TECHNOLOGIES

Qualcomm and Mistral AI Partner to Bring New Generative AI Models to Edge Devices

Highlights: Qualcomm announces collaboration with Mistral AI to bring Mistral AI’s models to devices powered by Snapdragon and Qualcomm platforms. Mistral AI’s new state-of-the-art models, Ministral 3B and Ministral 8B, are being optimized to run on devices powered by the new Snapdragon 8 Elite Mobile Platform, Snapdragon Cockpit Elite and Snapdragon Ride Elite, and Snapdragon […]

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Why Qualcomm AI Orchestrator is the Key to Next Generation AI Experiences

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. The software will help facilitate your personal preferences, apps and gen AI models to work together and provide revolutionary on-device AI capabilities In the rapidly evolving landscape of generative artificial intelligence (AI) and how we interact with

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“Multi-object Tracking Systems,” a Presentation from Tryolabs

Javier Berneche, Senior Machine Learning Engineer at Tryolabs, presents the “Multiple Object Tracking Systems” tutorial at the May 2024 Embedded Vision Summit. Object tracking is an essential capability in many computer vision systems, including applications in fields such as traffic control, self-driving vehicles, sports and more. In this talk, Berneche walks through the construction of

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e-con Systems Launches 4K RGB-IR USB Camera Powered by Proprietary RGB-IR Separation Tech for Diverse Embedded Vision Applications

Stunning Visuals with Reliable Precision. Exceptional Performance Day and Night California & Chennai (October 15, 2024): e-con Systems®, a global leader in embedded vision solutions, is elated to announce the launch of its latest innovation, See3CAM_CU83 – a 4K RGB-IR superspeed USB Camera featuring onsemi’s AR0830 sensor. This RGB-IR camera offers promising performance for a

e-con Systems Launches 4K RGB-IR USB Camera Powered by Proprietary RGB-IR Separation Tech for Diverse Embedded Vision Applications Read More +

USB 2.0 vs 3.0: Choosing the Right Standard for Your Application

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. USB continues to evolve, having been a popular camera interface since the 90s. Today, USB 2.0 and USB 3.0 are ruling the roost – offering speeds to power multimedia devices and support high-capacity storage. Understand

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“Improved Navigation Assistance for the Blind via Real-time Edge AI,” a Presentation from Tesla

Aishwarya Jadhav, Software Engineer in the Autopilot AI Team at Tesla, presents the “Improved Navigation Assistance for the Blind via Real-time Edge AI,” tutorial at the May 2024 Embedded Vision Summit. In this talk, Jadhav presents recent work on AI Guide Dog, a groundbreaking research project aimed at providing navigation assistance for the blind community.

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Silicon IP Provider Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+

Seoul, South Korea, Oct 23, 2024—Chips&Media (C&M), a global leader in video codec IP and application-specific NPU IP, today announced the WAVE6 Gen2+ series, a new multi-standard video codec hardware IP based on the next-generation video codec IP platform WAVE6. The WAVE6 Gen2+ series is a newly designed IP series that leverages the comprehensive architecture

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Qualcomm Announces Multi-year Strategic Collaboration with Google to Deliver Generative AI Digital Cockpit Solutions

Highlights: Qualcomm and Google will leverage Snapdragon Digital Chassis and Google’s in-vehicle technologies to produce a standardized reference framework for development of generative AI-enabled digital cockpits and software-defined vehicles (SDV). Qualcomm to lead go-to-market efforts for scaling and customization of joint solution with the broader automotive ecosystem. Companies’ collaboration demonstrates power of co-innovation, empowering automakers

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Qualcomm Unveils Snapdragon 8 Elite with the World’s Fastest Mobile CPU

Highlights: Snapdragon 8 Elite is the first Snapdragon Mobile Platform featuring Qualcomm’s next gen custom Qualcomm Oryon™ CPU. The platform powers a new era of on-device generative AI, built to handle the complexities of multi-modal AI seamlessly while prioritizing privacy. Leading OEMs and smartphone brands including ASUS, Honor, iQOO, OnePlus, OPPO, RealMe, Samsung, Vivo, Xiaomi,

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New Strategic Collaboration between FRAMOS and NXP Semiconductors to Simplify Embedded Vision Device Development

Munich, Bavaria, Germany, 22nd October 2024 — FRAMOS, a leading global expert in vision systems, dedicated to innovation and excellence in enabling devices to see and think, is excited to announce a new strategic collaboration with NXP® Semiconductors, a world leader in secure connectivity solutions for embedded applications. NXP Semiconductors brings together bright minds to

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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