ST enters into agreement for acquisition of NXP’s MEMS sensor business for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of technical milestones The MEMS businesses of ST and NXP are strongly complementary in terms of technology and product portfolio, with the […]
Edge AI was the primary focus of microcontroller vendors at the 2025 Embedded World Exhibition. We caught up with some industry executives for our annual Embedded Quest program, asking them about their take on Edge AI. As usual, the Embedded World Exhibition in Nuremberg, Germany, drew a large crowd of companies in the computing processor
Embedded Quest 2025: MCU Vendors Step up Edge AI Play Read More +
New technology delivers more than 20% power consumption reduction per day in addition to improved security and privacy ST solution combines market leading Time-of-Flight (ToF) sensors and unique AI algorithms for a seamless user experience Geneva, Switzerland, June 17, 2025 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics
Industry-first inertial measurement unit (IMU) with dual MEMS accelerometer and embedded AI measures accurately up to 320g full-scale range Geneva, Switzerland, May 13, 2025 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g
STMicroelectronics continues to revolutionize the world of imaging and edge-AI technologies with its innovative ST BrightSense Imaging solutions, ST Flightsense Time-of-Flight technologies and its new Arm® Cortex®-M55-based MCU. Leveraging cutting-edge advancements in CMOS image sensors, in mini-LiDAR with flood illumination and in the ST Neural-ART Accelerator, STMicroelectronics offers demos that highlight the capabilities of their
STMicroelectronics Smart Vision Solutions at the 2025 Embedded Vision Summit Read More +
Thomas Viart, Technical Product Marketing Engineer at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 CES. Specifically, Viart compares STMicroelectronics’ VD55G1 BrightSense image sensor to other standard image sensors found in the market. The VD55G1’s unique embedded features include: Smallest global shutter sensor on the market, enabling 0.6 MP,
Focused feature set with AI acceleration and cyber protection for industrial and IoT applications Geneva, Switzerland, April 7, 2025 — STMicroelectronics has announced mass-market availability of new STM32MP23 general-purpose microprocessors (MPUs), combining high-temperature operation up to 125°C with the speed and efficiency of dual Arm® Cortex®-A35 cores, for superior performance and ruggedness in industrial and
16g/80g dual-range IMU with edge processing brings advanced sports monitoring to affordable wearables to “train like a pro!” Geneva, Switzerland, February 24, 2025 — STMicroelectronics’ innovative LSM6DSV80X combines two accelerometer structures for 16g and 80g full-scale sensing, a gyroscope up 4000dps, and embedded intelligence in a single component. Capable of measuring events ranging from slight
Where safety meets safety: ST’s Stellar MCUs certified to the highest level of risk management, ISO 26262 ASIL D, are now supported with the same safety level by HighTec’s Rust compiler Geneva, Switzerland and Saarbrücken, Germany, February 4, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications,
New hardware integrates closely with convenient, graphical development environment Geneva, Switzerland, January 27, 2025 — Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. Now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication , the
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