This blog post was originally published at Quadric’s website. It is reprinted here with the permission of Quadric. The term “model zoo” first gained prominence in the world of AI / machine learning beginning in the 2016-2017 timeframe. Originally used to describe open-source public repositories of working AI models – the most prominent of which today […]
Let’s Visit the Zoo Read More +
This blog post was originally published at ENERZAi’ website. It is reprinted here with the permission of ENERZAi. Today, we’ll share results where we re-trained the original Whisper for optimal Korean ASR(Automatic Speech Recognition), applied Post-Training Quantization (PTQ), and provided a richer Pareto analysis so customers with different constraints and requirements can pick exactly what
Small Models, Big Heat — Conquering Korean ASR with Low-bit Whisper Read More +
This article was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. IDTechEx forecasts that the global sensor market will reach US$250B by 2036 as global mega-trends in mobility, AI, robotics, 6G connectivity and IoT drive sensor demand. IDTechEx’s newly updated “Sensor Market 2026-2036: Technologies, Trends, Players, Forecasts” report provides extensive
New IDTechEx Report: Sensor Market 2026-2036 Read More +
Nov 18, 2025 Geneva, Switzerland —>STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled new models and enhanced project support for its STM32 AI Model Zoo to accelerate the prototyping and development of embedded AI applications. This marks a significant expansion for what is already the industry’s largest library
This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for AI-based designs, including Ultra Accelerator Link (UALink), Ultra Ethernet (UEC), LPDDR6, UCIe 3.0, AMBA CHI-H, Embedded USB v2 (eUSB2), and UniPro 3.0. These new VIP will
Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs Read More +
Quality training data – especially segmented visual data – is a cornerstone of building robust vision models. Meta’s recently announced Segment Anything Model 3 (SAM3) arrives as a potential game-changer in this domain. SAM3 is a unified model that can detect, segment, and even track objects in images and videos using both text and visual
SAM3: A New Era for Open‑Vocabulary Segmentation and Edge AI Read More +
On December 4, 2025, at 10:00 am CET (4:00 am EST) Alliance Member companies Sony and RESTAR FRAMOS will deliver a 30-minute technical session “Sony’s Large Format Sensors: A Look at Global Shutter and Rolling Shutter” From the event page: Join experts from Sony, FRAMOS, and RESTAR FRAMOS for a focused, 30-minute technical session examining
Sony’s Large Format Sensors: A Look at Global Shutter and Rolling Shutter Read More +
This blog post was originally published at Gimlet Labs’ website. It is reprinted here with the permission of Gimlet Labs. We’re excited to finally share what we’ve been building at Gimlet Labs. Our mission is to make AI workloads 10X more efficient by expanding the pool of usable compute and improving how it’s orchestrated. Over the
Introducing Gimlet Labs: AI Infrastructure for the Agentic Era Read More +
Big update from the Metis world: the epic new 4-core PCIe card is now available to order over on the store. Huge performance shift that opens up seriously scalable edge AI. Key specs: 856 TOPS (INT8) Choice of 16GB and 64GB DRAM ~12,800 FPS on ResNet-50 Runs dozens of streams or parallel models per board
The New Metis PCIe with 4 Quad-Core AIPUs is Here Read More +
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI, mobility and cloud are the growth engines: They’re pushing chips toward a $1 trillion market by 2030 and forcing fabs to invest in sub-3nm nodes and advanced packaging Chips are bigger and more complex: Larger dies and
How semiconductor equipment makers will drive the next $1 trillion wave Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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