Memory

When DRAM Becomes the Bottleneck (Again): What the 2026 Memory Squeeze Means for Edge AI

A funny thing is happening in the edge AI world: some of the most important product decisions you’ll make this year won’t be about TOPS, sensor resolution, or which transformer variant to deploy. They’ll be about memory—how much you can get, how much it costs, and whether you can ship the exact part you designed […]

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MemryX Unveils MX4 Roadmap: Enabling Distributed, Asynchronous Dataflow for Highly Efficient Data Center AI

ANN ARBOR, Mich., Dec. 26, 2025 (PRNewswire) — MemryX Inc., a company delivering production AI inference acceleration, today announced its strategic roadmap for the MX4. The next-generation accelerator is engineered to scale the company’s “at-memory” dataflow architecture from edge deployments into the data center, leveraging 3D hybrid-bonded memory to eliminate the industry’s most pressing bottleneck: the “memory wall.” MemryX is

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AMD Spartan UltraScale+ FPGA Kit Adds Proven Infineon HyperRAM Support for Edge AI Designs

Somewhat eclipsed by last week’s announcement that the AMD Spartan™ UltraScale+™ FPGA SCU35 Evaluation Kit is now available, AMD and Infineon have disclosed successful validation of Infineon’s 64-Mb HYPERRAM™ memory and HYPERRAM controller IP on the platform. This collaboration expands the kit’s value for engineers building edge AI and computer vision systems. The SCU35 kit,

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Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability

Architected to power AI workloads, Micron’s latest automotive solution, built with G9 NAND, equips the industry to create safer, smarter more connected driver experiences MUNICH, Nov. 13, 2025 (GLOBE NEWSWIRE) — Automotive Computing Conference — Micron Technology, Inc. (Nasdaq: MU), today announced shipping of qualification samples of its automotive universal flash storage (UFS) 4.1 solution to

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Trends in Embedded AI: Designing Hardware for Machine Learning on the Edge

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The world is increasingly becoming connected, intelligent, and autonomous. At the core of this transformation is Artificial Intelligence (AI), which is swiftly transitioning from the cloud to the edge, nearer to where data is generated and actions are

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AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its new report, Automotive Computing and AI 2025, Yole Group analyzes the technological and market forces redefining vehicle intelligence, safety, and connectivity. The automotive industry is accelerating into a new era

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“Three Big Topics in Autonomous Driving and ADAS,” an Interview with Valeo

Frank Moesle, Software Department Manager at Valeo, talks with Independent Journalist Junko Yoshida for the “Three Big Topics in Autonomous Driving and ADAS” interview at the May 2025 Embedded Vision Summit. In this on-stage interview, Moesle and Yoshida focus on trends and challenges in automotive technology, autonomous driving and ADAS.… “Three Big Topics in Autonomous

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“Toward Hardware-agnostic ADAS Implementations for Software-defined Vehicles,” a Presentation from Valeo

Frank Moesle, Software Department Manager at Valeo, presents the “Toward Hardware-agnostic ADAS Implementations for Software-defined Vehicles” tutorial at the May 2025 Embedded Vision Summit. ADAS (advanced-driver assistance systems) software has historically been tightly bound to the underlying system-on-chip (SoC). This software, especially for visual perception, has been extensively optimized for… “Toward Hardware-agnostic ADAS Implementations for

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The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier

A Tale of Two Cultures It is the best of times and the worst of times. The quest for fully autonomous vehicles (AVs) is increasingly a problem of hardware—but at a systems level, it’s a multi-faceted engineering challenge. The AD (Automated Driving) Europe 2025 conference in Berlin tackled this issue head-on this week. Far from

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Upcoming Seminar Explores the Latest Innovations in Mobile Robotics

On October 22, 2022 at 9:00 am PT, Alliance Member company NXP Semiconductors, along with Avnet, will deliver a free (advance registration required) half-day in-person robotics seminar at NXP’s office in San Jose, California. From the event page: Join us for a free in-depth seminar exploring the latest innovations in mobile robotics with a focus

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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