TI Edge AI Cloud is a free service that lets you evaluate accelerated deep learning inference using TDA4x processors from Texas Instruments that you access via the cloud. No hardware purchase or software installation is required. TI Edge AI Cloud lets you: Connect to a Jacinto™ TDA4x processor evaluation board via the cloud Experience software […]
Benchmark Embedded Deep Learning Inference in Minutes Read More +
Afshin Niktash, Senior Principal Member of the Technical Staff at Maxim Integrated (now part of Analog Devices) demonstrates the keyword spotting and other audio recognition capabilities of the MAX78000 in a fun snake game application.
Maxim Integrated (Analog Devices) Demonstration of AI-based Speech Recognition Read More +
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. An ISP is a key component in an embedded camera system since a sensor provides the output only in the RAW format. An ISP (Image Signal Processor) is a dedicated processor that converts this RAW
Why Do Image Sensors Not Come with Integrated Image Signal Processors? Read More +
This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. The road to vehicular autonomy will take a detour between Levels 2 and 3. Hands-on, actively supervised self-driving features, including automated steering, acceleration, and braking, have seen a surge in popularity in recent years. Pioneered by Tesla’s
San Jose and Chennai (November 29, 2021) – e-con Systems’ SmarteCAM, a ready to deploy smart AI camera system has now been validated by the AWS Device Qualification Program (DQP) under the AWS IoT Greengrass category. The camera has also been listed in the AWS Partner device catalog. SmarteCAM has been certified by AWS owing
NXP’s automotive processors, combined with the Hailo-8™AI processor, offer powerful, scalable, safe, and efficient deep learning processing for automotive ECUs TEL AVIV, Israel, Dec. 16, 2021 /PRNewswire/ — Hailo, the leading edge Artificial Intelligence chipmaker today announced its partnership with NXP® Semiconductors, an automotive market innovator, to launch a number of joint AI solutions for
News Highlights Armv9 architecture at the foundation of MediaTek Dimensity 9000 premium SoC Specialized processing empowers MediaTek to redefine the flagship mobile experience First partner adoption of Total Compute solution with Arm Cortex-X2 2021 has been a year of continued innovation for Arm and its partners as we look to empower the ultimate digital experiences
MediaTek Dimensity 9000 Uses Armv9 Technology for Unparalleled Performance Read More +
Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022 HSINCHU, Taiwan – December 16, 2021 – MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements
Improved user experience and more performance for applications in robotics, smart factory, and motion control HILLSBORO, Ore – Dec. 15, 2021 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today launched the latest version of its Lattice Automate™ solution stack for industrial automation systems featuring new real-time networking capabilities, AI-based predictive maintenance, increased
Manny Singh, Principal Product Marketing Manager at Renesas, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Singh demonstrates the company’s the RZ/V microprocessor with a power-efficient AI accelerator. In this demo of object detection and recognition on Renesas’ proprietary Dynamically Reconfigurable Processor (DRP-AI), Singh shows
Renesas Demonstration of the RZ/V Microprocessor with a Power-efficient AI Accelerator Read More +
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