica Processor Cores Enable Sensor Fusion for Robust Perception” tutorial at the May 2023 Embedded Vision Summit. Until recently, the majority of sensor-based AI processing used vision and speech inputs. Recently, we have begun to see radar, LiDAR, event-based image sensors and other types of sensors
New ecosystem members Kudan and Visionary.ai enable fast deployment of high-performance, energy-efficient SLAM and AI ISP-based solutions April 11, 2023–SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has welcomed Kudan and Visionary.ai to the Tensilica software partner ecosystem, bringing industry-leading simultaneous localization and mapping (SLAM) and AI image signal processor
Suhas Mitra, Director of Product Management and Marketing at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Mitra demonstrates the Cadence Tensilica AI accelerator portfolio. Mitra demonstrates how the Tensilica Neural Network Accelerator (NNA) 110 IP can significantly improve the performance of edge
Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Borkar demonstrates Xvisio’s highly accurate 3D camera position and tracking using Visual SLAM (VSLAM), implemented on a customer’s platform and featuring the
Cadence Demonstration of Real-time Visual SLAM for Embedded Devices Read More +
Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Borkar demonstrates Tensilica’s latest processor from the Vision DSP family, the Vision P1 DSP, running on Cadence’s own FPGA platform. The Vision
Amol Borkar, Director of Product Management and Marketing for Tensilica Vision and AI DSPs at Cadence, presents the “Designing the Next Ultra-Low-Power Always-On Solution” tutorial at the May 2022 Embedded Vision Summit. Increasingly, users expect their systems to be ready to respond at any time—for example, using a voice command to launch a music playlist.
“Designing the Next Ultra-Low-Power Always-On Solution,” a Presentation from Cadence Read More +
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