PROVIDER

Edge AI and Vision Insights: June 19, 2024

EDGE AI DEVELOPMENT TRENDS AND CHALLENGES Silicon Slip-Ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!) For over 30 years, BDTI has provided engineering, evaluation and advisory services to processor suppliers and companies that use processors in products. The company has seen a lot, including some classic mistakes. (You know, […]

Edge AI and Vision Insights: June 19, 2024 Read More +

Understanding Spatial Noise and Its Reduction Methods Using Convolution

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Convolution is a mathematical operation used in image processing to apply filters to images. These filters are used for spatial noise reduction in images with variations or irregularities in the pixel values that are unrelated

Understanding Spatial Noise and Its Reduction Methods Using Convolution Read More +

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America

Hussein Osman, Segment Marketing Director at Lattice Semiconductor, and Richard Crisp, Vice President and Chief Scientist at Etron Technology America, co-presents the “Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs” tutorial at the May 2024 Embedded Vision Summit. Attaining the lowest power, size and cost for a

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America Read More +

Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements 18 Jun 2024 – At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification

Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024 Read More +

TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. What is a token? Why is batch size important? And how do they help determine how fast AI computes? Editor’s note: This post is part of the AI Decoded series, which demystifies AI by making the technology

TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations Read More +

“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, presents the “Maximize Your AI Compatibility with Flexible Pre- and Post-processing” tutorial at the May 2024 Embedded Vision Summit. At a time when IC fabrication costs are skyrocketing and applications have increased in complexity, it is important to minimize design risks and maximize

“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix Read More +

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence

Amol Borkar, Product Marketing Director at Cadence, presents the “Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors” tutorial at the May 2024 Embedded Vision Summit. From ADAS to autonomous vehicles to smartphones, the number and variety of sensors used in edge devices is increasing: radar, LiDAR, time-of-flight sensors and multiple cameras are

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence Read More +

Automotive LiDAR Deployment Ramps Up in 2024

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. More new car models with LiDAR were released in 2023 than the previous four years. Chinese players lead the game. Supplier market share in the dynamic automotive LiDAR space is changing as

Automotive LiDAR Deployment Ramps Up in 2024 Read More +

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip

Chris Jones, Director of Product Management at BrainChip, presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit. The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent a novel and highly efficient

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip Read More +

Butterfly Network’s iQ3 CMUT Sensor: The Ins and Outs

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Innovative 9656 Transmitter CMUT MEMS die in Butterfly’s iQ3 handheld point-of-care ultrasound system. OUTLINE The iQ3, Butterfly Network’s third-generation CMUT sensor, received FDA clearance in January 2024 and follows the sale of

Butterfly Network’s iQ3 CMUT Sensor: The Ins and Outs Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top