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Semiconductor Memory: China’s Ambition Shows No Signs of Slowing Down

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The semiconductor memory industry has long been a strategic priority for China’s economic development. Chinese companies purchase more than 30% of the NAND and DRAM products manufactured by global IDMs, while China’s […]

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A Full Physical and Cost Analysis of Qualcomm’s Flagship Smartphone Processor, Including a Comparison with Its Predecessor, Reveals Qualcomm’s Newest Design

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Smartphone Application Procession Unit (APU) vendors earned $8.3B revenue in Q4-2022. Products like the Snapdragon 8 Generation 2 help Qualcomm maintain their leadership position in this APU market. This full reverse costing

A Full Physical and Cost Analysis of Qualcomm’s Flagship Smartphone Processor, Including a Comparison with Its Predecessor, Reveals Qualcomm’s Newest Design Read More +

Chiplets: Why Now?

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The idea of a multi-chip product has been around for some time, for the purposes of achieving a higher functioning system made up of smaller components. We have the mainframe CPU IBM

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DEEPX Hosts the Largest Showcase at the Embedded Vision Summit, Continues to Expand Global Footprint

DEEPX will hold the largest showcase for its global market debut at the Embedded Vision Summit, the largest technology event in the field of edge AI The Embedded Vision Summit to be held in Silicon Valley, USA from May 22nd to May 24th is the largest exhibition in the field of edge vision AI and

DEEPX Hosts the Largest Showcase at the Embedded Vision Summit, Continues to Expand Global Footprint Read More +

Velodyne’s H800 LiDAR: Noteworthy Progress in Integration Practices, Based on VCSEL and Laser Technologies

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Compact enough to be integrated into the cabin of a car – such as within the windshield –  Velodyne’s Velarray H800 is the first lidar system that integrates two illumination modules for

Velodyne’s H800 LiDAR: Noteworthy Progress in Integration Practices, Based on VCSEL and Laser Technologies Read More +

BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit

Laguna Hills, Calif. – May 10, 2023 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that Chief Marketing Officer Nandan Nayampally has been selected to present as part of the Enabling Technologies track at the Embedded Vision

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CEVA Acquires Spatial Audio Business from VisiSonics

Acquisition of RealSpace® enables CEVA to offer a complete spatial audio solution to OEMs targeting high volume markets including TWS, OTC hearables, gaming headphones, AR/VR, audio conferencing, automotive and media entertainment ROCKVILLE, MD., May 10, 2023 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today

CEVA Acquires Spatial Audio Business from VisiSonics Read More +

What is Multiple Camera Interference, and How Can Time-of-flight Cameras Overcome It?

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Multiple Camera Interference (MCI) is one of the biggest challenges faced by multi-camera setups – powered by Time-of-Flight (ToF) technology. So, avoiding light interference between two or more TOF cameras becomes very crucial. Read our

What is Multiple Camera Interference, and How Can Time-of-flight Cameras Overcome It? Read More +

Teledyne to Showcase a Comprehensive Portfolio of Imaging Technologies at Automate 2023

Waterloo, CANADA – May 9, 2023 – Teledyne will showcase their newest products and solutions at the Automate 2023 exhibition taking place May 22-25, in Detroit, USA. Teledyne’s DALSA, FLIR IIS (Integrated Imaging Solutions), and Lumenera businesses will display the world’s most comprehensive, vertically integrated portfolio of industrial imaging technology. Visit Teledyne at booth 1619

Teledyne to Showcase a Comprehensive Portfolio of Imaging Technologies at Automate 2023 Read More +

Basler Presents Vision Solutions for Factory Automation at automatica 2023

With a comprehensive portfolio of image processing components and solutions, the company aims to optimize its customers’ vision applications. Live demonstrations at the Basler booth showcase product compatibility with well-known manufacturers in robotics. Ahrensburg, May 09, 2023 – Embodying the motto “Accelerate your Vision – Vision Solutions for Smart Factories”, Basler AG will present itself

Basler Presents Vision Solutions for Factory Automation at automatica 2023 Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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