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An Analysis of Consumer MEMS Microphones

This market research report was originally published at Yole Développement’s website. It is reprinted here with the permission of Yole Développement. Yole SystemPlus analyzes and compares the technology choices made by Knowles, Goermicro, Omron, MEMSensing, Zilltek, Novosense, BSE, TDK-Invensense, and Hosiden. OUTLINE The consumer MEMS microphone market is expected to reach almost US$2.3 billion in […]

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Object Detection on the Edge: Making the Right Choice

This blog post was originally published at Hailo’s website. It is reprinted here with the permission of Hailo. When choosing an object detection network for edge devices, there are many factors you should consider: compute power, memory resources, and many more. Which ones? This blog post outlines everything you need to know when choosing an

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Hailo Demonstration of Its New Hailo-8 Century Evaluation Platform

Avi Baum, Chief Technology Officer at Hailo, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Baum demonstrates the Falcon, a multi-stream video analytics demo based on the company’s new Hailo-8 Century high-performance and cost-effective PCIe AI acceleration card that delivers up to 156 TOPS.

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Cadence Demonstration of Powering Next-gen On-device Edge AI Using a Turnkey AI Accelerator Solution

Suhas Mitra, Director of Product Management and Marketing at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Mitra demonstrates the Cadence Tensilica AI accelerator portfolio. Mitra demonstrates how the Tensilica Neural Network Accelerator (NNA) 110 IP can significantly improve the performance of edge

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Edge AI and Vision Insights: October 12, 2022 Edition

LETTER FROM THE EDITOR Dear Colleague, On Tuesday, December 13 at 9 am PT, Deci will deliver the free webinar “How to Successfully Deploy Deep Learning Models on Edge Devices” in partnership with the Edge AI and Vision Alliance. The introduction of powerful processors, memories and other devices, along with robust connectivity to the cloud,

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InferSens to Introduce Ultra-Low-Power Edge DL Sensor Solution with Syntiant Technology

Battery-Powered Sensor with Embedded Syntiant NDP120 Neural Decision Processor to Enable Highly Accurate On-Device Processing for Commercial and Industrial Applications. InferSens CTO Jonathan Peace to Present First Application for Legionella Water System Monitoring at the tinyML EMEA Innovation Forum 2022 in Cyprus Cambridge, U.K., and Irvine, Calif., October 11 – InferSens today announced the first

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Everything Announced at Imagine 2022

This blog post was originally published at Edge Impulse’s website. It is reprinted here with the permission of Edge Impulse. All great events include exciting announcements, and through a full first day of incredible speaker presentations and demos, followed by two days of virtual workshops and tech talks, this year’s Imagine gathering brought bountiful news

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MediaTek’s New Dimensity 1080 Brings a Performance Boost to 5G Smartphones

New 5G chipset packs impressive imaging features with 200MP camera support HSINCHU, Taiwan – October 11, 2022 – MediaTek today unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the

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Cadence Demonstration of Real-time Visual SLAM for Embedded Devices

Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Borkar demonstrates Xvisio’s highly accurate 3D camera position and tracking using Visual SLAM (VSLAM), implemented on a customer’s platform and featuring the

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Cadence Demonstration of Ultra-low Power Always-on Applications on the Tensilica Vision P1 DSP

Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Borkar demonstrates Tensilica’s latest processor from the Vision DSP family, the Vision P1 DSP, running on Cadence’s own FPGA platform. The Vision

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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