Memory

“Enabling Ego Vision Applications on Smart Eyewear Devices,” a Presentation from EssilorLuxottica

Algorithms, Edge AI and Vision Alliance, Memory, Multimodal, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Francesca Palermo, Research Principal Investigator at EssilorLuxottica, presents the “Enabling Ego Vision Applications on Smart Eyewear Devices” tutorial at the May 2025 Embedded Vision Summit. Ego vision technology is revolutionizing the capabilities of smart eyewear, enabling applications that understand user actions, estimate human pose and provide spatial awareness through simultaneous… “Enabling Ego Vision Applications on […]

“Enabling Ego Vision Applications on Smart Eyewear Devices,” a Presentation from EssilorLuxottica Read More +

“Deep Sentinel: Lessons Learned Building, Operating and Scaling an Edge AI Computer Vision Company,” a Presentation from Deep Sentinel

Algorithms, Edge AI and Vision Alliance, Memory, Object Identification, Object Tracking, Processors, Security, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

David Selinger, CEO of Deep Sentinel, presents the “Deep Sentinel: Lessons Learned Building, Operating and Scaling an Edge AI Computer Vision Company” tutorial at the May 2025 Embedded Vision Summit. Deep Sentinel’s edge AI security cameras stop some 45,000 crimes per year. Unlike most security camera systems, they don’t just… “Deep Sentinel: Lessons Learned Building,

“Deep Sentinel: Lessons Learned Building, Operating and Scaling an Edge AI Computer Vision Company,” a Presentation from Deep Sentinel Read More +

Advanced Packaging Market Set to Reach $79.4 Billion by 2030

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases its annual report, Status of the Advanced Packaging Industry 2025, featuring exclusive market ranking and in-depth analysis of leading players. KEY TAKEAWAYS: Advanced packaging market reached $46 billion in

Advanced Packaging Market Set to Reach $79.4 Billion by 2030 Read More +

“Vision-based Aircraft Functions for Autonomous Flight Systems,” a Presentation from Acubed (an Airbus Innovation Center)

Aerospace and Defense, Algorithms, Edge AI and Vision Alliance, Memory, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Arne Stoschek, Vice President of AI and Autonomy at Acubed (an Airbus innovation center), presents the “Vision-based Aircraft Functions for Autonomous Flight Systems” tutorial at the May 2025 Embedded Vision Summit. At Acubed, an Airbus innovation center, the mission is to accelerate AI and autonomy in aerospace. Stoschek gives an… “Vision-based Aircraft Functions for Autonomous

“Vision-based Aircraft Functions for Autonomous Flight Systems,” a Presentation from Acubed (an Airbus Innovation Center) Read More +

“Edge AI and Vision at Scale: What’s Real, What’s Next, What’s Missing?,” An Embedded Vision Summit Expert Panel Discussion

Algorithms, Edge AI and Vision Alliance, Memory, Multimodal, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Sally Ward-Foxton, Senior Reporter at EE Times, moderates the “Edge AI and Vision at Scale: What’s Real, What’s Next, What’s Missing?” Expert Panel at the May 2025 Embedded Vision Summit. Other panelists include Chen Wu, Director and Head of Perception at Waymo, Vikas Bhardwaj, Director of AI in the Reality… “Edge AI and Vision at

“Edge AI and Vision at Scale: What’s Real, What’s Next, What’s Missing?,” An Embedded Vision Summit Expert Panel Discussion Read More +

“A View From the 2025 Embedded Vision Summit (Part 2),” a Presentation from the Edge AI and Vision Alliance

Algorithms, Edge AI and Vision Alliance, Memory, Multimodal, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Jeff Bier, Founder of the Edge AI and Vision Alliance, welcomes attendees to the May 2025 Embedded Vision Summit on May 22, 2025. Bier provides an overview of the edge AI and vision market opportunities, challenges, solutions and trends. He also introduces the Edge AI and Vision Alliance and the… “A View From the 2025

“A View From the 2025 Embedded Vision Summit (Part 2),” a Presentation from the Edge AI and Vision Alliance Read More +

“A View From the 2025 Embedded Vision Summit (Part 1),” a Presentation from the Edge AI and Vision Alliance

Algorithms, Edge AI and Vision Alliance, Memory, Multimodal, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Jeff Bier, Founder of the Edge AI and Vision Alliance, welcomes attendees to the May 2025 Embedded Vision Summit on May 21, 2025. Bier provides an overview of the edge AI and vision market opportunities, challenges, solutions and trends. He also introduces the Edge AI and Vision Alliance and the… “A View From the 2025

“A View From the 2025 Embedded Vision Summit (Part 1),” a Presentation from the Edge AI and Vision Alliance Read More +

“The Future of Visual AI: Efficient Multimodal Intelligence,” a Keynote Presentation from Trevor Darrell

Algorithms, Edge AI and Vision Alliance, Memory, Multimodal, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Trevor Darrell, Professor at the University of California, Berkeley, presents the “Future of Visual AI: Efficient Multimodal Intelligence” tutorial at the May 2025 Embedded Vision Summit. AI is on the cusp of a revolution, driven by the convergence of several breakthroughs. One of the most significant of these advances is… “The Future of Visual AI:

“The Future of Visual AI: Efficient Multimodal Intelligence,” a Keynote Presentation from Trevor Darrell Read More +

Infineon Technologies, NXP, and STMicroelectronics Face Rising Competition in $132 Billion Automotive Semiconductor Race

Automotive, Infineon, Market Analysis, Memory, NXP Semiconductors, Processors, Sensors and Cameras, STMicroelectronics, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group’s Automotive Semiconductor Trends 2025 report maps the competitive shifts in semiconductors reshaping the future of automotive electronics. KEY TAKEAWAYS Top five players hold roughly 50% of the automotive semiconductor market,

Infineon Technologies, NXP, and STMicroelectronics Face Rising Competition in $132 Billion Automotive Semiconductor Race Read More +

Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases the first edition of its Status of the Back-End Equipment Industry Report, offering a strategic outlook on the semiconductor market. KEY TAKEAWAYS 2025-2030 period: The global back-end equipment market

Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030 Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Pages

Topics

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top