This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. In this blog post, we take a closer look at chunked prefill, a feature of NVIDIA TensorRT-LLM that increases GPU utilization and simplifies the deployment experience for developers. This builds on our previous post discussing how advanced […]
PolarFire® FPGA Ethernet Sensor Bridge provides low-power multi-sensor bridging to NVIDIA edge AI platforms CHANDLER, Ariz., November 14, 2024 — To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology (Nasdaq: MCHP) has released its PolarFire® FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform. PolarFire FPGAs enable multi-protocol
Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan Read More +
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Qualcomm Technologies sets new standards in AI performance for its latest mobile, automotive and Qualcomm AI Hub advancements Our annual Snapdragon Summit wrapped up with exciting new announcements centered on the future of on-device artificial intelligence (AI).
Snapdragon Summit’s AI Highlights: A Look at the Future of On-device AI Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Automotive OEMs are moving upstream in the semiconductor supply chain with diverse strategies. OUTLINE The automotive semiconductor market is expecting a significant CAGR of 11% between 2023 and 2029 to almost $100
Electrification and Autonomy: A Semiconductor Content Boost to $1,000 per Car by 2029 Read More +
As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex. Challenges include developing the right materials and innovating packaging manufacturing techniques. IDTechEx‘s “Materials and Processing
Advanced Semiconductor Packaging: Key Materials and Processing Trends Read More +
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. GPU offloading makes massive models accessible on local RTX AI PCs and workstations. Editor’s note: This post is part of the AI Decoded series, which demystifies AI by making the technology more accessible, and showcases new hardware,
How to Accelerate Larger LLMs Locally on RTX With LM Studio Read More +
This blog post was originally published at AMD’s website. It is reprinted here with the permission of AMD. In recent years, the rapid development of artificial intelligence technology, especially the progress in large language models (LLMs), has garnered significant attention and discussion. From the emergence of ChatGPT to subsequent models like GPT-4 and Llama, these
Introducing the First AMD 1B Language Models: AMD OLMo Read More +
SAN JOSE, CA – October 30, 2024 – MIPS, a leading developer of efficient and configurable IP compute cores, announced today the general availability(GA) launch of the MIPS P8700 Series RISC-V Processor. Designed to meet the low-latency, highly intensive data movement demands of the most advanced automotive applications such as ADAS and Autonomous Vehicles (AVs),
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. The Qualcomm IoT Solutions Framework represents a comprehensive suite of developer tools, reference blueprints and a robust ecosystem of partners Qualcomm Technologies, Inc. is known for its vast collection of wireless-related intellectual property and its processor and
RA8E1 and RA8E2 Deliver Unmatched Scalar and Vector Compute Performance with Best-in-Class Feature Set to Address Value-Oriented Markets TOKYO, Japan, November 5, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending the industry’s most powerful series of MCUs. Introduced in 2023, the
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