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GMSL Cameras vs MIPI Cameras: A Detailed Study

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. GMSL is a high-speed serial interface used in automotive video applications, robotic devices, agricultural vehicles, etc. It is a SerDes technique that enables long-distance transmission. Compared to MIPI – one of the most popular camera

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Qualcomm at CVPR 2023: Advancing Research and Bringing Generative AI to the Edge

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. ControlNet running entirely on device, fitness coaching with an LLM, 3D reconstruction for XR, our accepted papers and much more The annual IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) is regarded as one of the

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“Battery-powered Edge AI Sensing: A Case Study Implementing Low-power, Always-on Capability,” a Presentation from Avnet

Peter Fenn, Director of the Advanced Applications Group at Avnet, presents the “Battery-powered Edge AI Sensing: A Case Study Implementing Low-power, Always-on Capability” tutorial at the May 2023 Embedded Vision Summit. The trend of pushing AI/ML capabilities to the edge brings design challenges around the need to combine high-performance computing (for AI/ML algorithms) with low

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“Sparking the Next Generation of Arm-based Cloud-native Smart Camera Designs,” a Presentation from Arm

Stephen Su, Senior Product Manager at Arm, presents the “Sparking the Next Generation of Arm-based Cloud-native Smart Camera Designs” tutorial at the May 2023 Embedded Vision Summit. As enterprises and consumers increasingly adopt machine learning-enabled smart cameras, the expectations of these end users are becoming more sophisticated. In particular, smart camera users increasingly expect their

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Innovation Beyond Moore’s Law: Advanced Packaging Explores New Frontiers

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. ECTC explores integration, bonding technologies and new materials in search of advanced packaging for the AI age Advanced packaging is a linchpin for the semiconductor industry which is wrestling with integrating multiple

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Advanced Semiconductor Packaging: A New Geopolitical Battleground

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Geopolitical tensions are making advanced semiconductor packaging increasingly crucial… OUTLINE The Advanced Packaging (AP) market, valued at US$44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022

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Buying an Autonomous Electric Car Will Feel More Like Buying a Laptop Than a Car

Computer chips have been part of cars for a long time, but no one really cares about them until they stop working or they are late to the production line, grinding manufacturing to an industry-shaking halt. However, the research within IDTechEx’s “Semiconductors for Autonomous and Electric Vehicles 2023-2033” report shows that trends within the automotive

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“Five Things You Might Overlook on Your Next Vision-enabled Product Design,” a Presentation from BDTI

Phil Lapsley, Co-founder and Vice President of BDTI, presents the “Five Things You Might Overlook on Your Next Vision-enabled Product Design” tutorial at the May 2023 Embedded Vision Summit. When you think about building a vision-enabled product, you probably think about things like: Which processor am I going to use? What neural network will it

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“Image Sensors to Enable Low-cost and Low-power Computer Vision Applications,” a Presentation from STMicroelectronics

Ruchi Upadhyay, Technical Marketing Manager at STMicroelectronics, presents the “Image Sensors to Enable Low-cost and Low-power Computer Vision Applications” tutorial at the May 2023 Embedded Vision Summit. Advances in image sensor capabilities, such as improved imaging in low-light conditions, coupled with reduced footprint and lower power consumption, are enabling more and more systems to incorporate

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