Pulin Desai, Vision and AI Product Marketing Group Director at Cadence, presents the “Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases” tutorial at the September 2020 Embedded Vision Summit. In this talk, Desai presents the full range of Cadence Tensilica edge AI processing solutions. These silicon IP-based solutions serve markets from […]
What’s New: Intel today announced key milestones in its multiyear journey to deliver a mix of architectures with a unified software experience. The company announced the gold release of Intel® oneAPI toolkits coming in December, and new capabilities in its software stack as part of the Intel’s combined hardware and software design approach. Intel also debuted
Intel Executing toward XPU Vision with oneAPI and Intel Server GPU Read More +
Offering the most responsive and power efficient neural network acceleration for next-generation automotive use cases London, England – 12th November 2020 – Imagination Technologies announces IMG Series4, its next-generation neural network accelerator (NNA) for advanced driver-assistance systems (ADAS) and autonomous driving. Series4 targets automotive industry-leading disruptors as well as Tier 1s, original equipment manufacturer (OEMS)
Tara K. Thimmanaik, Solutions Architect at Intel, presents the “Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision” tutorial at the September 2020 Embedded Vision Summit. As demand for smarter and more efficient manufacturing is growing, IoT technologies—including sensors, edge devices, gateways, servers and the cloud—are being used throughout the factory to compute deep learning analytics
Rockville, MD., – November 11, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC). “We are honored that Renesas, a world leading automotive semiconductor supplier, has selected our leading-edge DSP
CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC Read More +
Manas Pathak, Global AI Lead for Oil and Gas at Intel, presents the “Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study” tutorial at the September 2020 Embedded Vision Summit. The use of deep learning for automatic seismic data interpretation is gaining the attention of many researchers across the oil and gas industry. The
Dimensity 700 caters to growing consumer demand for 5G devices HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives
MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones Read More +
New chipsets to power premium and mainstream Chromebooks and enhance computing experiences HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its MT8192 and MT8195 chipsets for the next generation of Chromebooks. With the 7nm MT8192 for mainstream devices and the 6nm MT8195 for premium devices, brands can design powerful, sleek and lightweight Chromebooks that
AMD Ryzen Embedded V2000 Series processors deliver double the cores1, up to 2x the performance-per-watt2 and an estimated 15 percent IPC uplift3 over the previous generation SANTA CLARA, Calif. – 11/10/2020 AMD (NASDAQ: AMD) today launched a new product in its high-performance Embedded processor family, the AMD Ryzen™ Embedded V2000 Series processor. Built on the innovative 7nm
The low-power i350 brings reliable connectivity and advanced multimedia features to edge AI devices HSINCHU, Taiwan – October 13, 2020 – MediaTek today announced the i350, a highly integrated Edge AI platform with a dedicated APU (AI processor) and digital signal processor (DSP) for AIoT products that require vision and voice edge processing. The i350
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