TECHNOLOGIES

“Accelerating the Creation of Custom, Production-Ready AI Models for Edge AI,” a Presentation from NVIDIA

Akhil Docca, Senior Product Marketing Manager at NVIDIA, presents the “Accelerating the Creation of Custom, Production-Ready AI Models for Edge AI,” tutorial at the May 2022 Embedded Vision Summit. AI applications are powered by models. However, creating customized, production-ready AI models requires an army of data scientists and mountains of data. For businesses looking to […]

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World’s First AV1 Decoder Silicon IP with Support for 12-bit Pixel Size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT

Grenoble, France – June 16th 2022 – Allegro DVT, the leading provider of video processing silicon IPs and video compliance streams, has announced that its D310 AV1 Decoder silicon IP now supports 12-bit sample size and 4:4:4 chroma sub-sampling. Emerging applications such as cloud-gaming, automotive and screen mirroring will directedly benefit from these new features to provide a superior

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Detecting Safety Helmets in Real-time

This blog post was originally published at Tryolabs’ website. It is reprinted here with the permission of Tryolabs. At Tryolabs, we are passionate about building computer vision solutions that have real-world impact. Very often, this means integrating them to run on edge devices. In our journey to master AI on the edge, we have developed

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“A Novel Packet-based Accelerator for Resource-Constrained Edge Devices,” a Presentation from Expedera

Sharad Chole, Chief Scientist and Co-founder of Expedera, presents the “Novel Packet-based Accelerator for Resource-Constrained Edge Devices” tutorial at the May 2022 Embedded Vision Summit. As AI applications move from cloud platforms into edge devices, processor designers are increasingly incorporating hardware accelerators for real-time AI processing. These accelerators must meet tight cost, bandwidth and power

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What is Multipath Interference, and How Can You Minimize It In Time-of-flight Cameras?

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Time-of-Flight (ToF) cameras are powerful embedded vision solutions that provide real-time depth measurement – predominantly for applications that require autonomous and guided navigation. As you may know, ToF sensors use the light illumination technique where

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“NeuPro-M: A Highly Scalable, Heterogeneous and Secure Processor for High-performance AI/ML in Smart Edge Devices,” a Presentation from CEVA

Yair Siegel, Senior Director of Business Development at CEVA, presents the “NeuPro-M: A Highly Scalable, Heterogeneous and Secure Processor for High-performance AI/ML in Smart Edge Devices” tutorial at the May 2022 Embedded Vision Summit. AI capabilities have become an integral part of many products across a wide range of markets and applications. Increasingly, system developers

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Vision Components Website Relaunch

July 14, 2022 – Vision Components has completely redesigned its website www.vision-components.com with all information in a clear, modern design and with new navigation. All embedded vision products and services are presented in a flat menu structure. The German manufacturer has been a trendsetter and technology leader in decentralized machine vision for over 25 years

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“A Flexible Software Ecosystem and Marketplace for Hybrid AI Vision Solutions,” a Presentation from Basler

Bastian Steinbach, Head of Software Product Management at Basler, presents the “Flexible Software Ecosystem and Marketplace for Hybrid AI Vision Solutions” tutorial at the May 2022 Embedded Vision Summit. For most vision applications, the best solution combines classical vision algorithms with AI techniques. In practice, developing hybrid solutions is challenging. For example, different tools are

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The AI Semiconductor Market 2021

This market research report was originally published at Woodside Capital Partners’ website. It is reprinted here with the permission of Woodside Capital Partners. Woodside Capital Partners (WCP) is pleased to share our Industry Report on the AI Semiconductor Market 2021, authored by Managing Director Shusaku Sumida. This report covers the following aspects of the Semiconductor

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Apple’s Success Encourages the Mobile 3D Sensing Market in Android Phones

This market research report was originally published at Yole Développement’s website. It is reprinted here with the permission of Yole Développement. 3D sensing will be worth US$16.7 billion in 2027. But, will the metaverse be the killer app that drives Android adoption? OUTLINE The global 3D imaging and sensing market is expected to reach US$16.7

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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