Processors

e-con Systems Launches AI-powered Vision and Compute Solutions Accelerated by NVIDIA Jetson Thor

California & Chennai (August 25, 2025): e-con Systems®, a global leader in embedded vision solutions, announces support for the newly launched NVIDIA Jetson Thor series, covering a comprehensive range of vision solutions including USB Series, RouteCAM GigE series, 10G Holoscan Camera solutions and robust ECU platform purpose-built for real‑time edge AI applications. This strategic expansion […]

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AI at the Edge: The Next Gold Rush

This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. Generative AI has ushered in a new era of technological progress, reminiscent of the rise of the internet in the 1990s. Beyond the impressive chatbots we’re now used to, the constant flow of innovation has introduced new

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“The Future of Visual AI: Efficient Multimodal Intelligence,” a Keynote Presentation from Trevor Darrell

Trevor Darrell, Professor at the University of California, Berkeley, presents the “Future of Visual AI: Efficient Multimodal Intelligence” tutorial at the May 2025 Embedded Vision Summit. AI is on the cusp of a revolution, driven by the convergence of several breakthroughs. One of the most significant of these advances is… “The Future of Visual AI:

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Akida Exploits Sparsity For Low Power in Neural Networks

This blog post was originally published at BrainChip’s website. It is reprinted here with the permission of BrainChip. In the rapidly evolving field of artificial intelligence, edge computing has become increasingly vital for deploying intelligent systems in real-world environments where power, latency, and bandwidth are limited: we need neural network models to run efficiently. For

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Infineon Technologies, NXP, and STMicroelectronics Face Rising Competition in $132 Billion Automotive Semiconductor Race

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group’s Automotive Semiconductor Trends 2025 report maps the competitive shifts in semiconductors reshaping the future of automotive electronics. KEY TAKEAWAYS Top five players hold roughly 50% of the automotive semiconductor market,

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Chips&Media Launches Cframe60: Lossless and Lossy Frame Compression Standalone Hardware IP

2025-08-21 – Chips&Media is announcing that CFrame60 will be delivered to market as an independent product; new HW core based on compression/decompression technology to contribute performance, DRAM bandwidth, and power efficiency within various multimedia applications. Key notes: Significant DRAM bandwidth reduction between IP modules within imaging application Lossless as well as lossy, with no visual quality

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Snapdragon Ride: A Foundational Platform for Automakers to Scale with the ADAS Market

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. The automotive industry is well into the transformation of vehicle architectures and consumer-driven experiences. As the demand for advanced driver assistance systems (ADAS) technologies continues to soar, Qualcomm Technologies’ cutting-edge Snapdragon Ride Platforms are setting a new standard for automotive

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Maximize Robotics Performance by Post-training NVIDIA Cosmos Reason

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. First unveiled at NVIDIA GTC 2025, NVIDIA Cosmos Reason is an open and fully customizable reasoning vision language model (VLM) for physical AI and robotics. The VLM enables robots and vision AI agents to reason using prior

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“Introduction to Shrinking Models with Quantization-aware Training and Post-training Quantization,” a Presentation from NXP Semiconductors

Robert Cimpeanu, Machine Learning Software Engineer at NXP Semiconductors, presents the “Introduction to Shrinking Models with Quantization-aware Training and Post-training Quantization” tutorial at the May 2025 Embedded Vision Summit. In this presentation, Cimpeanu explains two neural network quantization techniques, quantization-aware training (QAT) and post-training quantization (PTQ), and explain when to… “Introduction to Shrinking Models with

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Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases the first edition of its Status of the Back-End Equipment Industry Report, offering a strategic outlook on the semiconductor market. KEY TAKEAWAYS 2025-2030 period: The global back-end equipment market

Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030 Read More +

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