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SiMa.ai Announces First Integrated Capability with Synopsys to Accelerate Automotive Physical AI Development
San Jose, California – January 6, 2026 – SiMa.ai today announced the first integrated capability resulting from its strategic collaboration

D3 Embedded Showcases Camera/Radar Fusion, ADAS Cameras, Driver Monitoring, and LWIR solutions at CES
Las Vegas, NV, January 7, 2026 — D3 Embedded is showcasing a suite of technology solutions in partnership with fellow

NVIDIA DRIVE AV Software Debuts in All-New Mercedes-Benz CLA
This post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. Production launch of

Ambarella Launches Powerful Edge AI 8K Vision SoC With Industry-Leading AI and Multi-Sensor Perception Performance
New 4nm CV7 System-on-Chip Provides Ideal Combination of Simultaneous Multi-Stream Video and Advanced On-Device Edge AI Processing With Very Low

Qualcomm’s IE‑IoT Expansion Is Complete: Edge AI Unleashed for Developers, Enterprises & OEMs
Key Takeaways: Expanded set of processors, software, services, and developer tools including offerings and technologies from the five acquisitions of Augentix, Arduino, Edge Impulse, Focus.AI, and Foundries.io, positions the Company to help meet edge computing and AI needs for customers across virtually all verticals. Completed

NXP and GE HealthCare Accelerate AI Innovation in Acute Care
NXP and GE HealthCare announced a collaboration to pioneer new advancements in edge AI innovation, beginning with new anesthesia and

Accelerate AI Inference for Edge and Robotics with NVIDIA Jetson T4000 and NVIDIA JetPack 7.1
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA is introducing

NVIDIA Unveils New Open Models, Data and Tools to Advance AI Across Every Industry
This post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. Expanding the open model

Qualcomm Introduces a Full Suite of Robotics Technologies, Powering Physical AI from Household Robots up to Full-Size Humanoids
Key Takeaways: Utilizing leadership in Physical AI with comprehensive stack systems built on safety-grade high performance SoC platforms, Qualcomm’s general-purpose
News

Vision Components to Present VC MIPI IMX454 Multispectral Camera Module at Photonics West
Ettlingen, Germany, January 12, 2026 — Vision Components will present its new VC MIPI IMX454 Camera Module at SPIE Photonics West, 20-22 January in San Francisco, California. The MIPI Camera features Sony’s new multispectral image sensor IMX454 and enables to capture up to 41 wavelength in one shot. VC will also showcase its lineup of

Free Webinar Examines Autonomous Imaging for Environmental Cleanup
On March 3, 2026 at 9 am PT (noon ET), The Ocean Cleanup’s Robin de Vries, ADIS (Autonomous Debris Imaging System) Lead, will present the free hour webinar “Cleaning the Oceans with Edge AI: The Ocean Cleanup’s Smart Camera Transformation,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration

Upcoming Webinar on Advances in Automatic Test Pattern Generation
On January 14, 2026, at 7:00 am EST (10:00 am EST) Alliance Member company Synopsys will deliver a webinar “Advances in ATPG: From Power and Timing Awareness to Intelligent Pattern Search with AI” From the event page: As System-on-Chip (SoC) designs become increasingly complex, meeting test quality and cost goals requires advances in automatic test
Market Analysis

AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its new report, Automotive Computing and AI 2025, Yole Group analyzes the technological and market forces redefining vehicle intelligence, safety, and connectivity. The automotive industry is accelerating into a new era

Two-Phase Liquid Cooling: The Future of High-end GPUs
As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal design power (TDP) continuing to rise, the industry is approaching the limits of what single-phase cooling can handle. Two-phase D2C cooling is expected to enter large-scale deployment around 2027. IDTechEx has conducted extensive interviews across

AI-enhanced In-cabin Sensing Systems
As the trend of vehicle intelligence enhancement rises, in-cabin sensing systems will be largely responsible for increased communication, sensitivity, and smart features within cars. IDTechEx‘s report, “In-Cabin Sensing 2025-2035: Technologies, Opportunities, and Markets“, provides the latest technology developments within the sector, along with forecasts for their uptake over the next ten years. Where AI meets
Blog

AI Glasses: Ushering in the Next Generation of Advanced Wearable Technology
This blog post was originally published at NXP Semiconductors’ website. It is reprinted here with the permission of NXP Semiconductors. With the continuous evolution of AI and smart hardware, AI smart glasses are no longer science fiction but becoming part of reality. Modern AI glasses are available in a variety of shapes with rich functionality.

What is a Red Light Camera? A Quick Guide to Vision-Based Traffic Violation Detection
This article was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Intersections remain among the most accident-prone areas in traffic networks, with violations like red-light running leading to severe crashes. Red light cameras automate detection by linking vehicle movement with signal state, capturing clear evidence for enforcement. They

Accelerate AI Inference for Edge and Robotics with NVIDIA Jetson T4000 and NVIDIA JetPack 7.1
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA is introducing the NVIDIA Jetson T4000, bringing high-performance AI and real-time reasoning to a wider range of robotics and edge AI applications. Optimized for tighter power and thermal envelopes, T4000 delivers up to 1200 FP4 TFLOPs of AI compute and 64 GB of memory,
