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North America and Europe to Account for 17 Million Video Telematics Systems in Use by 2029

Algorithms, Automotive, Market Analysis, Memory, Processors, Sensors and Cameras, Software, Tools /

For more information, visit https://www.berginsight.com/the-video-telematics-market. The integration of cameras to enable various video-based solutions in commercial vehicle environments is one of the most apparent trends in the fleet telematics sector today. Berg Insight’s definition of video telematics includes a broad range of camera-based solutions deployed in commercial vehicle fleets either as standalone applications or as […]

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Emerging Memory and Storage Technology 2025-2035: Markets, Trends, Forecasts

Market Analysis, Memory /

For more information, visit https://www.idtechex.com/en/research-report/emerging-memory-and-storage-technology-2025-2035-markets-trends-forecasts/1088. Yearly market size for memory & storage market will exceed $300B by 2035 The explosion of AI and HPC workloads, the rising demand for data centers and cloud storage, and the expansion of IoT and edge computing are driving the need for next-generation memory and storage solutions, as well as

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PLP Technology Roadmap Toward High-end Packaging Fueled by AI

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group anticipates strong growth in the PLP market with a 27% CAGR from 2024 to 2030, driven by its cost efficiency and ability to meet both advanced and traditional packaging needs.

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Key Insights from Data Centre World 2025: Sustainability and AI

Algorithms, Market Analysis, Memory, Processors, Software, Tools /

Scope 2 power-based emissions and Scope 3 supply chain emissions make the biggest contribution to the data center’s carbon footprint. IDTechEx’s Sustainability for Data Centers report explores which technologies can reduce these emissions. Major data center players converged in London, UK, in the middle of March for the 2025 iteration of Data Centre World. Co-located

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Demand for HBM to Grow 15-fold by 2035 for HPC and AI

Market Analysis, Memory /

Parallel computer architectures, such as those deployed for modern high-performance computing (HPC) and artificial intelligence (AI) workloads, frequently encounter memory bottlenecks that limit performance, known as the ‘memory wall’. Historically, this has stemmed from the advances in processor performance (e.g. CPUs, GPUs, and other AI accelerators) outpacing developments in memory performance. This poses significant challenges

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Passenger Car ADAS Market 2025-2045: Technology, Market Analysis, and Forecasts

Algorithms, Automotive, Market Analysis, Memory, Processors, Sensors and Cameras, Software, Tools /

For more information, visit https://www.idtechex.com/en/research-report/passenger-car-adas-market-2025-2045-technology-market-analysis-and-forecasts/1080. Global L2+/L3 feature adoption will exceed 50% by 2035. Over the past few years, Advanced Driver Assistance Systems (ADAS) have become a core competitive factor in the passenger vehicles market. In particular, “Level 2+” has emerged as a term describing advanced Level 2 ADAS with more sophisticated capabilities, such as

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The Rise of Chiplets and Simplified Interconnectivity

Market Analysis, Memory, Processors /

Smaller and more compact designs with simplified structures can be achieved with chiplet technology. IDTechEx‘s report, “Chiplet Technology 2025-2035: Technology, Opportunities, Applications“, unpacks the benefits and challenges of developing chiplet technology compared with competing semiconductor designs and their best-suited applications. Chiplet characteristics Chiplets allow for GPU, CPU, and IO components to become miniaturized to suit

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$1 Trillion by 2030: The Semiconductor Devices Industry is On Track

Market Analysis, Memory, Processors, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Entering a new growth cycle, the surge in the semiconductor industry is driven by the rise of generative AI processors and HBM[1] OUTLINE Market evolution: with a $672 billion market in 2024[2],

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Advanced Packaging: How AI is Revolutionizing the Game

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The growth of the AI server market is driving the adoption of 2.5D/3D packaging technologies. 2.5D & 3D interconnect types for the high-end performance packaging market: Revenue is expected to grow with

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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