News
In-depth information about the edge AI and vision market, applications, technologies, products, and trends.
Read industry market analyses, blogs, news, and press releases from our Member companies.
All News

China’s Autonomous Trucks Now Log Over One Million Kilometers Daily
This blog post was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. To gain deeper

Public road demonstration tests of the latest autonomous driving EV bus, including nighttime operation, have begun at a hot spring resort
Following on from last year, Macnica, Inc., Fukuyama Consultant Co., Ltd., and KCS Corporation will collaborate with Ureshino City, Saga

How semiconductor equipment makers will drive the next $1 trillion wave
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI,

VC MIPI Cameras & ADLINK i.MX 8M Plus: Full driver support
Ettlingen, November 18, 2025 — For a medical imaging project, ADLINK wanted to integrate VC MIPI Cameras with its I-Pi

The Art of Robotics and The Growing Intellect of Autonomy
This blog post was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. ‘Robotics’ takes

IIJ and Sony to Agree on the Establishment of a Joint Venture to Promote Smart Agriculture
TOKYO and ATSUGI, Japan – November 7, 2025 – Internet Initiative Japan Inc. (IIJ) and Sony Semiconductor Solutions Corporation (Sony)

Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability
Architected to power AI workloads, Micron’s latest automotive solution, built with G9 NAND, equips the industry to create safer, smarter

STMicroelectronics introduces new battery-saving wireless microcontrollers optimized for remote controls
Nov 18, 2025 Geneva, Switzerland STM32WL3R MCUs add flexible features to low-power radio for superior user experiences in consumer electronics and

The Image Sensor Size and Pixel Size of a Camera is Critical to Image Quality
This blog post was originally published at Commonlands’ website. It is reprinted here with the permission of Commonlands. The sensor
News

Nota AI Signs Technology Collaboration Agreement with Samsung Electronics for Exynos AI Optimization “Driving the Popularization of On-Device Generative AI”
Nota AI’s optimization technology integrated into Samsung Electronics’ Exynos AI Studio, enhancing efficiency in on-device AI model development Seoul, South Korea Nov.26, 2025 — Nota AI, a company specializing in AI model compression and optimization, announced today that it has signed a collaboration agreement with Samsung Electronics’ System LSI Business to provide its AI

Jeff Bier to Speak at AI Everywhere 2025
On Thursday, December 11, Jeff Bier, Founder of the Edge AI and Vision Alliance will present at two sessions as part of EE Times’ AI Everywhere 2025. In the first, “Edge AI Everywhere: What Will It Take To Get There?” Jeff will highlight some inspiring success stories and explore the key challenges that need to

WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
Nov 26, 2025 Seoul, South Korea — Chips&Media is announcing that the next-generation customized NPU, WAVE-N v2, is ready for release, delivering higher computational power along with improved area and power efficiency. WAVE-N v2 is also designed to support a wider range of applications, such as object detection and segmentation, in addition to visual quality enhancement
Market Analysis

AI-enhanced In-cabin Sensing Systems
As the trend of vehicle intelligence enhancement rises, in-cabin sensing systems will be largely responsible for increased communication, sensitivity, and smart features within cars. IDTechEx‘s report, “In-Cabin Sensing 2025-2035: Technologies, Opportunities, and Markets“, provides the latest technology developments within the sector, along with forecasts for their uptake over the next ten years. Where AI meets

The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier
A Tale of Two Cultures It is the best of times and the worst of times. The quest for fully autonomous vehicles (AVs) is increasingly a problem of hardware—but at a systems level, it’s a multi-faceted engineering challenge. The AD (Automated Driving) Europe 2025 conference in Berlin tackled this issue head-on this week. Far from

Artificial Intelligence (AI) As the Semiconductor Growth Engine: AI White Paper Volume 1 – Memory & Computing
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group Launches its First AI White Paper. KEY TAKEAWAYS Compute at the limit: Training and inference workloads now demand gigawatts of electricity, raising urgent questions on sustainability, cost, and infrastructure capacity.
Blog

Small Models, Big Heat — Conquering Korean ASR with Low-bit Whisper
This blog post was originally published at ENERZAi’ website. It is reprinted here with the permission of ENERZAi. Today, we’ll share results where we re-trained the original Whisper for optimal Korean ASR(Automatic Speech Recognition), applied Post-Training Quantization (PTQ), and provided a richer Pareto analysis so customers with different constraints and requirements can pick exactly what

Introducing Gimlet Labs: AI Infrastructure for the Agentic Era
This blog post was originally published at Gimlet Labs’ website. It is reprinted here with the permission of Gimlet Labs. We’re excited to finally share what we’ve been building at Gimlet Labs. Our mission is to make AI workloads 10X more efficient by expanding the pool of usable compute and improving how it’s orchestrated. Over the

How semiconductor equipment makers will drive the next $1 trillion wave
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI, mobility and cloud are the growth engines: They’re pushing chips toward a $1 trillion market by 2030 and forcing fabs to invest in sub-3nm nodes and advanced packaging Chips are bigger and more complex: Larger dies and
