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“Ergo: Perceive’s Chip – Data Center-Class Inference in Edge Devices at Ultra-Low Power,” a Presentation from Perceive

Steve Teig, CEO of Perceive, presents the “Ergo: Perceive’s Chip – Data Center-Class Inference in Edge Devices at Ultra-Low Power” tutorial at the September 2020 Embedded Vision Summit. To date, people seeking to deploy machine learning-based inference within consumer electronics have had only two choices, both unattractive. The first option entails transmitting voluminous raw data, […]

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NVIDIA Doubles Down: Announces A100 80GB GPU, Supercharging World’s Most Powerful GPU for AI Supercomputing

Leading Systems Providers Atos, Dell Technologies, Fujitsu, GIGABYTE, Hewlett Packard Enterprise, Inspur, Lenovo, Quanta and Supermicro to Offer NVIDIA A100 Systems to World’s Industries Monday, November 16, 2020—SC20—NVIDIA today unveiled the NVIDIA® A100 80GB GPU — the latest innovation powering the NVIDIA HGX™ AI supercomputing platform — with twice the memory of its predecessor, providing

NVIDIA Doubles Down: Announces A100 80GB GPU, Supercharging World’s Most Powerful GPU for AI Supercomputing Read More +

AMD Announces World’s Fastest HPC Accelerator for Scientific Research

AMD Instinct™ MI100 accelerators revolutionize high-performance computing (HPC) and AI with industry-leading compute performance First GPU accelerator with new AMD CDNA architecture engineered for the exascale era SANTA CLARA, Calif. – 11/16/2020 – AMD (NASDAQ: AMD) today announced the new AMD Instinct™ MI100 accelerator – the world’s fastest HPC GPU and the first x86 server GPU

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AI Startup Deep Vision Powers AI Innovation at the Edge

LOS ALTOS, Calif., November 16, 2020 – Deep Vision exits stealth mode and launches its ARA-1 inference processor to enable the creation of new world AI vision applications at the edge. The processors provide the optimal balance of compute, memory, energy efficiency (2W Typical), and ultra-low latency in a compact form factor, making it the

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T3S Thermal Camera from IRAY Technology: a Good Value-for-Money Product, but…

OUTLINE: T3S thermal camera from IRAY – Details: Pixel resolution: 384×288 – Pixel pitch: 17µm – Thermal resolution: <60mK – Temperature measurement accuracy: +/-3% Those specifications have been tested in Piséo’s report. Evaluation from Piséo: Good value-for-money product but it requires some improvements. Good image quality provided thanks to a very good bolometric sensor. IRAY’s

T3S Thermal Camera from IRAY Technology: a Good Value-for-Money Product, but… Read More +

OmniVision Launches World’s First Complete Medical Imaging Subsystems for Single-Use Endoscopes and Catheters with Addition of OVMed® Cables

Combined with Portfolio of Medical CameraCubeChip™ Modules and OVMed ISP Boards, New Line of Cables Enables OmniVision to Uniquely Provide Optimally Tuned End-to-End Imaging Subsystems SANTA CLARA, Calif. – Nov. 16, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced at CompaMed the OVMed® Cable line of medical endoscope,

OmniVision Launches World’s First Complete Medical Imaging Subsystems for Single-Use Endoscopes and Catheters with Addition of OVMed® Cables Read More +

OmniVision and Almalence Add SuperResolution to World’s Smallest Camera Module for Endoscopic Medical Imaging

Joint Solution Combines OmniVision’s Wafer-Level CameraCubeChip™ Technology With Almalence’s Unique SuperResolution Algorithm to Provide Highest Quality Images of Smallest Parts of Anatomy SANTA CLARA, Calif. – Nov. 16, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, and Almalence Inc., one of the world’s leaders in computational imaging, today announced at

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“Machine-Learning-Based Perception on a Tiny, Low-Power FPGA,” a Presentation from Lattice Semiconductor

Hoon Choi, Fellow at Lattice Semiconductor, presents the “Machine-Learning-Based Perception on a Tiny, Low-Power FPGA” tutorial at the September 2020 Embedded Vision Summit. In this tutorial, Choi presents a set of machine-learning-based perception solutions that his company implemented on a tiny (5.4 mm2 package), low-power FPGA. These solutions include hand gesture classification, human detection and

“Machine-Learning-Based Perception on a Tiny, Low-Power FPGA,” a Presentation from Lattice Semiconductor Read More +

VCSEL Market Dominated by Consumer 3D Sensing but Other Applications Could Emerge – An Interview with Vixar

The VCSEL industry has witnessed strong growth in the past few years, since the emergence of 3D sensing in smartphones. According to Yole Développement’s latest report “VCSELs – Market and Technology Trends 2020“, the VCSEL market for mobile and consumer applications is expected to grow from $844M in 2020 to $2.1B in 2025, representing a

VCSEL Market Dominated by Consumer 3D Sensing but Other Applications Could Emerge – An Interview with Vixar Read More +

“Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases,” a Presentation from Cadence

Pulin Desai, Vision and AI Product Marketing Group Director at Cadence, presents the “Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases” tutorial at the September 2020 Embedded Vision Summit. In this talk, Desai presents the full range of Cadence Tensilica edge AI processing solutions. These silicon IP-based solutions serve markets from

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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