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CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms

Extends CEVA’s market reach into the sustainable aerospace & defense markets Increases CEVA’s revenue and royalty opportunity by combining IP, software and chip development for full turnkey IP platforms Expands CEVA’s IP portfolio with secure processor IP and interface IP for heterogeneous SoCs targeting IoT markets Rockville, MD., – May 10, 2021  – CEVA, Inc. […]

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Challenges of Running Deep Learning Computer Vision on Computationally Limited Devices

Clear vision using glasses (Photo by timJ on Unsplash) This blog post was originally published at Xailient’s website. It is reprinted here with the permission of Xailient. Autonomous driving, facial recognition, traffic surveillance, person tracking, and object counting, all of these applications have one thing in common, Computer Vision (CV). Since the success of deep

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Beneficial AI: The More Advanced, The More Beneficial

This blog post was originally published at BrainChip’s website. It is reprinted here with the permission of BrainChip. In many of our presentations, podcasts, and blogs, we’ve focused the conversation around “Beneficial AI.” Here at BrainChip, we consider applications that aim to improve the human or global condition to be beneficial. This could apply to

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Merger of Silicon Software GmbH with Basler AG

Companies complete merger and expand product areas frame grabber and VisualApplets under Basler brand. Ahrensburg, May 05, 2021 – Silicon Software GmbH has been merged into Basler AG. Basler had acquired Silicon Software in 2018 and managed it as an independent GmbH within the group structure. Functions such as production, logistics, sales and technical support

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Coherent Logix to Present at the 2021 Embedded Vision Summit

Austin, Texas – May 3, 2021 – COHERENT LOGIX announced today that it will participate in the 2021 Embedded Vision Summit, the premier event for innovators adding computer vision and AI to products. This year’s Summit will be 100% online, where attendees will be able to watch presentations, ask questions of speakers, visit the virtual

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OpenFive Tapes Out SoC for Advanced AI/HPC Solutions on TSMC 5nm Technology

OpenFive HBM3 and Die-2-Die (D2D) interfaces combined with SiFive E76 RISC-V CPU core enable high performance chiplets and 2.5D based system-on-a-chip (SoC) designs. SAN MATEO, Calif. – April 13, 2021 – OpenFive, a leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the successful tape out of a high-performance SoC on TSMC’s N5

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Edge AI and Vision Insights: May 4, 2021 Edition

LETTER FROM THE EDITOR Dear Colleague, The Embedded Vision Summit is quickly approaching (May 25-28), and I just took a look at our long (and growing) list of exhibitors. All I can say is wow! These top suppliers are creating cutting-edge building-block technologies that are accelerating the future of edge AI and vision, and they’ll

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What is Intelligent Photography? Part II: Image Enhancement Techniques

This blog post was originally published at Visidon’s website. It is reprinted here with the permission of Visidon. In the last post we discussed what is a good image and what does image quality mean. You can read the article here. In general, there are a few common criteria which usually determine the image quality: noise,

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Protocol- and Interface-Agnostic Universal D2D Controller for Chiplets and HPC

This blog post was originally published at OpenFive’s website. It is reprinted here with the permission of OpenFive. Demand for die-to-die and chip-to-chip interfaces has been growing steadily in the past few years due to new applications in cloud/data centers, AI (training and edge applications), and High-Performance Computing (HPC). The demand is driven by the requirements

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