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“HiFi iQ: Enabling Voice AI and Immersive Audio for Smart Home, Mobile and Automotive,” a Presentation from Cadence

Amol Borkar, Group Director of Product Management and Marketing—Tensilica DSPs, Silicon Solutions Group (SSG) at Cadence presents “HiFi iQ: Enabling Voice AI and Immersive Audio for Smart Home, Mobile and Automotive” at the May 2026 Embedded Vision Summit. Voice is quickly becoming the primary interface for consumer and enterprise devices,… “HiFi iQ: Enabling Voice AI […]

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Gemma 4 on Arm: Accessible, Immediate, Optimized On-device AI to Accelerate the Mobile App Experience

Gemma 4 on Arm brings fast, privacy-preserving, power-efficient AI directly onto Android devices, helping developers deliver richer real-time app experiences to billions of users without relying on the cloud.   This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. Real-time assistance, seamless communication, and greater personalization are now baseline expectations for billions of smartphone

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e-con Systems to Showcase AI-Powered Smart Cameras and Urban Mobility Vision Solutions at ITS America Conference & Expo 2026

Live demos showcasing high-accuracy ALPR, AI-powered traffic analytics, and cloud-based traffic video management solutions for Vision Zero initiatives   California & Chennai (May 27, 2026): e-con Systems®, a global leader in embedded vision solutions, will showcase its latest Edge AI-powered Intelligent Transportation System (ITS) solutions at ITS America Conference & Expo 2026, taking place from

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The Software Gap Holding AI Back: What Semiconductor Leaders Can Learn From the EV Transition

This blog post was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. The story of EV adoption contains a warning that semiconductor companies would be wise to take seriously. When the automotive industry made the leap from combustion engines to electric drivetrains, it discovered that a transformative technology is not enough on its own. The

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Intel Core Ultra Series 3: The New Standard for Edge AI Robotics Compute

By integrating a CPU, GPU, and NPU, Intel Core Ultra Series 3 delivers edge AI power across global use cases—from hospitality and manufacturing to healthcare and education. At 2 a.m., an emergency room nurse orders a latte at a quiet hospital coffee stand. There is no human behind the counter. Instead, a sleek robotic arm

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Scaling Edge AI for the Enterprise: Building the Ultimate Multi-Model, Multi-Stream Security System

This blog post was originally published at Axelera AI’s website. It is reprinted here with the permission of Axelera AI. At a Glance The Achievement: Real-time AI person-of-interest (POI) identification and threat detection across multiple 8K streams at 2.5 PetaOPS The Stack: Voyager SDK + Axelera Metis + Intel Xeon The Future: 3x performance leap with

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How Customized Single-board Computers Increase the Profitability of Embedded Vision Systems

This blog post was originally published at Helbling’s website. It is reprinted here with the permission of Helbling. Artificial Intelligence is one of the defining technological trends of this decade. In particular, vision-based AI applications, where camera data is processed directly on the edge, are gaining rapid momentum. Embedded Vision systems are the backbone of these

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Upcoming Webinar on Building Your First Real-World AI Tool

On May 21, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “What It Takes to Build Your First Real-World AI Tool” From the event page: Most AI talks focus on what’s possible. This one shows how to actually use AI in product development, even if you’re just getting started. In

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AMD Silo AI and University of Bologna Start Spatial AI Collaboration for Robotics and Autonomous Driving

The research collaboration will focus on building geometry-aware perception modules on the AMD ROCm™ open software stack AMD Silo AI and University of Bologna through its Department of Computer Science and Engineering (DISI) are starting a research collaboration to bring explicit 3D geometry into the Vision Language Action (VLA) and world-model pipeline for robotics and

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Upcoming Event on AI Transformation

KOTRA Silicon Valley will host “Physical AI Superconnect 2026,” on June 24, 2026, from 10:00 am to 8:00 pm PDT at the Computer History Museum in Mountain View, California. The event will feature insightful presentations, technology exhibits, matchmaking and networking. From the event page: ​M.AX: A New Era of Manufacturing AI Transformation ​​Physical AI Superconnect

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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