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NEXTY Electronics (Toyota Tsusho Group) to Distribute Blaize AI Edge Computing Products in Japan

Serve edge AI markets across automotive and industrial edge computing El Dorado Hills, CA — October 14, 2021— Blaize®, the AI computing innovator revolutionizing automotive and edge computing, and NEXTY Electronics Corp., a core member of the Toyota Tsusho Group, today announced NEXTY is now a Blaize distribution partner serving automotive and industrial markets for […]

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Is That Your Standby Power?

This blog post was originally published at Syntiant’s website. It is reprinted here with the permission of Syntiant. Syntiant recently submitted its NDP120 into the MLPerf Tiny category for keyword spotting and our internal measurements pegged our solution at around 60 uJ/inferences at a 6ms latency. As a comparison, the one other published MCU-based benchmark

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“Computer Vision for the Built Environment,” a Presentation from Nomad Go

David Greschler, CEO and co-founder of Nomad Go, presents the “Computer Vision for the Built Environment” tutorial at the May 2021 Embedded Vision Summit. Facilities and operations managers of buildings, college campuses, retail and foodservice establishments all struggle to answer one fundamental question: “What are people doing in our spaces?” Computer vision – specifically edge

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“Secure Hardware Architecture for Embedded Vision,” a Presentation from NeuroBinder

Jonathan Cefalu, CEO and founder of NeuroBinder, presents the “Secure Hardware Architecture for Embedded Vision” tutorial at the May 2021 Embedded Vision Summit. Security is a problem for every IoT system, but due to privacy concerns, security is particularly worrisome for embedded vision systems. In this talk, Cefalu covers how to design your embedded device

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Camera Module Industry: Resilience and Innovations as Key Strengths

This market research report was originally published at Yole Développement’s website. It is reprinted here with the permission of Yole Développement. “Many cameras” approach in mobile phones and automotive continues to drive the industry forward. OUTLINE: Market figures: The COVID-19 pandemic combined with US-China trade tensions have marginally affected the continued growth in 2020. The

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Axelera AI Announces New CTO and Scientific Advisors

Experts Hail from IBM, Google, ETH Zurich, and Other Leading Organisations EINDHOVEN, October 13, 2021 – Today, semiconductor start-up Axelera AI announced that Prof. Dr. Evangelos Eleftheriou has joined its executive team as Chief Technology Officer. Axelera AI also announced two new appointments to its cohort of scientific advisors, Prof. Dr. Marian Verhelst and Prof.

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Blechexpo Trade Fair: Plug-and-play Solution for Optical Angle Measurement in Sheet Metal Bending

For angle measurement and inline control of sheet metal bending processes, Vision Components supplies industrial-grade ready-to-use solutions, customer-specific systems, and OEM kits October 13, 2021 – Vision Components will present its flexible modular system for optical angle measurement in sheet metal bending applications at its Blechexpo booth #5-222. The tested and proven laser sensors can

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“Developing Edge Computer Vision Solutions for Applications with Extreme Limitations on Real-World Testing,” a Presentation from Nedra

Alexander Belugin, Computer Vision Product Manager at Nedra, presents the “Developing Edge Computer Vision Solutions for Applications with Extreme Limitations on Real-World Testing” tutorial at the May 2021 Embedded Vision Summit. Deploying computer vision-based solutions in very remote locations (such as those often found in mining and oil drilling) introduces unique challenges. For example, it

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Allegro DVT and Beamr Announce the World’s First Content-Adaptive Silicon IP Video Encoder

The integrated solution, which combines Beamr’s CABR silicon IP with Allegro’s market-leading video encoder IP, cuts AV1 bitrates by up to 40% with no quality loss. October 12, 2021 – Allegro DVT, the leading provider of video processing silicon IPs, and Beamr, the leading developer of content-adaptive video encoding technologies, announced an integrated solution that

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MicroSys Partners with Leading AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform

MicroSys miriac® embedded modules and platforms combined with Hailo-8™ AI acceleration modules offer a high-performance, scalable embedded platform for AI processing at the edge, with applications in fields such as Industry 4.0, automotive and heavy machinery Columbia, MD and Tel Aviv, Israel, September 30th, 2021 – MicroSys Electronics announced today its partnership with leading AI (Artificial Intelligence)

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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