Memory

AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry

Automotive, Market Analysis, Memory, Processors, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its new report, Automotive Computing and AI 2025, Yole Group analyzes the technological and market forces redefining vehicle intelligence, safety, and connectivity. The automotive industry is accelerating into a new era […]

AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry Read More +

“Three Big Topics in Autonomous Driving and ADAS,” an Interview with Valeo

Algorithms, Automotive, Edge AI and Vision Alliance, Memory, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Frank Moesle, Software Department Manager at Valeo, talks with Independent Journalist Junko Yoshida for the “Three Big Topics in Autonomous Driving and ADAS” interview at the May 2025 Embedded Vision Summit. In this on-stage interview, Moesle and Yoshida focus on trends and challenges in automotive technology, autonomous driving and ADAS.… “Three Big Topics in Autonomous

“Three Big Topics in Autonomous Driving and ADAS,” an Interview with Valeo Read More +

“Toward Hardware-agnostic ADAS Implementations for Software-defined Vehicles,” a Presentation from Valeo

Algorithms, Automotive, Edge AI and Vision Alliance, Memory, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Frank Moesle, Software Department Manager at Valeo, presents the “Toward Hardware-agnostic ADAS Implementations for Software-defined Vehicles” tutorial at the May 2025 Embedded Vision Summit. ADAS (advanced-driver assistance systems) software has historically been tightly bound to the underlying system-on-chip (SoC). This software, especially for visual perception, has been extensively optimized for… “Toward Hardware-agnostic ADAS Implementations for

“Toward Hardware-agnostic ADAS Implementations for Software-defined Vehicles,” a Presentation from Valeo Read More +

The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier

Market Analysis, Memory, Processors /

A Tale of Two Cultures It is the best of times and the worst of times. The quest for fully autonomous vehicles (AVs) is increasingly a problem of hardware—but at a systems level, it’s a multi-faceted engineering challenge. The AD (Automated Driving) Europe 2025 conference in Berlin tackled this issue head-on this week. Far from

The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier Read More +

Upcoming Seminar Explores the Latest Innovations in Mobile Robotics

Algorithms, Memory, News, NXP Semiconductors, Processors, Robotics, Sensors and Cameras, Software, Tools /

On October 22, 2022 at 9:00 am PT, Alliance Member company NXP Semiconductors, along with Avnet, will deliver a free (advance registration required) half-day in-person robotics seminar at NXP’s office in San Jose, California. From the event page: Join us for a free in-depth seminar exploring the latest innovations in mobile robotics with a focus

Upcoming Seminar Explores the Latest Innovations in Mobile Robotics Read More +

“Lessons Learned Building and Deploying a Weed-killing Robot,” a Presentation from Tensorfield Agriculture

Algorithms, Edge AI and Vision Alliance, Memory, Object Identification, Object Tracking, Processors, Robotics, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Xiong Chang, CEO and Co-founder of Tensorfield Agriculture, presents the “Lessons Learned Building and Deploying a Weed-Killing Robot” tutorial at the May 2025 Embedded Vision Summit. Agriculture today faces chronic labor shortages and growing challenges around herbicide resistance, as well as consumer backlash to chemical inputs. Smarter, more sustainable approaches… “Lessons Learned Building and Deploying

“Lessons Learned Building and Deploying a Weed-killing Robot,” a Presentation from Tensorfield Agriculture Read More +

Artificial Intelligence (AI) As the Semiconductor Growth Engine: AI White Paper Volume 1 – Memory & Computing

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group Launches its First AI White Paper. KEY TAKEAWAYS Compute at the limit: Training and inference workloads now demand gigawatts of electricity, raising urgent questions on sustainability, cost, and infrastructure capacity.

Artificial Intelligence (AI) As the Semiconductor Growth Engine: AI White Paper Volume 1 – Memory & Computing Read More +

Edge AI Hangs on Power: Can Chipmakers Meet Up?

Market Analysis, Memory, Processors, Sensors and Cameras, STMicroelectronics /

Power semiconductors will define how well and how quickly the global economy adopts Edge AI and benefit from its promises. That’s why the race is stiffening among chipmakers to offer the most innovative power management components and systems. Who is winning? What’s at stake: The stakes for power semiconductor makers in the Edge AI market

Edge AI Hangs on Power: Can Chipmakers Meet Up? Read More +

“Sensors and Compute Needs and Challenges for Humanoid Robots,” a Presentation from Agility Robotics

Algorithms, Edge AI and Vision Alliance, Memory, Processors, Robotics, Sensors and Cameras, Software, Tools, Videos /

Vlad Branzoi, Perception Sensors Team Lead at Agility Robotics, presents the “Sensors and Compute Needs and Challenges for Humanoid Robots” tutorial at the September 2025 Edge AI and Vision Innovation Forum.

“Sensors and Compute Needs and Challenges for Humanoid Robots,” a Presentation from Agility Robotics Read More +

Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging

Market Analysis, Memory, Processors /

The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology

Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Pages

Topics

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top